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Official data from USPTO

EVG

Did you know this trademark is already registered in United States?

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Active USPTO registrationType: CombinedOffice: US

Quick snapshot

EVG

ST13

US500000079045546

Class

7, 9, 10, 42

Filing

79045546

Registration

3612566

Risk and opportunity diagnosis

Executive reading for naming, filing, and monitoring decisions.

Attention: there is active risk

USPTO status

Active USPTO registration

Case type

Application and registration

Recorded events

54

Latest update

06/11/2020

Classification

Registered

Trademark type

Combined

Nice classes

7, 9, 10, 42

Filing date

08/13/2007

Registration date

04/28/2009

Expiration date

-

Recommended action

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Next step

These are the details of the registration process. Even so, constant monitoring is what ensures peace of mind that your main asset remains protected.

Complete case details

Structured fields from the responsible authority and the official record.

Status date

04/18/2019

Last transaction

04/18/2019

Responsible office

United States Patent and Trademark Office

Status code

706

Official register

Principal Register

Drawing code

3

Owner type

16

Owner location

St. Florian am Inn, AT

Examiner

FRENCH, CURTIS W

Law office

M60

Current location

GENERIC WEB UPDATE

Mark description

The mark consists of the color dark grey appearing in the wording "EVG" and in the design in the middle of the ellipse. The color yellow fills in the ellipse around the design element.

Holders and representatives

Holders

EV GROUP E. THALLNER GmbH
EV GROUP E. THALLNER GmbH

Representatives

Patricia A. Walker Walker & Jocke Co., LPA

Technical classification

Nice Classes

Class 7Class 9Class 10Class 42

Vienna Codes

No Vienna codes available.

Goods and services

Class 7

Machines and structural parts thereforefor the productiontreatmenttransport and processing of electronic componentssemiconductorsin the field of microelectronicmedical technologybiotechnologysemiconductor technology and microsystems technology; machines and structural parts thereforfor the productiontreatment and processing of semiconductors; machines and structural parts therefore for treatment of surfaces of electronic componentsespecially wafers

Class 9

Scientific apparatus and instruments for microelectronicsbiotechnologymicrosystem techniquessemiconductor and nanotechnologyexposure systems for 1X lithography applicationsmask aligners and contact and proximity printers and devices for joining one or multiple substrates temporarily or permanentlysubstrate bonding systems comprised of UV-radiation/UV-light source devicesheaterspneumatic and hydraulic piston setups and spindles; systems for the application of coatings to work piecesresist coatersdeveloper systems for developing lithographically structured layersresist developersimprinting systems used to imprint pattern onto surfaces on work piecesimprint lithography systems comprised of one or more of the following componentsalignment stages for substrate to stamp alignment suitable for a single step or step and repeat alignmentmeans to apply imprinting forcemeans to cure the imprint resist such as a UV- light source and heatersmeasurement apparatus that can detect the relative position of the stamp versus the substrate and provide the input for the alignment procedure; lamination equipment used to coat surfaces with tape like materials; surveying instruments; electricphotographicopticalmeasuringsignalmonitoring devicesprecision systems in the semiconductor technologyin microelectronicsin medical equipment techniquesbiotechnologymicrosystem techniquesnanotechnologyfront to backside alignment accuracy measurement systems comprised of one or more of the following: measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrateas well as computer hardware that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; infrared microscopesmetrology systems comprised of one or more of the followinginfrared light source devices for infrared inspection of the bonding interfaceinfrared detectors to detect the infrared light passing through the bond interfaceultrasonic transducers and detectorsx-ray transducers and detectorsvisible light light-sources and camerasmicroscope setupscomputer hardware and operating software for data analysis for the inspection of wafer bonding interfaces; overlay accuracy measurement systems comprised of optical detection devicesmicroscopes and lasers to detect the positions of two patterns in reference to each othercomputer hardware for data analysis and collectionas well as mapping; critical dimension metrology systems comprised of optical detection devicesmicroscopes and lasers to detect the two or more features of a specific pattern on the wafer and allow for calculation of the distance between themas well as a computer hardware for data analysiscollection and mapping; pressure uniformity metrology apparatus; apparatus for analysisfront to backside alignment accuracy measurement system comprised of one or more of the following: measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrateas well as computer hardware and software that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; semiconductor chipsintegrated circuits; computer operation programs; peripheral equipment for computers; data processing unitsdata processors and computer hardware; computer software related to the analysis of lithography resultssoftware for the analysis of wafer bonding resultsaligning software; scientific diagnosis devices in bio-chip formatoligonucleotide-arraysminiaturized immunologic test-arrayssubstance librariescombinatorial substance libraries on chip surfaces for scientific purposes; remote controls for electric systems for remote controlled industrial operational processeslaboratory robots; electric control panels for manufacturing facilities for microelectronicsmedical equipment techniquesbiotechnologymicrosystem techniquesnanotechnology; filters and masks for photographic and photolithographic equipment; telescopes; telephones; semiconductors; monitoring devicesoscillographsindicatorssurveying instruments; data processing coupler; special furniture for laboratories; laser for non-medical purposes; reading devices for processing electronic data; measuring instruments and measuring deviceslaser measuring devices; material testing instruments and machinesmachines for testing bonding strength in bonded substratesfront to backside alignment accuracy measurement systems comprised of one or more of the following: measurement apparatus that detect a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrateas well as computer hardware and related software that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; infrared microscopesmetrology systems comprised of one or more of the following; infrared light source devices for infrared inspection of the bonding interfaceinfrared detectors to detect the infrared light passing through the bond interfaceultrasonic transducers and detectorsx-ray transducers and detectorsvisible light light-sources and camerasmicroscope setupscomputer hardware and related software for data analysis for the inspection of wafer bonding interfaces; optical apparatus and instrumentsmicroscopes; photographic apparatus and instrumentscameras; video projectors; controlled volume pumps; protective clothingin particular for clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; photographic range finders

Class 10

Medical diagnosis devices in bio-chip formatoligonucleotide-arraysminiaturized immunologic test-arrayssubstance libraries for medical purposescombinatorial substance libraries on chip surfaces for medical purposes ; medical diagnostic devicesmicro-titer plates and nano-titer plates; analyzers for medical purposesmachines used to carry out automatic testing of biological samples; bio-array chips for being used as diagnosis means for bio-chemical applicationsfor tissue and secretory testsas well as for indication of physiologic parameters or of genetic informationfor screening in the pharmaceutical industry for developing drugsfor process monitoring with biotechnological processes; miniaturized sensors for use in gene analysis and diagnosis; medical devicesaccessories for bio-chips for filling and manipulating the same by machine as well as manuallychip-holderschip reader devicesas well as electronicfluidalmechanic control therefor

Class 42

Engineering services; development of precision systems and devices for the semiconductor technology; development of devices for microsystem techniquesmicroelectronicsmedical techniquesbiotechnology and telecommunication for others; consulting in the fields of medical and scientific equipment; research services in the field of microsystem technology and nanotechnology; research services in the field of bio-sensorics and chemical sensorics; technical consulting for third parties concerning handling production plants and process equipment; providing temporary use of non-downloadable software for data processing; designing of computer software for others

Publications

History of USPTO decisions and trademark events.

54 publications found

NREP

NEW REPRESENTATIVE AT IB RECEIVED

06/11/2020

INNP

PARTIAL INVALIDATION PROCESSED BY THE IB

02/28/2020

INPS

PARTIAL INVALIDATION OF REG EXT PROTECTION SENT TO IB

01/16/2020

INPC

INVALIDATION PROCESSED

01/16/2020

INPR

PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED

12/18/2019

NA71

NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED

04/18/2019

71AG

REGISTERED-SEC.71 ACCEPTED

04/18/2019

APRE

CASE ASSIGNED TO POST REGISTRATION PARALEGAL

04/16/2019

71AF

REGISTERED-SEC.71 FILED

03/28/2019

REM4

COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED

04/28/2018

RNWL

INTERNATIONAL REGISTRATION RENEWED

08/31/2017

NA75

NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED

05/16/2014

C75A

REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK.

05/16/2014

APRE

CASE ASSIGNED TO POST REGISTRATION PARALEGAL

05/16/2014

715F

REGISTERED - SEC. 71 & SEC. 15 FILED

04/29/2014

ES75

TEAS SECTION 71 & 15 RECEIVED

04/29/2014

FINO

FINAL DECISION TRANSACTION PROCESSED BY IB

01/12/2013

FICS

FINAL DISPOSITION NOTICE SENT TO IB

08/07/2009

FIMP

FINAL DISPOSITION PROCESSED

08/07/2009

FICR

FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB

07/28/2009

ADCH

CHANGE OF NAME/ADDRESS REC'D FROM IB

06/11/2009

OPNX

NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB

05/07/2009

R.PR

REGISTERED-PRINCIPAL REGISTER

04/28/2009

OPNS

NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB

04/23/2009

OPNR

NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB

04/23/2009

PUBO

PUBLISHED FOR OPPOSITION

02/10/2009

NPUB

NOTICE OF PUBLICATION

01/21/2009

PREV

LAW OFFICE PUBLICATION REVIEW COMPLETED

01/06/2009

CNSA

APPROVED FOR PUB - PRINCIPAL REGISTER

01/05/2009

TEME

TEAS/EMAIL CORRESPONDENCE ENTERED

12/16/2008

CRFA

CORRESPONDENCE RECEIVED IN LAW OFFICE

12/15/2008

TROA

TEAS RESPONSE TO OFFICE ACTION RECEIVED

12/15/2008

GNRN

NOTIFICATION OF NON-FINAL ACTION E-MAILED

07/30/2008

GNRT

NON-FINAL ACTION E-MAILED

07/30/2008

CNRT

NON-FINAL ACTION WRITTEN

07/30/2008

TEME

TEAS/EMAIL CORRESPONDENCE ENTERED

06/26/2008

ALIE

ASSIGNED TO LIE

06/26/2008

CRFA

CORRESPONDENCE RECEIVED IN LAW OFFICE

06/25/2008

TROA

TEAS RESPONSE TO OFFICE ACTION RECEIVED

06/25/2008

GNRN

NOTIFICATION OF NON-FINAL ACTION E-MAILED

04/29/2008

GNRT

NON-FINAL ACTION E-MAILED

04/29/2008

CNRT

NON-FINAL ACTION WRITTEN

04/29/2008

TEME

TEAS/EMAIL CORRESPONDENCE ENTERED

03/29/2008

TCCA

TEAS CHANGE OF CORRESPONDENCE RECEIVED

03/28/2008

CRFA

CORRESPONDENCE RECEIVED IN LAW OFFICE

03/28/2008

TROA

TEAS RESPONSE TO OFFICE ACTION RECEIVED

03/28/2008

RFNT

REFUSAL PROCESSED BY IB

12/21/2007

RFCS

NON-FINAL ACTION MAILED - REFUSAL SENT TO IB

12/04/2007

RFRR

REFUSAL PROCESSED BY MPU

12/04/2007

RFCR

NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW

12/04/2007

CNRT

NON-FINAL ACTION WRITTEN

12/03/2007

DOCK

ASSIGNED TO EXAMINER

11/26/2007

NWAP

NEW APPLICATION ENTERED

11/26/2007

REPR

SN ASSIGNED FOR SECT 66A APPL FROM IB

11/22/2007

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