FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
02/05/2026
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Official data from USPTO
TORYZA
Did you know this trademark is already registered in United States?
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Active USPTO registrationType: WordOffice: United States
Risk and opportunity diagnosis
Executive reading for naming, filing, and monitoring decisions.
USPTO status
Active USPTO registration
Case type
Application and registration
Recorded events
25
Latest update
04/03/2026
Trademark type
Word
Nice classes
1, 7
Filing date
03/04/2024
Registration date
06/17/2025
Expiration date
-
Complete case details
Structured fields from the responsible authority and the official record.
Status date
06/17/2025
Last transaction
04/03/2026
Responsible office
United States Patent and Trademark Office
Status code
700
Official register
Principal Register
Drawing code
4
Owner type
03
Owner location
JP
Examiner
JANSON, ANDREW KYLE
Law office
L50
Current location
FILE REPOSITORY (FRANCONIA)
Holders and representatives
Holders
OKUNO CHEMICAL INDUSTRIES CO., LTD.
Representatives
Boris Umansky Ladas & Parry LLP
Technical classification
Nice Classes
Class 1Class 7
Vienna Codes
No Vienna codes available.
Goods and services
Class 1
Chemicals for use in the manufacture of semiconductors; chemical surface treatment agents for use in the manufacture of electronic components; etchants for use in the manufacture of semi-conductors; plating removing preparationschemical agents for removing metal plating from microelectronic components and semiconductors; release solvent for photoresists being solvent type processing compositions for use in the electronics industry; chemicals for use in metal plating; industrial chemicals; chemicals for use in plating; plating preparations; chemical plating solutionslithium plating solutionssodium plating solutionsaluminum plating solutionsmagnesium plating solutionschromium plating solutionsmanganese plating solutionsiron plating solutionscobalt plating solutionsnickel plating solutionselectroless nickel plating solutionsacid copper plating solutionscopper plating solutionselectroless copper plating solutionszinc plating solutionsgallium plating solutionsgermanium plating solutionsruthenium plating solutionselectroless ruthenium plating solutionsrhodium plating solutionselectroless rhodium plating solutionspalladium plating solutionselectroless palladium plating solutionssilver plating solutionselectroless silver plating solutionstin plating solutionsiridium plating solutionsplatinum plating solutionselectroless platinum plating solutionsgold plating solutionselectroless gold plating solutionsbismuth plating solutionselectroless bismuth plating solutions; metal plating chemical compositions; chemical additives for metal plating chemical compositions; metal surface treatment agentschemical compositions for use in metal plating processes; chemicals for use in metal surface treatmentchemical compositions for use in metal plating processes; chemical preparations for use in metal industries; catalytic agents; catalysts for chemical plating processes; ungluing preparationschemical solvents and degreasing solvents for use in manufacturing processes; etching agents being etching solutions for metals; etching agents being etching solutions for the surface of aluminum and aluminum alloys; etching agents being etching solutions for the surface of glass.
Class 7
Surface treatment equipment for use in manufacture of semiconductorssemiconductor wafer plating processing machines for use in manufacture; semiconductor manufacturing machines; metal plating machines for use in the manufacture of semiconductors; semiconductor wafers plating processing machines for use in the manufacture of semiconductors; surface treatment equipment for semiconductor wafers and integrated circuitsmetal plating processing machines system comprised of mixing machinesfilter machinesspraying machinesplating bath machinespumping machinesplating processing machines for use in surface treatment; semiconductor substrates manufacturing machines; semiconductor wafer processing machines; etching machines and equipment for semiconductor substrates; electrolessplating machines; electroplating machines; liquid metal processing tanks for electronic components and semiconductor wafer plating being parts of machines; chemical processing tanks being parts of machines; machines and equipment for use in manufacturing and processing electronic circuit printed boardsmetal plating processing machines system comprised of mixing machinesfilter machinesspraying machinesplating bath machinespumping machinesplating processing machines for use in surface treatment.
Publications
History of USPTO decisions and trademark events.
25 publications found
FICS
FINAL DISPOSITION NOTICE SENT TO IB
01/17/2026
FIMP
FINAL DISPOSITION PROCESSED
01/17/2026
OPNX
NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
01/01/2026
OPNS
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
12/17/2025
OPNR
NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
12/17/2025
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
09/17/2025
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
06/17/2025
R.PR
REGISTERED-PRINCIPAL REGISTER
06/17/2025
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
04/29/2025
PUBO
PUBLISHED FOR OPPOSITION
04/29/2025
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
04/23/2025
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
04/01/2025
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
03/20/2025
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
03/20/2025
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
03/20/2025
RFNT
REFUSAL PROCESSED BY IB
10/12/2024
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
09/20/2024
RFRR
REFUSAL PROCESSED BY MPU
09/20/2024
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
09/19/2024
CNRT
NON-FINAL ACTION WRITTEN
09/18/2024
DOCK
ASSIGNED TO EXAMINER
09/18/2024
MAFR
APPLICATION FILING RECEIPT MAILED
07/25/2024
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
07/25/2024
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
07/18/2024
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