NREP
NEW REPRESENTATIVE AT IB RECEIVED
04/02/2026
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Official data from USPTO
CELLFIL
Did you know this trademark is already registered in United States?
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Active USPTO registrationType: WordOffice: United States
Quick snapshot
CELLFIL
ST13
US500000079313789Class
1, 2, 17
Filing
79313789
Registration
6741699
Risk and opportunity diagnosis
Executive reading for naming, filing, and monitoring decisions.
USPTO status
Active USPTO registration
Case type
Application and registration
Recorded events
33
Latest update
04/03/2026
Trademark type
Word
Nice classes
1, 2, 17
Filing date
02/22/2021
Registration date
05/31/2022
Expiration date
-
Complete case details
Structured fields from the responsible authority and the official record.
Status date
05/31/2022
Last transaction
04/03/2026
Responsible office
United States Patent and Trademark Office
Status code
700
Official register
Principal Register
Drawing code
4
Owner type
03
Owner location
JP
Examiner
HARMON, RAYMOND E
Law office
L30
Current location
PUBLICATION AND ISSUE SECTION
Holders and representatives
Holders
TAIYO HOLDINGS CO., LTD.
Representatives
Kumiko Ide Wenderoth, Lind & Ponack, L.L.P.
Technical classification
Nice Classes
Class 1Class 2Class 17
Vienna Codes
No Vienna codes available.
Goods and services
Class 1
Chemicals for use in the process of producing printed circuit boardsresist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boardsresist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boardssolder resists; chemical preparations for use in the process of producing printed circuit boardssolder mask; chemicals for use in the process of producing printed circuit boardsetching resist; chemicals for use in the process of producing printed circuit boardsphotoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the form of film for sealing electronic components; unexposed dry filmsmold dry films for electronic components; unexposed dry filmsinsulation mold dry films for electronic components; unexposed dry filmsthermal curing type mold dry films for electronic components; chemicals for use in the process of producing printed circuit boardschemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boardschemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boardschemical agents for plugging holes on printed circuit boards; chemical sealants for use in the process of producing electronic components; synthetic resins that are used as sealants for use in the process of producing electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes
Class 2
Dyessynthetic dyes; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks being printing inks for use in the process of producing electronic components; inks for hole pluggingprinting inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink
Class 17
Electrical insulating resistselectrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materialsinsulating resin materials for use in the process of producing printed circuit boards; electrical insulating materialsinsulating resin materials for use in the process of producing electronic components; electrical insulating materialsinsulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; electrical insulating materialsinsulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; electrical insulating materialsinsulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materialsinsulating resin materials for interlayer dielectric materials for sealing electronic components; electrical insulating materialsinsulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; electrical insulating materialsinsulating resin materials for interlayer dielectric materials in the form of film for sealing electronic components; electrical insulating materialsinsulating coating materials for use in the process of producing printed circuit boards; electrical insulating materialsinsulating coating materials for use in the process of producing display panels; electrical insulating materialsinsulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materialsinsulating coating materials for use in the process of producing package application boards; electrical insulating materialsinsulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillerselectrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic components; electrical insulating materialsinsulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics
Publications
History of USPTO decisions and trademark events.
33 publications found
FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
10/10/2022
FICS
FINAL DISPOSITION NOTICE SENT TO IB
09/15/2022
FIMP
FINAL DISPOSITION PROCESSED
09/15/2022
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
08/31/2022
ADCH
CHANGE OF NAME/ADDRESS REC'D FROM IB
07/09/2022
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
05/31/2022
R.PR
REGISTERED-PRINCIPAL REGISTER
05/31/2022
GPNX
NOTIFICATION PROCESSED BY IB
03/21/2022
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
03/15/2022
PUBO
PUBLISHED FOR OPPOSITION
03/15/2022
OPNS
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
02/23/2022
OP2R
NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB
02/23/2022
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
02/23/2022
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
02/14/2022
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
02/14/2022
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
02/14/2022
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
02/09/2022
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
02/09/2022
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
02/09/2022
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
02/09/2022
RFNT
REFUSAL PROCESSED BY IB
11/05/2021
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
10/12/2021
RFRR
REFUSAL PROCESSED BY MPU
10/12/2021
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
09/25/2021
CNRT
NON-FINAL ACTION WRITTEN
09/24/2021
DOCK
ASSIGNED TO EXAMINER
09/16/2021
CORR
CORRECTION FROM IB ENTERED - NO REVIEW REQUIRED
08/05/2021
CRCV
CORRECTION TRANSACTION RECEIVED FROM IB
07/31/2021
MAFR
APPLICATION FILING RECEIPT MAILED
07/06/2021
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
06/30/2021
LIMI
LIMITATION FROM ORIGINAL APPLICATION ENTERED
06/28/2021
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
06/24/2021
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