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Official data from USPTO

LAIRD

Did you know this trademark is already registered in United States?

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Active USPTO registrationType: CombinedOffice: United States

Quick snapshot

LAIRD

ST13

US500000087464645

Class

17

Filing

87464645

Registration

5515128

Risk and opportunity diagnosis

Executive reading for naming, filing, and monitoring decisions.

USPTO status

Active USPTO registration

Case type

Application and registration

Recorded events

26

Latest update

01/14/2026

Trademark type

Combined

Nice classes

17

Filing date

05/25/2017

Registration date

07/10/2018

Expiration date

-

Complete case details

Structured fields from the responsible authority and the official record.

Status date

04/29/2025

Last transaction

01/14/2026

Responsible office

United States Patent and Trademark Office

Status code

702

Official register

Principal Register

Filing basis

Intent to use

First use anywhere

05/04/2018

First use in commerce

05/04/2018

Drawing code

3

Owner type

03

Owner location

Chesterfield, MO

Examiner

SOBRAL,CHRISTINA

Current location

Historical data usage

Mark description

The mark consists of the word "LAIRD" and a ring design.

Holders and representatives

Holders

Laird Technologies, Inc.
Laird Technologies, Inc.

Representatives

Joseph E. Walsh, Jr. HARNESS, DICKEY & PIERCE, P.L.C.

Technical classification

Nice Classes

Class 17

Vienna Codes

No Vienna codes available.

Goods and services

Class 17

Microwave absorberspastespadsgelsmolded / extruded shapescomprised of foamselastomerspolymers loaded with magnetic particles; Conducting and protective interlayer conductive materials and coatings for use in integrated circuitssemiconductor devicescomputer disk drives and other computer hardware; conductive contactsfabric over foam contactsfoil over foam contactsspring contactssurface mount device contactsfor providing an electrical connection between two surfaces in electronic devices; Insulating and protective interlayer dielectric materials and coatings for use in integrated circuitssemiconductor devicescomputer disk drives and other computer hardware; conductive foamsheetspadsstripsdie-cut shapesfor use in conducting heat and electricity; conductive tape for electromagnetic radiation shielding in electronic products; decorative electromagnetic interference (EMI) shielding metalsconductive metal sheets having a decorative finish thereonfor EMI shielding in electronics; structural EMI shielding metalsin the form of metal board level shields; EMI shielding wire mesh and knitted wirein the form of gaskets; Electromagnetic interference (EMI) shielding productsEMI shielding contactsEMI spring contactsEMI shielding user interface shields and EMI combination shieldsEMI board level shielding and customer designed EMI shielding; electromagnetic interference shielding gasketsfabric over foam gasketsfoil over foam gasketsfingerstocks; conductive elastomerssynthetic elastomers in the form of padsas moldeddie cut or extruded shapesfor use as components in electronics; form-in-place non-metal gaskets for electronic devices; vent panelsmetal plated rigid structures that provide EMI shielding and permit air flow to electronic components; thermal interface materials and phase change thermal interface materialslow thermal resistance interface padstapessheetsfilmscoatings for use as heat transfer interfaces between electronic components and thermal dissipation members; thermal gap filler pad thermal interface materialsthermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materialslow thermal resistance interface padstapessheetsfilmscoatings for use as heat transfer interfaces between electronic components and thermal dissipation members; thermally conductive PCB (printed circuit board) materialsfilms and sheets made out of resins for use in manufacturing electronic circuit boards; thermally conductive thermoplasticssemiprocessed thermoplastics in moldedextrudedsheet form; conductive plastics and elastomersputtiesgreasespadssheets for use in the management of electromagnetic radiation and heat in electronic devices; absorbing plastics and elastomers for use in absorbing electromagnetic radiation in electronic devices

Publications

History of USPTO decisions and trademark events.

26 publications found

TCCA

TEAS CHANGE OF CORRESPONDENCE RECEIVED

01/12/2026

ARAA

ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED

01/12/2026

REAP

TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED

01/12/2026

NA85

NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED

04/29/2025

C15A

REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.

04/29/2025

APRE

CASE ASSIGNED TO POST REGISTRATION PARALEGAL

04/28/2025

E815

TEAS SECTION 8 & 15 RECEIVED

01/10/2025

REM1

COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED

07/10/2023

R.PR

REGISTERED-PRINCIPAL REGISTER

07/10/2018

SUNA

NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED

06/08/2018

CNPR

ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED

06/07/2018

SUPC

STATEMENT OF USE PROCESSING COMPLETE

06/06/2018

AITU

CASE ASSIGNED TO INTENT TO USE PARALEGAL

06/06/2018

IUAF

USE AMENDMENT FILED

05/17/2018

EISU

TEAS STATEMENT OF USE RECEIVED

05/17/2018

CHAN

APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED

02/19/2018

COAR

TEAS CHANGE OF OWNER ADDRESS RECEIVED

02/19/2018

NOAM

NOA E-MAILED - SOU REQUIRED FROM APPLICANT

11/21/2017

NPUB

OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED

09/26/2017

PUBO

PUBLISHED FOR OPPOSITION

09/26/2017

NONP

NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED

09/06/2017

CNSA

APPROVED FOR PUB - PRINCIPAL REGISTER

08/15/2017

DOCK

ASSIGNED TO EXAMINER

08/15/2017

MDSC

NOTICE OF DESIGN SEARCH CODE E-MAILED

06/02/2017

NWOS

NEW APPLICATION OFFICE SUPPLIED DATA ENTERED

06/01/2017

NWAP

NEW APPLICATION ENTERED

05/29/2017

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