NAS8
NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED
06/14/2024
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Official data from USPTO
KS
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Active USPTO registrationType: CombinedOffice: United States
Quick snapshot
ST13
US500000076328762Class
7, 8, 9, 35, 37, 40, 41, 42
Filing
76328762
Registration
2788019
Risk and opportunity diagnosis
Executive reading for naming, filing, and monitoring decisions.
USPTO status
Active USPTO registration
Case type
Application and registration
Recorded events
41
Latest update
06/14/2024
Trademark type
Combined
Nice classes
7, 8, 9, 35, 37, 40, 41, 42
Filing date
10/24/2001
Registration date
12/02/2003
Expiration date
-
Complete case details
Structured fields from the responsible authority and the official record.
Status date
06/14/2024
Last transaction
06/14/2024
Responsible office
United States Patent and Trademark Office
Status code
800
Official register
Principal Register
First use anywhere
2000-05-00
First use in commerce
2000-05-00
Drawing code
5
Owner type
03
Owner location
FORT WASHINGTON, PA, US
Examiner
KAZAZIAN, MICHAEL H
Holders and representatives
Holders
KULICKE AND SOFFA INDUSTRIES, INC.
Kulicke & Soffa Investments, Inc.
Representatives
Christopher M. Spletzer, Sr.
Technical classification
Nice Classes
Class 7Class 8Class 9Class 35Class 37Class 40Class 41Class 42
Vienna Codes
No Vienna codes available.
Goods and services
Class 7
Dicing bladespower-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipmentsemiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; solder ball placement equipmentsemiconductor assembly equipment used to place solder balls onto substrate material; wafer bumping equipmentsemiconductor assembly equipment for bonding stud bumps onto a silicon wafer; and wafer preparation equipmentsemiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame
Class 8
Hand-operated wire bonding equipmentnamely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductorsnamely die colletscapillaries and wedge bonders
Class 9
Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materialssubstrates with copper inlaypolymer materialswire encapsulants applied over wire bonds to lock individual wires in place prior to moldingbonding wires; bonder softwaresoftware used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; dicing equipmentelectrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; factory automation softwaresoftware designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; wafer test productssemiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test productselectrical sockets and contactors for testing the electrical functionality of a completed integrated circuit package; and electrical circuit substrates
Class 35
Providing on-line electronic commerce serviceson-line catalog for selectionordering and payment of products and servicesautomatic wire bonding equipmenttools and materialsbonder softwaredie attachment equipmentdicing equipment and bladesfactory automation products and serviceselectrical circuit substratesmanual wire bonding equipmentsolder ball placement equipmentwafer bumping equipmentwafer bumping serviceswafer preparation equipmentwafer test products and package test productson-line customer support services relating theretoon-line supplyon-line logistics and supporton-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times
Class 37
Maintenance and refurbishment of equipment used in back-end assembly of semiconductorsintegrated circuit ball bonderswedge bondersmanual wire bondersautomated dicing equipmentribbon bondersstud bumperswafer preparation equipmenttesting equipment and ball attachment equipment; on-line consulting and advisory services for said equipment maintenance and refurbishment
Class 40
Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors; assembly services for othersprototype building of mechanical components and printed circuit boards; and wafer bumping services for otherssemiconductor assembly services for placement of solder balls onto individual integrated electrical circuits
Class 41
Customer training in the use of equipment for back-end assembly of semiconductors; on-line consulting and advisory services for said training
Class 42
Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application supportdesign of new bonding capillaries based on customer-specific capillary configurations; on-line design for others in the field of semiconductor packaging assemblysemiconductor packaging product design application support for the developmenttesting and assembly of new electrical circuitsall in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined informationwhich includes search engines and on-line web links to other web sites; design and fabrication services for othersdesign and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digitalanalog and mix signal circuit boards; technical support services rendered in personvia telephone and via global computer network relating to the use of equipment used for the back-end assembly of semiconductors and installation of spare parts therefor
Publications
History of USPTO decisions and trademark events.
41 publications found
RNL2
REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS)
06/14/2024
9G8P
REGISTERED - SEC. 9 GRANTED/CHECK RECORD FOR SEC. 8
06/14/2024
8PRT
REGISTERED - PARTIAL SEC. 8 (10-YR) ACCEPTED
06/14/2024
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
06/14/2024
E89R
TEAS SECTION 8 & 9 RECEIVED
03/13/2024
REM2
COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
12/02/2022
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
01/29/2018
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
01/29/2018
NA89
NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
06/17/2014
RNL1
REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
06/17/2014
89AG
REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
06/17/2014
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
06/17/2014
E89R
TEAS SECTION 8 & 9 RECEIVED
05/30/2014
C15A
REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
01/04/2010
ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
12/16/2009
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
12/11/2009
ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
12/09/2009
E815
TEAS SECTION 8 & 15 RECEIVED
12/02/2009
FAXX
FAX RECEIVED
12/02/2009
EXPT
EXPARTE APPEAL TERMINATED
12/03/2003
R.PR
REGISTERED-PRINCIPAL REGISTER
12/02/2003
PUBO
PUBLISHED FOR OPPOSITION
09/09/2003
NPUB
NOTICE OF PUBLICATION
08/20/2003
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
06/30/2003
CFIT
CASE FILE IN TICRS
05/21/2003
CFIT
CASE FILE IN TICRS
05/20/2003
JURT
JURISDICTION RESTORED TO EXAMINING ATTORNEY
05/13/2003
EXPI
EX PARTE APPEAL-INSTITUTED
04/29/2003
EXAF
EXPARTE APPEAL RECEIVED AT TTAB
04/25/2003
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
04/11/2003
PAPER RECEIVED
04/11/2003
CNFR
FINAL REFUSAL MAILED
10/10/2002
DOCK
ASSIGNED TO EXAMINER
10/09/2002
DOCK
ASSIGNED TO EXAMINER
09/27/2002
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
08/26/2002
PAPER RECEIVED
08/26/2002
CNRT
NON-FINAL ACTION MAILED
02/25/2002
DOCK
ASSIGNED TO EXAMINER
02/22/2002
AMPX
PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED
12/14/2001
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
12/14/2001
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