Official data from INPI

COMPOSIÇÃO DE MOLDAGEM.

Em AnáliseInvention Patent

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Application data

Number

PI8701094

Type

Invention Patent

Filing

03/10/1987

Publication

12/29/1987

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Progress at the INPI

Filing03/10/87
Publication12/29/87
Abandoned08/21/90
Allowance
Grant
In force

The application was abandoned: the INPI technical office action was not answered in time (art. 36 of the Brazilian IP Act). The technology is in the public domain in Brazil.

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Latest action published by the INPI: 12/13/1988. We update with every new RPI gazette, published weekly.

Applicants and inventors

Applicants

Celanese Engineering Resins, Inc

H. C. (pessoa física)

Inventors

G. B. (pessoa física)

M. G. (pessoa física)

Technical data

IPC Classification

C08L 67/02 C08L 67/06

Priority claims

837.998 · 03/10/1986

Prosecution history

Publications in the Brazilian Industrial Property Gazette (RPI).

14.1

12/13/1988

RPI 947

Publicação do pedido de patente

#3.1

12/29/1987

RPI 897

Pedido de patente depositado

#2.1

06/23/1987

RPI 870

Arquivamento - Art. 36 §1° da LPI

#11.2

09/14/1993

RPI 1189

Exigência - art. 36 da LPI

#6.1

03/02/1993

RPI 1161

Solicitação de exame técnico

#4.1

08/21/1990

RPI 1029

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COMPOSIÇÃO DE MODELAGEM DE POLIESTER E ARTIGO MOLDADO.COMPOSIÇÃO DE MOLDAGEM DE POLIÉSTER.

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