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Official data from INPI

MATERIAL DE ACÚMULO DE SOLDAGEM, METAL DEPOSITADO E ELEMENTO COM METAL DEPOSITADO

ConcedidaInvention PatentPCT · JP2011005449

Application data

Number

112013007560

Type

Invention Patent

Filing

09/28/2011

Publication

08/02/2016

PCT

JP2011005449

Progress at the INPI

  1. Filing09/28/11
  2. Publication08/02/16
  3. Examination
  4. Allowance07/31/18
  5. Grant09/25/18
  6. In force09/28/31

The patent was granted on 09/25/2018 and is in force until 09/28/2031. Until then, no one may make, use or sell the invention in Brazil without the owner's authorisation.

Protection valid until:09/28/2031

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Latest action published by the INPI: 09/25/2018. We update with every new RPI gazette, published weekly.

Applicants and inventors

Applicants

Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)

JP

See this company's full portfolio

Inventors

R. K. (pessoa física)

JP

T. T. (pessoa física)

JP

Technical data

IPC Classification

Priority claims

JP

2010-222861 · 09/30/2010

Abstract

ACÃMULO DE MATERIAL DE SOLDAGEM, METAL DEPOSITADO E ELEMENTO COM METAL DEPOSITADO.Proporcionado um acúmulo de material de soldagem que contém C: 0,2 a 1,5% em massa, Si: 0,5 a 2% em massa, Mn: 0,5 a 2% em massa, Cr: 20 a 40% em massa, Mo: 2 a 6% em massa, Ni: de 0,5 a 6% em massa, V: 1 a 5% em massa e W: O,5 a 5% em massa, com o restante sendo Fe e impurezas inevitáveis.

Prosecution history

Publications in the Brazilian Industrial Property Gazette (RPI).

Concessão da patente

#16.1

09/25/2018

RPI 2490

Deferimento

#9.1

07/31/2018

RPI 2482

Exigência - art. 36 da LPI

#6.1

04/10/2018

RPI 2466

Notificação de entrada na fase nacional - PCT

#1.3

08/02/2016

RPI 2378

Alteração de dados cadastrais

#1.1

01/07/2014

RPI 2244

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