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Official data from INPI

MICROCÁPSULAS, COMPOSIÇÃO DE RESINA, MATERIAL DE REVESTIMENTO E ADESIVO REPELENTE DE ROEDORES

Em AnáliseInvention Patent

Application data

Number

PI8606050

Type

Invention Patent

Filing

12/09/1986

Publication

09/15/1987

Progress at the INPI

  1. Filing12/09/86
  2. Publication09/15/87
  3. Abandoned06/14/88
  4. Allowance
  5. Grant
  6. In force

The application was abandoned: the INPI technical office action was not answered in time (art. 36 of the Brazilian IP Act). The technology is in the public domain in Brazil.

Talk to a specialist

Latest action published by the INPI: 06/14/1988. We update with every new RPI gazette, published weekly.

Applicants and inventors

Applicants

Tanabe Seiyaku Co., Ltd.

JP

Toppan Moore Co., Ltd.

JP

See this company's full portfolio

Inventors

H. F. (pessoa física)

JP

M. M. (pessoa física)

JP

O. U. (pessoa física)

JP

T. K. (pessoa física)

JP

Y. F. (pessoa física)

JP

Technical data

IPC Classification

Priority claims

JP

276276/1985 · 12/03/1985

JP

276277/1985 · 12/09/1985

JP

277622/1985 · 12/09/1985

Prosecution history

Publications in the Brazilian Industrial Property Gazette (RPI).

Solicitação de exame técnico

#4.1

06/14/1988

RPI 921

Publicação do pedido de patente

#3.1

09/15/1987

RPI 882

Pedido de patente depositado

#2.1

04/22/1987

RPI 861

Arquivamento - Art. 36 §1° da LPI

#11.2

11/28/1995

RPI 1304

Exigência - art. 36 da LPI

#6.1

02/21/1995

RPI 1264

Exigência - art. 36 da LPI

#6.1

09/27/1994

RPI 1243

Exigência - art. 36 da LPI

#6.1

02/22/1994

RPI 1212

Exigência - art. 36 da LPI

#6.1

02/16/1993

RPI 1159

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