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AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
08/04/2025
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Official data from USPTO
WELCO
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Active USPTO registrationType: WordOffice: United States
Quick snapshot
WELCO
ST13
US500000097068631Class
1, 2, 6, 9
Filing
97068631
Registration
7251588
Risk and opportunity diagnosis
Executive reading for naming, filing, and monitoring decisions.
USPTO status
Active USPTO registration
Case type
Application and registration
Recorded events
24
Latest update
08/05/2025
Trademark type
Word
Nice classes
1, 2, 6, 9
Filing date
10/11/2021
Registration date
12/26/2023
Expiration date
-
Complete case details
Structured fields from the responsible authority and the official record.
Status date
12/26/2023
Last transaction
08/05/2025
Responsible office
United States Patent and Trademark Office
Status code
700
Official register
Principal Register
Filing basis
Foreign priority
Drawing code
4
Owner type
28
Owner location
HANAU, DE
Examiner
MAHONEY, KATHERINE
Law office
N90
Current location
PUBLICATION AND ISSUE SECTION
Holders and representatives
Holders
HERAEUS ELECTRONICS GMBH & CO. KG
Heraeus Deutschland GmbH & Co. KG
Representatives
Nathaniel Kramer KIRSCHSTEIN ISRAEL SCHIFFMILLER & PIERONI
Technical classification
Nice Classes
Class 1Class 2Class 6Class 9
Vienna Codes
No Vienna codes available.
Goods and services
Class 1
Chemical agents for use in soldering in the microelectronics industry; electronic-grade chemical agents for use in soldering in the microelectronics industry; chemical agents for use in screen printingdispensing and jetting in soldering in the microelectronics industry; chemical agents for use in soldering in the microelectronics industryin the semiconductor industry; chemical agents for use in soldering in the microelectronics industrychemical agents for use in clean room applications; all the aforementioned goods preferably for use in chip-productionas soldering preparations comprising solder metal alloys and fluxconductive inks comprising solder metal and its alloys and flux for use in surface-mountable devices (SMD)surface-mountable technology (SMT)through-hole technology (THT)pin-in-hole technology (PIH)System in Package (SIP)System on-chip (SoC)monolithic integration in a semiconductor (IC)electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometersin particular wherein the particles of the powder have a particle size of less than 50 micrometersin particular comprising the metals tincopperzincbismuth and silver and an alloy of at least of two of the metals; all the above mentioned goods preferably for use in chip-productionelectronic-grade chemical agents for use in soldering in the microelectronics industry for surface-mountable devices (SMD)surface-mountable technology (SMT)through-hole technology (THT)pin-in-hole technology (PIH)System in Package (SIP)System on-chip (SoC)monolithic integration in a semiconductor (IC)electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometersin particular wherein the particles of the powder have a particle size of less than 50 micrometersin particular comprising the metals tincopperzincbismuth and silver and an alloy of at least of two of these metals; all of the above-mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipescopper pipesguttersjewelry and iron-containing componentsin the field of gas and water pipes
Class 2
conductive inks for use in wave solderingTHT-solderingalso known as through-hole technology-solderingSMD-solderingalso known as surface mounted technology solderingwherein the inks comprising solder metal and its alloys and flux for printing of electronic componentsin particular in the chip industrysemiconductor industryconsumer electronics industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipescopper pipesguttersjewelry and iron-containing componentsnot for soldering in the field of gas and water pipes
Class 6
soldering pastes; soft solder for use in the form of a printable paste for use in microelectronic applicationswherein the paste comprises powder having a particle size of less than 50 micrometers of tincopperzinc and silver; solder pastes for use in wave solderingTHT-solderingalso known as through-hole technology-solderingSMD-solderingalso known as surface mounted technology solderingwherein the pastes comprise solder metal and its alloys and flux for use in printing of electronic componentsin particular in the chip industrysemiconductor industryconsumer electronic industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipescopper pipesguttersjewelry and iron-containing componentsnot for soldering in the field of gas and water pipes
Class 9
Lead-free soldertin comprising solderfor the microelectronics industryin particular the microelectronics chip industry; all of the above-mentioned goods for use in chip productionfor use as soldering pastes comprising solder metal and/or its alloys and fluxconductive inks comprising solder metal and/or its alloys and flux for surface mountable devices (SMD)surface mountable technology (SMT)through-hole technology (THT)pin-in-hole technology (PIH)System in Package (SIP)System on-chip (SoC)monolithic integration in a semiconductor (IC)electric circuits boards with pitches or line space from 100 nanometers to 200 micrometers; all the above-mentioned goods for use in chip productionfor use in the production of surface mountable devices (SMD)surface mountable technology (SMT)through-hole technology (THT)pin-in-hole technology (PIH)System in Package (SIP)System on-chip (SoC)monolithic integration in a semiconductor (IC)electric circuit boards with pitches or line space from 100 nanometers up to 200 micrometers; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipescopper pipesguttersjewelry or iron-containing componentsin the field of gas and water pipes; all aforementioned goods for depositingin particular by printingunderfill technologies for flip-chip (FC)fine-pitch-ball-grid-array (FPBGA)including chip-size packaging (CSP)preferred according to Industry Specifications (IPC)
Publications
History of USPTO decisions and trademark events.
24 publications found
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
12/26/2023
R.PR
REGISTERED-PRINCIPAL REGISTER
12/26/2023
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
10/10/2023
PUBO
PUBLISHED FOR OPPOSITION
10/10/2023
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
09/20/2023
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
09/05/2023
XAEC
EXAMINER'S AMENDMENT ENTERED
09/05/2023
GNEN
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
09/05/2023
GNEA
EXAMINERS AMENDMENT E-MAILED
09/05/2023
CNEA
EXAMINERS AMENDMENT -WRITTEN
09/05/2023
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
07/30/2023
GNRT
NON-FINAL ACTION E-MAILED
07/30/2023
CNRT
NON-FINAL ACTION WRITTEN
07/30/2023
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
04/17/2023
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
04/17/2023
ALIE
ASSIGNED TO LIE
04/17/2023
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
01/19/2023
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
07/25/2022
GNRT
NON-FINAL ACTION E-MAILED
07/25/2022
CNRT
NON-FINAL ACTION WRITTEN
07/25/2022
DOCK
ASSIGNED TO EXAMINER
07/14/2022
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
11/02/2021
NWAP
NEW APPLICATION ENTERED
10/14/2021
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