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Official data from INPI

MÉTODO DE LIGAÇÃO TÉRMICA DE ENCHIMENTO

Concessão AnuladaInvention PatentPCT · US2015045888

Application data

Number

112017001979

Type

Invention Patent

Filing

08/19/2015

Publication

11/21/2017

PCT

US2015045888

Progress at the INPI

  1. Filing08/19/15
  2. Publication11/21/17
  3. Examination
  4. Allowance06/08/21
  5. Grant08/31/21
  6. In force08/19/35

The patent was granted on 08/31/2021 and is in force until 08/19/2035. Until then, no one may make, use or sell the invention in Brazil without the owner's authorisation.

Protection valid until:08/19/2035

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Latest action published by the INPI: 08/22/2023. We update with every new RPI gazette, published weekly.

Applicants and inventors

Applicants

EVAPCO, INC.

US

See this company's full portfolio

Inventors

D. V. (pessoa física)

US

J. K. (pessoa física)

US

Technical data

IPC Classification

Priority claims

US

14/830,301 · 08/19/2015

US

62/039,110 · 08/19/2014

Abstract

Trata-se de um método e um aparelho de ligação térmica para ligar termicamente chapas de enchimento em um pacote de enchimento de torre de resfriamento. O aparelho cria uma junta hemisférica que se estende através de duas chapas de enchimento para fornecer uma junta substancial entre as ditas chapas.

Prosecution history

Publications in the Brazilian Industrial Property Gazette (RPI).

16.3

REFERENTE A RPI 2643 DE 31/08/2021, QUANTO AO ITEM [73] ENDEREÇO DO TITULAR.

08/22/2023

RPI 2746

Concessão da patente

#16.1

20 (vinte) anos contados a partir de 19/08/2015, observadas as condições legais

08/31/2021

RPI 2643

Deferimento

#9.1

06/08/2021

RPI 2631

Exigência preliminar

#6.21

02/18/2020

RPI 2563

Notificação de entrada na fase nacional - PCT

#1.3

11/21/2017

RPI 2446

Alteração de dados cadastrais

#1.1

02/21/2017

RPI 2407

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