NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
01/04/2025
Voltar para busca
Dado oficial do USPTO
STATSCHIPPAC
Sabia que essa marca já está registrada no Estados Unidos?
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Active USPTO registrationTipo: MistaEscritório: US
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
24
Atualização mais recente
23/07/2026
Classificação
Registrada
Tipo de marca
Mista
Classes Nice
40, 42
Data de depósito
11/04/2024
Data de registro
01/04/2025
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
01/04/2025
Última transação
23/07/2026
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Fundamento do pedido
Intent to use
Primeiro uso
06/05/2024
Primeiro uso no comércio
06/05/2024
Código do desenho
5
Tipo de titular
99
Localização do titular
Singapore, SG
Examinador
DELANEY, ZHALEH SYBIL
Unidade examinadora
M70
Localização atual
FILE REPOSITORY (FRANCONIA)
Descrição da marca
The mark consists of the stylized wording STATSChipPAC.
Titulares e representantes
Titulares
Stats Chippac Pte. Ltd.
Representantes
Audra Kemp Neal & McDevitt, LLC
Classificação técnica
Classes Nice
Classe 40Classe 42
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 40
Custom assembly and custom manufacture of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packagingintegrated circuit chips or devices for others; providing technical information in the field of product manufacturing of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packagingintegrated circuit chips or devicestechnical consulting and manufacturing process consulting related thereto
Classe 42
Software engineering services; engineering and testing services in the field of assemblypackagingencasingdesign of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devicesfor others; engineering consulting services relating to testingassemblypackaging encasing analysiswafer probewafer sortdesign of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devices; providing facilities featuring equipment for others for testing electrical and electronic componentselectrical semi-conductorssemi-conductor chips or devices for quality control purposes and for scientific research purposes; development and establishment of testing specifications and proceduresincluding wafer sorting proceduresall for the purpose of testing of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devices; final product quality testing services in the field of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devices; packaging design services for others in the field of packaging for electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit chips or devices; product research and development services relating to electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devices; providing scientific and technical information in the field of product designproduct developmentproduct engineeringproduct testing of electrical and electronic componentselectrical semi-conductorssemi-conductor chips or deviceselectrical integrated circuitsintegrated circuit packaging and integrated circuit chips or devicesadvice and consultation relating thereto
Publicações
Histórico de despachos e eventos da marca no USPTO.
24 publicações encontradas
R.PR
REGISTERED-PRINCIPAL REGISTER
01/04/2025
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
11/02/2025
PUBO
PUBLISHED FOR OPPOSITION
11/02/2025
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
05/02/2025
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
16/01/2025
IUAA
USE AMENDMENT ACCEPTED
16/01/2025
XAEC
EXAMINER'S AMENDMENT ENTERED
16/01/2025
GNEN
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
16/01/2025
GNEA
EXAMINERS AMENDMENT E-MAILED
16/01/2025
CNEA
EXAMINERS AMENDMENT -WRITTEN
16/01/2025
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
18/12/2024
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
18/12/2024
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
18/12/2024
ATRV
ATTORNEY REVIEW COMPLETED
08/11/2024
AUPC
AMENDMENT TO USE PROCESSING COMPLETE
28/10/2024
IUAF
USE AMENDMENT FILED
28/10/2024
EAAU
TEAS AMENDMENT OF USE RECEIVED
28/10/2024
GPRN
NOTIFICATION OF PRIORITY ACTION E-MAILED
25/10/2024
GPRA
PRIORITY ACTION E-MAILED
25/10/2024
CPRA
PRIORITY ACTION WRITTEN
25/10/2024
DOCK
ASSIGNED TO EXAMINER
24/10/2024
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
23/09/2024
NWAP
NEW APPLICATION ENTERED
11/04/2024
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