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Official data from USPTO

NOVASIC

Did you know this trademark is already registered in United States?

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Active USPTO registrationType: WordOffice: United States

Quick snapshot

NOVASIC

ST13

US500000079358894

Class

9, 40, 42

Filing

79358894

Registration

7394032

Risk and opportunity diagnosis

Executive reading for naming, filing, and monitoring decisions.

USPTO status

Active USPTO registration

Case type

Application and registration

Recorded events

37

Latest update

11/30/2024

Trademark type

Word

Nice classes

9, 40, 42

Filing date

09/27/2022

Registration date

05/28/2024

Expiration date

-

Complete case details

Structured fields from the responsible authority and the official record.

Status date

05/28/2024

Last transaction

05/28/2024

Responsible office

United States Patent and Trademark Office

Status code

700

Official register

Principal Register

Drawing code

4

Owner type

34

Owner location

FR

Examiner

BARRETT, LEAH

Law office

N80

Current location

FILE REPOSITORY (FRANCONIA)

Holders and representatives

Holders

NOVASIC

Representatives

Mari-Elise Paul McBrayer PLLC

Technical classification

Nice Classes

Class 9Class 40Class 42

Vienna Codes

No Vienna codes available.

Goods and services

Class 9

Single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different machining operationsoperations for conducting cutsmeplatsbevels; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface preparation operations ready for epitaxy or bondinglappingprecision grindingmechanical and chemical mechanical (CMP) polishingcleaninglaser marking operations; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components; all these goods being used in precision grindingmechanical and chemical mechanical polishing (CMP) operations and other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling

Class 40

mechanical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to machining operationsprocessing for conducting cutsmeplatsbevels; mechanicalchemical and optical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to for surface preparation operationslappingprecision grindingmechanical and chemical mechanical (CMP) polishingcleaninglaser marking operations; other mechanicalchemical and physical surface treatmentsused for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; surface characterization process beingphysicalchemical and opticaltopographyroughness and chemical analysis; structure characterization method being chemical or physicalmorphology and crystal structure; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling

Class 42

Testing of machining techniquestechnical tests and trials for conducting cutsmeplatsbevels; testing and tests of surface preparation techniquestechnical testing and testing of lappingprecision grindingmechanical and chemical mechanical polishing (CMP)cleaninglaser marking; technical tests of other surface treatments for others in the field of materials used to for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; research and development for new products for others; research and development of new consumable products for others used in machining operationsoperations for conducting cutsmeplatsbevels; research and development of new consumable products for others for use in surface preparation operationslappingprecision grindingmechanical and chemical mechanical (CMP) polishingcleaninglaser marking operations; research and development of new consumables for others used in other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for conducting machining operationsoperations for conducting cutsmeplatsbevels; technical advice for conducting surface preparation operationslappingprecision grindingmechanical and chemical mechanical (CMP) polishingcleaninglaser marking operations; technical advice for conducting other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for surface characterizationtopographyroughness and chemical analysis; technical advice for structure characterizationmorphology and crystallography; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding

Publications

History of USPTO decisions and trademark events.

37 publications found

FINO

FINAL DECISION TRANSACTION PROCESSED BY IB

11/30/2024

FICS

FINAL DISPOSITION NOTICE SENT TO IB

11/12/2024

FIMP

FINAL DISPOSITION PROCESSED

11/12/2024

FICR

FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB

08/28/2024

NRCC

NOTICE OF REGISTRATION CONFIRMATION EMAILED

05/28/2024

R.PR

REGISTERED-PRINCIPAL REGISTER

05/28/2024

TCCA

TEAS CHANGE OF CORRESPONDENCE RECEIVED

04/11/2024

ECDR

TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS

04/11/2024

ARAA

ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED

04/11/2024

REAP

TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED

04/11/2024

NPUB

OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED

03/12/2024

GPNX

NOTIFICATION PROCESSED BY IB

03/12/2024

PUBO

PUBLISHED FOR OPPOSITION

03/12/2024

OPNS

NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB

02/21/2024

NONP

NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED

02/21/2024

NPUB

OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED

02/21/2024

OP2R

NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB

02/21/2024

CNSA

APPROVED FOR PUB - PRINCIPAL REGISTER

02/06/2024

XAEC

EXAMINER'S AMENDMENT ENTERED

02/06/2024

GNEN

NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED

02/06/2024

GNEA

EXAMINERS AMENDMENT E-MAILED

02/06/2024

CNEA

EXAMINERS AMENDMENT -WRITTEN

02/06/2024

TCCA

TEAS CHANGE OF CORRESPONDENCE RECEIVED

01/18/2024

ECDR

TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS

01/18/2024

ARAA

ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED

01/18/2024

REAP

TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED

01/18/2024

CHAN

APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED

01/18/2024

COAR

TEAS CHANGE OF OWNER ADDRESS RECEIVED

01/18/2024

RFNT

REFUSAL PROCESSED BY IB

09/13/2023

RFCS

NON-FINAL ACTION MAILED - REFUSAL SENT TO IB

08/19/2023

RFRR

REFUSAL PROCESSED BY MPU

08/19/2023

RFCR

NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW

07/26/2023

CNRT

NON-FINAL ACTION WRITTEN

07/25/2023

DOCK

ASSIGNED TO EXAMINER

07/12/2023

MAFR

APPLICATION FILING RECEIPT MAILED

01/07/2023

NWOS

NEW APPLICATION OFFICE SUPPLIED DATA ENTERED

01/03/2023

REPR

SN ASSIGNED FOR SECT 66A APPL FROM IB

12/30/2022

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