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Official data from USPTO

JUSUNG

Did you know this trademark is already registered in United States?

Before investing in name, identity, and promotion, validate collision risk and registration strategy to avoid wasting time and budget.

Active USPTO registrationType: CombinedOffice: US

Quick snapshot

JUSUNG

ST13

US500000077594285

Class

7, 37

Filing

77594285

Registration

3697916

Risk and opportunity diagnosis

Executive reading for naming, filing, and monitoring decisions.

Attention: there is active risk

USPTO status

Active USPTO registration

Case type

Application and registration

Recorded events

38

Latest update

12/21/2020

Classification

Registered

Trademark type

Combined

Nice classes

7, 37

Filing date

10/16/2008

Registration date

10/20/2009

Expiration date

-

Recommended action

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Next step

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Complete case details

Structured fields from the responsible authority and the official record.

Status date

12/21/2020

Last transaction

12/21/2020

Responsible office

United States Patent and Trademark Office

Status code

800

Official register

Principal Register

Drawing code

5

Owner type

03

Owner location

Gyeonggi-do, KR

Examiner

HACK, ANDREA R

Law office

L80

Current location

GENERIC WEB UPDATE

Mark description

The mark consists of the word "JUSUNG".

Holders and representatives

Holders

JUSUNG engineering Co. Ltd.

Representatives

Rebecca A. Liebowitz VENABLE LLP

Technical classification

Nice Classes

Class 7Class 37

Vienna Codes

No Vienna codes available.

Goods and services

Class 7

Semiconductor processing machines; Semiconductor wafer processing machines; Atomic layer deposition (ALD) machines; Chemical vapor deposition (CVD) machines; Ultra high vacuum chemical vapor deposition (CVD) machines; Low pressure chemical vapor deposition (CVD) machines; Metal organic chemical vapor deposition (CVD) machines; Rapid thermal chemical vapor deposition (CVD) machines; High temperature chemical vapor deposition (CVD) machines; Atmospheric pressure chemical vapor deposition (CVD) machines; Middle pressure chemical vapor deposition (CVD) machines; Diffusion machines used for semiconductor manufacturing; Plasma enhanced chemical vapor deposition (PECVD) machines; Plasma chemical vapor deposition (PCVD) machines; Vapor epitaxial growth machines used for semiconductor manufacturing; Liquid epitaxial growth machines used for semiconductor manufacturing; Oxidation machines used for semiconductor manufacturing; Anealing machines used for semiconductor manufacturing; Deposition machines used for semiconductor manufacturing; Etching machines used for semiconductor manufacturing; Sputtering machines used for semiconductor manufacturing; Photolithography machines used for semiconductor manufacturing; Developing machines used for semiconductor manufacturing; Ashing machines used for semiconductor manufacturing; Cleaning machines used for semiconductor manufacturing; Polishing machines used for semiconductor manufacturing; Deposition machines used for liquid crystal display (LCD) manufacturing; Etching machines used for liquid crystal display (LCD) manufacturing; Sputtering machines used for liquid crystal display (LCD) manufacturing; Photolithography machines used for liquid crystal display (LCD) manufacturing; Developing machines used for liquid crystal display (LCD) manufacturing; Ashing machines used for liquid crystal display(LCD) manufacturing; Cleaning machines used for liquid crystal display (LCD) manufacturing; Polishing machines used for liquid crystal display (LCD) manufacturing; Deposition machines used for solar cells manufacturing; Etching machines used for solar cells manufacturing ; Sputtering machines used for solar cells manufacturing; Photolithography machines used for solar cells manufacturing; Developing machines used for solar cells manufacturing; Ashing machines used for solar cells manufacturing; Cleaning machines used for solar cells manufacturing; Polishing machines used for solar cells manufacturing

Class 37

Installationmaintenance and repair of semiconductor processing machines and systems; Installationmaintenance and repair of semiconductor wafer processing machines; Installationmaintenance and repair of atomic layer deposition (ALD) machines; Installationmaintenance and repair of chemical Vapor Deposition (CVD) machines; Installationmaintenance and repair of ultra high vacuum chemical vapor deposition (CVD) machines; Installationmaintenance and repair of low pressure chemical vapor deposition (CVD) machines; Installationmaintenance and repair of metal organic chemical vapor deposition (CVD) machines; Installationmaintenance and repair of rapid thermal chemical vapor deposition (CVD) machines; Installationmaintenance and repair of high temperature chemical vapor deposition (CVD) machines; Installationmaintenance and repair of atmospheric pressure chemical vapor deposition (CVD) machines; Installationmaintenance and repair of middle pressure chemical vapor deposition (CVD) machines; Installationmaintenance and repair of diffusion machines used for semiconductor manufacturing; Installationmaintenance and repair of plasma enhanced chemical vapor deposition (PECVD) machines; Installationmaintenance and repair of plasma chemical vapor deposition (PCVD) machines; Installationmaintenance and repair of vapor epitaxial growth machines used for semiconductor manufacturing; Installationmaintenance and repair of liquid epitaxial growth machines used for semiconductor manufacturing; Installationmaintenance and repair of oxidation machines used for semiconductor manufacturing; Installationmaintenance and repair of Anealing machines used for semiconductor manufacturing; Installationmaintenance and repair of deposition machines used for semiconductor manufacturing; Installationmaintenance and repair of etching machines used for semiconductor manufacturing; Installationmaintenance and repair of sputtering machines used for semiconductor manufacturing; Installationmaintenance and repair of photolithography machines used for semiconductor manufacturing; Installationmaintenance and repair of developing machines used for semiconductor manufacturing; Installationmaintenance and repair of ashing machines used for semiconductor manufacturing; Installationmaintenance and repair of cleaning machines used for semiconductor manufacturing; Installationmaintenance and repair of polishing machines used for semiconductor manufacturing; Installationmaintenance and repair of deposition machines used for liquid crystal display (LCD) manufacturing; Installationmaintenance and repair of etching machines used for liquid crystal display (LCD) manufacturing; Installationmaintenance and repair of sputtering machines used for liquid crystal display (LCD) manufacturing; Installationmaintenance and repair of photolithography machines used for liquid crystal display (LCD) manufacturing; Installationmaintenance and repair of developing machines used for liquid crystal display (LCD) manufacturing; Installationmaintenance and repair of ashing machines used for liquid crystal display (LCD) manufacturing; Installationmaintenance and repair of cleaning machines used for liquid crystal display (LCD) manufacturing; Installationmaintenance and repair of polishing machines used for liquid crystal display (LCD) manufacturing; Installationmaintenance and repair of deposition machines used for solar cells manufacturing; Installationmaintenance and repair of etching machines used for solar cells manufacturing ; Installationmaintenance and repair of sputtering machines used for solar cells manufacturing; Installationmaintenance and repair of photolithography machines used for solar cells manufacturing; Installationmaintenance and repair of developing machines used for solar cells manufacturing; Installationmaintenance and repair of ashing machines used for solar cells manufacturing; Installationmaintenance and repair of cleaning machines used for solar cells manufacturing; Installationmaintenance and repair of polishing machines used for solar cells manufacturing

Publications

History of USPTO decisions and trademark events.

38 publications found

NA89

NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED

12/21/2020

APRE

CASE ASSIGNED TO POST REGISTRATION PARALEGAL

12/21/2020

RNL1

REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)

12/21/2020

89AG

REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED

12/21/2020

CHAN

APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED

07/09/2020

TCCA

TEAS CHANGE OF CORRESPONDENCE RECEIVED

07/09/2020

ECDR

TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS

07/09/2020

ARAA

ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED

07/09/2020

REAP

TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED

07/09/2020

COAR

TEAS CHANGE OF OWNER ADDRESS RECEIVED

07/09/2020

EROP

TEAS RESPONSE TO OFFICE ACTION-POST REG RECEIVED

12/20/2019

PR89

POST REGISTRATION ACTION MAILED - SEC. 8 & 9

06/25/2019

APRE

CASE ASSIGNED TO POST REGISTRATION PARALEGAL

06/24/2019

E89R

TEAS SECTION 8 & 9 RECEIVED

06/05/2019

NAS8

NOTICE OF ACCEPTANCE OF SEC. 8 - MAILED

11/02/2015

8.OK

REGISTERED - SEC. 8 (6-YR) ACCEPTED

11/02/2015

APRE

CASE ASSIGNED TO POST REGISTRATION PARALEGAL

11/02/2015

8.AF

REGISTERED - SEC. 8 (6-YR) FILED

10/19/2015

MAIL

PAPER RECEIVED

10/19/2015

CHAN

APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED

01/24/2010

COAR

TEAS CHANGE OF OWNER ADDRESS RECEIVED

01/24/2010

R.PR

REGISTERED-PRINCIPAL REGISTER

10/20/2009

PUBO

PUBLISHED FOR OPPOSITION

08/04/2009

NPUB

NOTICE OF PUBLICATION

07/15/2009

PREV

LAW OFFICE PUBLICATION REVIEW COMPLETED

07/01/2009

CNSA

APPROVED FOR PUB - PRINCIPAL REGISTER

06/24/2009

CNFR

FINAL REFUSAL MAILED

06/12/2009

CNFR

FINAL REFUSAL WRITTEN

06/11/2009

TEME

TEAS/EMAIL CORRESPONDENCE ENTERED

05/22/2009

CRFA

CORRESPONDENCE RECEIVED IN LAW OFFICE

05/22/2009

TROA

TEAS RESPONSE TO OFFICE ACTION RECEIVED

05/21/2009

CNRT

NON-FINAL ACTION MAILED

01/21/2009

CNRT

NON-FINAL ACTION WRITTEN

01/16/2009

DOCK

ASSIGNED TO EXAMINER

01/16/2009

AMPX

PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED

11/18/2008

ALIE

ASSIGNED TO LIE

11/18/2008

MAIL

PAPER RECEIVED

11/05/2008

NWAP

NEW APPLICATION ENTERED

10/20/2008

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