FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
04/16/2026
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Official data from USPTO
IMEC. NETZERO
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Active USPTO registrationType: WordOffice: United States
Quick snapshot
IMEC. NETZERO
ST13
US500000079387071Class
9, 35, 40, 41, 42
Filing
79387071
Registration
7943008
Risk and opportunity diagnosis
Executive reading for naming, filing, and monitoring decisions.
USPTO status
Active USPTO registration
Case type
Application and registration
Recorded events
35
Latest update
04/17/2026
Trademark type
Word
Nice classes
9, 35, 40, 41, 42
Filing date
11/03/2023
Registration date
09/16/2025
Expiration date
-
Complete case details
Structured fields from the responsible authority and the official record.
Status date
09/16/2025
Last transaction
04/17/2026
Responsible office
United States Patent and Trademark Office
Status code
700
Official register
Principal Register
Drawing code
4
Owner type
99
Owner location
BE
Examiner
KOPENSKI, CLAUDIA ANN
Law office
O20
Current location
FILE REPOSITORY (FRANCONIA)
Holders and representatives
Holders
I. V. (pessoa física)
Representatives
Jessica S. Sachs Harness, Dickey & Pierce, P.L.C.
Technical classification
Nice Classes
Class 9Class 35Class 40Class 41Class 42
Vienna Codes
No Vienna codes available.
Goods and services
Class 9
Downloadable computer-aided manufacturing (CAM) software for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; downloadable computer software for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; downloadable computer application software for measuring the environmental impact of manufacturing integrated circuit chips; downloadable computer application software for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips to help reduce the carbon footprint of lithography and etch process steps; application-specific integrated circuits; electronic chips for the manufacture of integrated circuits; blank electronic chip cards; encoded electronic chip cards containing programming used for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; downloadable computer software for environmental monitoring; semiconductor chips; integrated circuit chips; semiconductors; semiconductor apparatus; semiconductor testing apparatus; integrated circuits; downloadable mobile applications for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips
Class 35
Business consulting servicesproviding business information and advice concerning semiconductorsintegrated circuits and application-specific integrated circuits (ASICs); business consulting servicesproviding business information relating to reducing the carbon footprint of lithography and etch process steps
Class 40
Custom manufacture of integrated circuitsapplication-specific integrated circuits (asics)semiconductorsmicroprocessorsmicrocontrollersembedded systems; custom manufacture of semiconductor componentsdevices and circuits
Class 41
Training services in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; training services in the field of semiconductorsintegrated circuits and application-specific integrated circuits; educational servicesconducting programs in the field of scientific modelling of the environmental impact of manufacturing; educational servicesthe organization and conducting of workshopsconferences and seminars in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; publication of online and electronic books and periodicals; publication of learning materials in the nature of books and periodicals in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; developing learning materialseducational materials for others in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; provision of non-downloadableonline electronic publications in the nature of booksmagazinesbrochures in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; providing educational advising and information with respect to education in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chipsalso by electronic networks particularly the internet; training in the field of the design of integrated circuits; training in the field of the development of integrated circuits; training in the field of reducing the carbon footprint of lithography and etch process steps; educational servicesproviding workshopsconferences and seminars in the field of reducing the carbon footprint of lithography and etch process steps
Class 42
Providing temporary use of online non-downloadable web-based applications for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; environmental consulting services in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; scientific research in the field of environmental conservation; research in the reduction of carbon emissions; research in the area of semiconductor processing technology; technical project studies in the nature of technical research in the field of carbon offsetting; technical consultancy in the field of the production of semiconductors; providing scientific informationadvice and consultancy relating to carbon offsetting; providing scientific informationadvice and consultancy relating to net zero emissions; providing scientific informationadvice and consultancy relating to reducing the carbon footprint of lithography and etch process steps; designdevelopmenttesting in the field of integrated circuitsapplication-specific integrated circuits (ASICs)semiconductorsmicroprocessorsmicrocontrollers and embedded systems for others; product quality testing services; technological consultancy in the field of new semiconductor processing and manufacturing technologies; research and development services in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; quality control and authentication services for others in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; scientific and technological servicesscientific researchanalysistesting and modelling in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; industrial analysis and industrial research services in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; development of new technology for others in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; design of integrated circuits; integrated circuit design services; technology consultancy in the field of new semiconductor processing and manufacturing technologies by experts; scientific adviceconsultancy and information relating to the design and modelling in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips also to be provided via electronic networks particularly the internet
Publications
History of USPTO decisions and trademark events.
35 publications found
FICS
FINAL DISPOSITION NOTICE SENT TO IB
03/28/2026
FIMP
FINAL DISPOSITION PROCESSED
03/27/2026
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
12/16/2025
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
09/16/2025
R.PR
REGISTERED-PRINCIPAL REGISTER
09/16/2025
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
07/29/2025
PUBO
PUBLISHED FOR OPPOSITION
07/29/2025
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
07/23/2025
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
06/24/2025
XAEC
EXAMINER'S AMENDMENT ENTERED
06/24/2025
GNEN
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
06/24/2025
GNEA
EXAMINERS AMENDMENT E-MAILED
06/24/2025
CNEA
EXAMINERS AMENDMENT -WRITTEN
06/24/2025
OPNX
NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
06/20/2025
OPNS
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
06/03/2025
OPNR
NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
06/03/2025
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
05/28/2025
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
05/28/2025
ERFR
TEAS REQUEST FOR RECONSIDERATION RECEIVED
05/28/2025
GNFN
NOTIFICATION OF FINAL REFUSAL EMAILED
02/20/2025
GNFR
FINAL REFUSAL E-MAILED
02/20/2025
CNFR
FINAL REFUSAL WRITTEN
02/20/2025
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
01/23/2025
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
01/23/2025
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
01/23/2025
RFNT
REFUSAL PROCESSED BY IB
08/11/2024
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
07/23/2024
RFRR
REFUSAL PROCESSED BY MPU
07/23/2024
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
06/26/2024
CNRT
NON-FINAL ACTION WRITTEN
06/25/2024
DOCK
ASSIGNED TO EXAMINER
06/13/2024
MAFR
APPLICATION FILING RECEIPT MAILED
01/10/2024
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
01/06/2024
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
01/04/2024
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