ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
10/18/2023
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Official data from USPTO
CMC MATERIALS
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Active USPTO registrationType: WordOffice: United States
Quick snapshot
CMC MATERIALS
ST13
US500000088698404Class
1, 3, 4, 7
Filing
88698404
Registration
6667318
Risk and opportunity diagnosis
Executive reading for naming, filing, and monitoring decisions.
USPTO status
Active USPTO registration
Case type
Application and registration
Recorded events
47
Latest update
10/18/2023
Trademark type
Word
Nice classes
1, 3, 4, 7
Filing date
11/19/2019
Registration date
03/08/2022
Expiration date
-
Complete case details
Structured fields from the responsible authority and the official record.
Status date
03/08/2022
Last transaction
08/19/2023
Responsible office
United States Patent and Trademark Office
Status code
700
Official register
Principal Register
Filing basis
Intent to use
First use anywhere
05/24/2021
First use in commerce
05/24/2021
Drawing code
4
Owner type
16
Owner location
WILMINGTON, DE, US
Examiner
CLARK, ROBERT C
Law office
L10
Current location
PUBLICATION AND ISSUE SECTION
Holders and representatives
Holders
CMC MATERIALS LLC
CMC MATERIALS, INC.
C. C. (pessoa física)
Representatives
Cynthia Johnson Walden Fish & Richardson P.C.
Technical classification
Nice Classes
Class 1Class 3Class 4Class 7
Vienna Codes
No Vienna codes available.
Goods and services
Class 1
Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductorssilicon wafersglassmetalsplasticsmachineryelectronic components and substratesoptical componentscomputer partsmagnetic data-storage disks and heads for use in the semiconductorelectronicrigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarizesmoothotherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarizesmooth or otherwise modify their mechanicalphysicalchemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductorsphotoresist stripperbenzotriazole (BTA) and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additivesabrasive dispersions for use in the manufacture of electronic components and substratesoptical componentsmetalsmachinerycomputer partsmagnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturingsolar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductorsintegrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and sciencefor use in the semiconductor and micro-electronics industries; Chemicalspolymer-containing drag reducers and flow improvers to increase flow of hydrocarbons through pipelines; Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
Class 3
Industrial abrasivesabrasive compounds for lapping and polishing semiconductorssilicon wafersglass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparationschemical cleanersabrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substratesoptical componentsglassmetalsplasticsmachinerycomputer partsmagnetic data-storage disks and heads
Class 4
Industrial lubricantsvalve lubricants for the oil and gas storagepipeline and gas distribution markets; Industrial lubricants and greases
Class 7
Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafersintegrated circuitshard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafersintegrated circuitshard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
Publications
History of USPTO decisions and trademark events.
47 publications found
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
08/09/2023
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
08/09/2023
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
08/09/2023
CHAN
APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
08/09/2023
COAR
TEAS CHANGE OF OWNER ADDRESS RECEIVED
08/09/2023
R.PR
REGISTERED-PRINCIPAL REGISTER
03/08/2022
SUNA
NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
02/02/2022
CNPR
ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
02/01/2022
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
02/01/2022
SUPC
STATEMENT OF USE PROCESSING COMPLETE
01/31/2022
EX3G
SOU EXTENSION 3 GRANTED
01/31/2022
AITU
CASE ASSIGNED TO INTENT TO USE PARALEGAL
01/31/2022
IUAF
USE AMENDMENT FILED
01/21/2022
EXT3
SOU EXTENSION 3 FILED
01/21/2022
EEXT
SOU TEAS EXTENSION RECEIVED
01/21/2022
EISU
TEAS STATEMENT OF USE RECEIVED
01/21/2022
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
07/23/2021
EX2G
SOU EXTENSION 2 GRANTED
07/21/2021
EXT2
SOU EXTENSION 2 FILED
07/21/2021
EEXT
SOU TEAS EXTENSION RECEIVED
07/21/2021
ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
05/12/2021
PCGR
PETITION TO DIRECTOR GRANTED
04/13/2021
APET
ASSIGNED TO PETITION STAFF
04/13/2021
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
01/14/2021
EX1G
SOU EXTENSION 1 GRANTED
01/12/2021
EXT1
SOU EXTENSION 1 FILED
01/12/2021
EEXT
SOU TEAS EXTENSION RECEIVED
01/12/2021
TPDR
TEAS PETITION TO DIRECTOR RECEIVED
01/12/2021
NOAM
NOA E-MAILED - SOU REQUIRED FROM APPLICANT
07/21/2020
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
05/26/2020
PUBO
PUBLISHED FOR OPPOSITION
05/26/2020
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
05/06/2020
ALIE
ASSIGNED TO LIE
04/22/2020
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
04/14/2020
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
04/13/2020
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
04/13/2020
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
04/13/2020
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
02/25/2020
GNRT
NON-FINAL ACTION E-MAILED
02/25/2020
CNRT
NON-FINAL ACTION WRITTEN
02/25/2020
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
02/24/2020
GNRT
NON-FINAL ACTION E-MAILED
02/24/2020
CNRT
NON-FINAL ACTION WRITTEN
02/24/2020
DOCK
ASSIGNED TO EXAMINER
02/24/2020
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
11/26/2019
NWAP
NEW APPLICATION ENTERED
11/22/2019
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