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Official data from USPTO

TCEE TCLAD

Did you know this trademark is already registered in United States?

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Active USPTO registrationType: CombinedOffice: United States

Quick snapshot

TCEE TCLAD

ST13

US500000097716333

Class

6, 9, 17

Filing

97716333

Registration

7434837

Risk and opportunity diagnosis

Executive reading for naming, filing, and monitoring decisions.

USPTO status

Active USPTO registration

Case type

Application and registration

Recorded events

28

Latest update

06/10/2025

Trademark type

Combined

Nice classes

6, 9, 17

Filing date

12/13/2022

Registration date

07/02/2024

Expiration date

-

Complete case details

Structured fields from the responsible authority and the official record.

Status date

07/02/2024

Last transaction

06/10/2025

Responsible office

United States Patent and Trademark Office

Status code

700

Official register

Principal Register

Filing basis

Intent to use

First use anywhere

05/04/2021

First use in commerce

05/04/2021

Drawing code

3

Owner type

03

Owner location

PRESCOTT, WI

Examiner

BUTTON, JENNIFER

Current location

Historical data usage

Mark description

The mark consists of a logo which includes a cube formed from the letters "TCEE", and the term "TCLAD" positioned to the right side of the logo.

Holders and representatives

Holders

TCLAD Inc.

Representatives

Nan Z Carr NZ CARR LAW OFFICE

Technical classification

Nice Classes

Class 6Class 9Class 17

Vienna Codes

No Vienna codes available.

Goods and services

Class 6

Thermal conductive insulated metallic substratesinsulated metal substrates for use in the manufacture of circuit boards

Class 9

Integrated circuit substratescircuit boards provided with integrated circuits; Printed circuit boards; Thermal conductive insulated metal circuit boards

Class 17

Insulators in the nature of insulating materials for electronic products; Insulating materialsinsulation ink for packaging; Insulating Coatings; Insulating Paints; Insulating varnish; Caulking materials; Thermal conductive Ink in the nature of insulating paints; Integrated circuit substratesfilms and sheets made from polymers for use in the manufacture of circuit boards; Thermal conductive insulated films and substrates made from polymers for use in the manufacture of circuit boards or electronic products; thermal interface materialselectrically insulating thermal conductive films and pads made from polymer for use in the manufacture of electronic circuits or electronic products

Publications

History of USPTO decisions and trademark events.

28 publications found

NURC

NOTICE OF UPDATED REGISTRATION CONFIRMATION EMAILED

06/10/2025

COC.

CORRECTION UNDER SECTION 7 - PROCESSED

05/19/2025

APRE

CASE ASSIGNED TO POST REGISTRATION PARALEGAL

05/19/2025

ES7R

TEAS SECTION 7 REQUEST RECEIVED

01/01/2025

NRCC

NOTICE OF REGISTRATION CONFIRMATION EMAILED

07/02/2024

R.PR

REGISTERED-PRINCIPAL REGISTER

07/02/2024

SUNA

NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED

05/28/2024

CNPR

ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED

05/28/2024

SUPC

STATEMENT OF USE PROCESSING COMPLETE

05/04/2024

AITU

CASE ASSIGNED TO INTENT TO USE PARALEGAL

05/04/2024

IUAF

USE AMENDMENT FILED

04/15/2024

EISU

TEAS STATEMENT OF USE RECEIVED

04/15/2024

NOAM

NOA E-MAILED - SOU REQUIRED FROM APPLICANT

01/23/2024

NPUB

OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED

11/28/2023

PUBO

PUBLISHED FOR OPPOSITION

11/28/2023

NONP

NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED

11/08/2023

CNSA

APPROVED FOR PUB - PRINCIPAL REGISTER

10/21/2023

TEME

TEAS/EMAIL CORRESPONDENCE ENTERED

10/18/2023

CRFA

CORRESPONDENCE RECEIVED IN LAW OFFICE

10/18/2023

TROA

TEAS RESPONSE TO OFFICE ACTION RECEIVED

10/18/2023

GNRN

NOTIFICATION OF NON-FINAL ACTION E-MAILED

09/23/2023

GNRT

NON-FINAL ACTION E-MAILED

09/23/2023

CNRT

NON-FINAL ACTION WRITTEN

09/23/2023

DOCK

ASSIGNED TO EXAMINER

09/16/2023

PARI

TEAS VOLUNTARY AMENDMENT RECEIVED

08/07/2023

MDSC

NOTICE OF DESIGN SEARCH CODE E-MAILED

01/11/2023

NWOS

NEW APPLICATION OFFICE SUPPLIED DATA ENTERED

01/10/2023

NWAP

NEW APPLICATION ENTERED

12/16/2022

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