NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
04/01/2025
Back to search
Official data from USPTO
STATSCHIPPAC
Did you know this trademark is already registered in United States?
Before investing in name, identity, and promotion, validate collision risk and registration strategy to avoid wasting time and budget.
Active USPTO registrationType: CombinedOffice: United States
Risk and opportunity diagnosis
Executive reading for naming, filing, and monitoring decisions.
USPTO status
Active USPTO registration
Case type
Application and registration
Recorded events
24
Latest update
07/23/2026
Trademark type
Combined
Nice classes
40, 42
Filing date
04/11/2024
Registration date
04/01/2025
Expiration date
-
Complete case details
Structured fields from the responsible authority and the official record.
Status date
04/01/2025
Last transaction
07/23/2026
Responsible office
United States Patent and Trademark Office
Status code
700
Official register
Principal Register
Filing basis
Intent to use
First use anywhere
05/06/2024
First use in commerce
05/06/2024
Drawing code
5
Owner type
99
Owner location
Singapore, SG
Examiner
DELANEY, ZHALEH SYBIL
Law office
M70
Current location
FILE REPOSITORY (FRANCONIA)
Mark description
The mark consists of the stylized wording STATSChipPAC.
Holders and representatives
Holders
Stats Chippac Pte. Ltd.
Representatives
Audra Kemp Neal & McDevitt, LLC
Technical classification
Nice Classes
Class 40Class 42
Vienna Codes
No Vienna codes available.
Goods and services
Class 40
Custom assembly and custom manufacture of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packagingintegrated circuit chips or devices for others; providing technical information in the field of product manufacturing of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packagingintegrated circuit chips or devicestechnical consulting and manufacturing process consulting related thereto
Class 42
Software engineering services; engineering and testing services in the field of assemblypackagingencasingdesign of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devicesfor others; engineering consulting services relating to testingassemblypackaging encasing analysiswafer probewafer sortdesign of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devices; providing facilities featuring equipment for others for testing electrical and electronic componentselectrical semi-conductorssemi-conductor chips or devices for quality control purposes and for scientific research purposes; development and establishment of testing specifications and proceduresincluding wafer sorting proceduresall for the purpose of testing of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devices; final product quality testing services in the field of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devices; packaging design services for others in the field of packaging for electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit chips or devices; product research and development services relating to electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devices; providing scientific and technical information in the field of product designproduct developmentproduct engineeringproduct testing of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devicesadvice and consultation relating thereto
Publications
History of USPTO decisions and trademark events.
24 publications found
R.PR
REGISTERED-PRINCIPAL REGISTER
04/01/2025
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
02/11/2025
PUBO
PUBLISHED FOR OPPOSITION
02/11/2025
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
02/05/2025
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
01/16/2025
IUAA
USE AMENDMENT ACCEPTED
01/16/2025
XAEC
EXAMINER'S AMENDMENT ENTERED
01/16/2025
GNEN
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
01/16/2025
GNEA
EXAMINERS AMENDMENT E-MAILED
01/16/2025
CNEA
EXAMINERS AMENDMENT -WRITTEN
01/16/2025
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
12/18/2024
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
12/18/2024
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
12/18/2024
ATRV
ATTORNEY REVIEW COMPLETED
11/08/2024
AUPC
AMENDMENT TO USE PROCESSING COMPLETE
10/28/2024
IUAF
USE AMENDMENT FILED
10/28/2024
EAAU
TEAS AMENDMENT OF USE RECEIVED
10/28/2024
GPRN
NOTIFICATION OF PRIORITY ACTION E-MAILED
10/25/2024
GPRA
PRIORITY ACTION E-MAILED
10/25/2024
CPRA
PRIORITY ACTION WRITTEN
10/25/2024
DOCK
ASSIGNED TO EXAMINER
10/24/2024
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
09/23/2024
NWAP
NEW APPLICATION ENTERED
04/11/2024
Continuous trademark protection
Get notified about every new filing that threatens STATSCHIPPAC or your mark.
Professional 24-month watch service: we monitor USPTO for you and alert you in time to oppose — before conflicts become losses.