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Official data from USPTO

PCBL

Did you know this trademark is already registered in United States?

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Active USPTO registrationType: WordOffice: United States

Quick snapshot

PCBL

ST13

US500000099082749

Class

1, 7, 17, 40

Filing

99082749

Registration

8218438

Risk and opportunity diagnosis

Executive reading for naming, filing, and monitoring decisions.

USPTO status

Active USPTO registration

Case type

Application and registration

Recorded events

21

Latest update

04/21/2026

Trademark type

Word

Nice classes

1, 7, 17, 40

Filing date

03/13/2025

Registration date

04/21/2026

Expiration date

-

Complete case details

Structured fields from the responsible authority and the official record.

Status date

04/21/2026

Last transaction

04/21/2026

Responsible office

United States Patent and Trademark Office

Status code

700

Official register

Principal Register

Filing basis

Intent to use, Foreign priority

Drawing code

4

Owner type

03

Owner location

Tokyo, JP

Examiner

SWEENEY, MOLLY B

Law office

N30

Current location

FILE REPOSITORY (FRANCONIA)

Holders and representatives

Holders

L. K. (pessoa física)

Representatives

Tomoko Nakajima Future IP LLC

Technical classification

Nice Classes

Class 1Class 7Class 17Class 40

Vienna Codes

No Vienna codes available.

Goods and services

Class 1

Adhesives for use in industry; Synthetic resin adhesives for industrial purposes; Adhesives for semiconductor processing; Adhesives for filling recesses in semiconductor wafers; Adhesives for adjusting the peripheral height of semiconductor wafers; self-adhesives for use in industry; unprocessed ultraviolet-curable polymer resins; Unprocessed synthetic resin

Class 7

semiconductor manufacturing machines; electric irradiation apparatus for use in manufacture of semiconductors; apparatus for adhesion of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in the manufacture of semiconductors; peeling apparatus of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in manufacture of semiconductor; adhesion apparatus for use in manufacturing semicondoctors; Fluid resin dispensing machine for use in manufacturing semiconductors

Class 17

Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of films and sheets; Adhesive-coated plastic sheets for use in manufacture; adhesive tapes and self-adhesive tapes for use in the processing of semiconductor; adhesive tapes and self-adhesive tapes for use in the mounting of semiconductor; tapes for use in the peeling of tapes for semiconductor wafer processing; heat sensitive adhesive tapes for use in the manufacture of electronic parts; protective tapes for the rear surface of semiconductor chips

Class 40

laminating of adhesive tapes and self-adhesive tapes; peeling of adhesive tapes and self-adhesive tapes; treatment and processing of plastic films and sheets; treatment and processing of metal foil; treatment and processing of synthetic papers and other papers; molding and processing of silicones and other resins; resins coating of semiconductor or wafer; electric irradiation treatment of resins; treatment and processing of semiconductor or wafer; rental of semiconductor manufacturing machines and apparatus; Fluid resin dispensing of semiconductor or wafer

Publications

History of USPTO decisions and trademark events.

21 publications found

NRCC

NOTICE OF REGISTRATION CONFIRMATION EMAILED

04/21/2026

R.PR

REGISTERED-PRINCIPAL REGISTER

04/21/2026

NPUB

OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED

03/03/2026

PUBO

PUBLISHED FOR OPPOSITION

03/03/2026

NONP

NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED

02/25/2026

CNSA

APPROVED FOR PUB - PRINCIPAL REGISTER

02/06/2026

TEME

TEAS/EMAIL CORRESPONDENCE ENTERED

02/03/2026

CRFA

CORRESPONDENCE RECEIVED IN LAW OFFICE

02/03/2026

ALIE

ASSIGNED TO LIE

02/03/2026

ERSI

TEAS RESPONSE TO SUSPENSION INQUIRY RECEIVED

01/27/2026

GNS3

NOTIFICATION OF LETTER OF SUSPENSION E-MAILED

08/14/2025

GNSL

LETTER OF SUSPENSION E-MAILED

08/14/2025

CNSL

SUSPENSION LETTER WRITTEN

08/14/2025

XAEC

EXAMINER'S AMENDMENT ENTERED

08/14/2025

GNEN

NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED

08/14/2025

GNEA

EXAMINERS AMENDMENT E-MAILED

08/14/2025

CNEA

EXAMINERS AMENDMENT -WRITTEN

08/14/2025

DOCK

ASSIGNED TO EXAMINER

08/14/2025

NWOS

NEW APPLICATION OFFICE SUPPLIED DATA ENTERED

07/10/2025

MAFR

APPLICATION FILING RECEIPT MAILED

03/13/2025

NWAP

NEW APPLICATION ENTERED

03/13/2025

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