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Official data from INPI

DISPOSITIVO PARA INTERLIGAR PAINÉIS E ESBOÇO PARA FORMAR UMA EMBALAGEM TIPO ENVOLVENTE

PublicadaInvention Patent

Application data

Number

PI8800111

Type

Invention Patent

Filing

01/13/1988

Publication

08/23/1988

Progress at the INPI

  1. Filing01/13/88
  2. Publication08/23/88
  3. Examination10/02/90
  4. Allowance11/12/91
  5. Grant09/29/92
  6. Expired09/02/08

The letters patent expired on 09/02/2008: the term of protection has ended. The technology is in the public domain and may be freely used in Brazil.

Talk to a specialist

Latest action published by the INPI: 08/23/1988. We update with every new RPI gazette, published weekly.

Applicants and inventors

Applicants

T. C. (pessoa física)

US

See this company's full portfolio

Inventors

P. M. (pessoa física)

FR

Technical data

IPC Classification

Priority claims

GB

8700777 · 01/14/1987

Prosecution history

Publications in the Brazilian Industrial Property Gazette (RPI).

Publicação do pedido de patente

#3.1

08/23/1988

RPI 931

Pedido de patente depositado

#2.1

04/26/1988

RPI 914

Carta-patente expirada

#21.1

Patente extinta em 13/01/2003

09/02/2008

RPI 1965

Concessão da patente

#16.1

09/29/1992

RPI 1139

Notificação para pagamento de retribuição

#13.1

03/31/1992

RPI 1113

Deferimento

#9.1

11/12/1991

RPI 1093

Solicitação de exame técnico

#4.1

10/02/1990

RPI 1035

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