REM3
COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED
07/07/2025
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Official data from USPTO
3.5 D
Did you know this trademark is already registered in United States?
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Active USPTO registrationType: WordOffice: United States
Quick snapshot
3.5 D
ST13
US500000079251467Class
6, 7, 40, 42
Filing
79251467
Registration
6092940
Risk and opportunity diagnosis
Executive reading for naming, filing, and monitoring decisions.
USPTO status
Active USPTO registration
Case type
Application and registration
Recorded events
31
Latest update
07/08/2025
Trademark type
Word
Nice classes
6, 7, 40, 42
Filing date
08/30/2018
Registration date
07/07/2020
Expiration date
-
Complete case details
Structured fields from the responsible authority and the official record.
Status date
07/07/2020
Last transaction
07/08/2025
Responsible office
United States Patent and Trademark Office
Status code
700
Official register
Principal Register
Drawing code
4
Owner type
99
Owner location
14641 Nauen, DE
Examiner
NADELMAN, ANDREA
Law office
M10
Current location
PUBLICATION AND ISSUE SECTION
Holders and representatives
Holders
Pac Tech - Packaging Technologies GmbH
Representatives
Cynthia A. Moyer Fredrikson & Byron, P.A.
Technical classification
Nice Classes
Class 6Class 7Class 40Class 42
Vienna Codes
No Vienna codes available.
Goods and services
Class 6
Common metals and their alloysunwrought or semi-wrought; transportable buildings of metal; non-electric cables and wires of common metal; metal containers for storage and transport; contact metallizations for micro joints of soldering in the nature of solder pastessoft solder filmsfoilsfluids and powder
Class 7
Machinesmachine tools and power tools for manufacturing of multifunctional-microelectromechanical and microoptoelectromechanical systems for the manufacture of transponders and semiconductor wafers and integrated circuits affixed thereto; bonding machines and bonding machine tools for assembly of electricalmechanical and optical components for the manufacture of transponderssensors and semiconductor wafersintegrated circuits affixed thereto; machinesmachine tools and power tools in the field of microperipheric technologiesautogenous soldering machineselectric welding machinesgas welding machineselectric brazing machinessintering machines for chemical processingall for manufacturing micro and non-scale structures by the transformation of solderweldingbrazingadhesive-bonding or sintering materials; machinesmachine tools and power tools for applying connecting materials in form of pre-formspastesfilmsfoilsfluids or powder onto substrates by using chemicalelectro-chemical and physical deposition techniquesmachinery for applying coatings ultrasonically to medical and industrial apparatus; machinesmachine tools and power tools for manufacturing microconnectionsby chemical or physical depositionmechanical-thermal- or optical transformation; machines for electricaloptical and mechanical bonding to build up substrate units composed of one substrate or several substrates combined together to form a modulein particular chips; motors and enginesother than for land vehicles; machine couplings and transmission componentsother than for land vehicles; devices in relation to micro-peripheral technologiesmachines for manufacture and processing of semi-conductors; apparatuselectrostatic coating machines for applying connecting materials onto substratesby using chemicalelectro-chemical and physical depositiondispenseplacement and mechanical-thermal- and optical transformation for manufacturing microconnectionsin particular for building up substrate units composed of one substrate or several substrates combined together to form a modulein particular chips
Class 40
Treatment of materials by thermaloptical and mechanical interaction in relation to substrates used in the field of microelectronicsin particular semiconductor substrates and flexible substratesoptical radiationlaser radiation
Class 42
Industrial analysis of goods or services of others to assure compliance with industry standards and scientific research services; design and development of computer hardware and software; product development in the field of contact pad metallizations for connection technology; development of new technology for others in the field of the manufacture of microconnections; technological consultancyin the technology field of the manufacture of microconnections
Publications
History of USPTO decisions and trademark events.
31 publications found
NREP
NEW REPRESENTATIVE AT IB RECEIVED
05/30/2025
NREP
NEW REPRESENTATIVE AT IB RECEIVED
10/09/2021
FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
01/09/2021
FICS
FINAL DISPOSITION NOTICE SENT TO IB
10/30/2020
FIMP
FINAL DISPOSITION PROCESSED
10/30/2020
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
10/07/2020
R.PR
REGISTERED-PRINCIPAL REGISTER
07/07/2020
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
04/21/2020
PUBO
PUBLISHED FOR OPPOSITION
04/21/2020
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
04/01/2020
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
03/13/2020
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
03/10/2020
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
03/09/2020
ERFR
TEAS REQUEST FOR RECONSIDERATION RECEIVED
03/09/2020
GNFN
NOTIFICATION OF FINAL REFUSAL EMAILED
09/16/2019
GNFR
FINAL REFUSAL E-MAILED
09/16/2019
CNFR
FINAL REFUSAL WRITTEN
09/16/2019
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
08/27/2019
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
08/27/2019
ALIE
ASSIGNED TO LIE
08/27/2019
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
08/20/2019
RFNT
REFUSAL PROCESSED BY IB
03/16/2019
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
02/23/2019
RFRR
REFUSAL PROCESSED BY MPU
02/23/2019
MAFR
APPLICATION FILING RECEIPT MAILED
02/16/2019
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
02/15/2019
CNRT
NON-FINAL ACTION WRITTEN
02/14/2019
DOCK
ASSIGNED TO EXAMINER
02/12/2019
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
02/12/2019
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
02/07/2019
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