NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
09/07/2024
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Dado oficial do USPTO
NANOMETRICS
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Active USPTO registrationTipo: VerbalEscritório: US
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NANOMETRICS
ST13
US500000097308047Classe
7, 9, 42
Pedido
97308047
Registro
7444130
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
26
Atualização mais recente
09/07/2024
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
7, 9, 42
Data de depósito
11/03/2022
Data de registro
09/07/2024
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
09/07/2024
Última transação
09/07/2024
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Fundamento do pedido
Intent to use
Primeiro uso
01/09/2023
Primeiro uso no comércio
01/09/2023
Código do desenho
4
Tipo de titular
03
Localização do titular
Wilmington, MA, US
Examinador
ALTREE, NICHOLAS
Unidade examinadora
L70
Localização atual
PUBLICATION AND ISSUE SECTION
Titulares e representantes
Titulares
Onto Innovation Inc.
Representantes
Heather J. Kliebenstein MERCHANT & GOULD P.C.
Classificação técnica
Classes Nice
Classe 7Classe 9Classe 42
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 7
Lithography machines for the manufacture of microelectronicsintegrated circuitslight emitting diodessemiconductors on laminar substrates including wafersglass panelspackaging panels such as copper plate or plastic; Optical metrologycharacterizationinspection systems comprised of a machinecomponents and operating software therefor sold as a unit for use in the production of laminar substrates including discrete electronic componentssemiconductors including non-volatile and volatile memory devicesfoundry and logic devicesasic devicescmos image sensorsmicroelectromechanical systemslight emitting diodesother micro and nano technology devicessystem in packageheterogeneous packagingother advanced packaging electronics technologies; optical metrologycharacterizationinspection systems comprised of machinecomponents and operating software therefor sold as a unit for use in the production of precision machined optical surfacesoptical coatingsoptical assemblies including reference flatsphereasphere and assemblies composed of both refractive and reflective components
Classe 9
Optical metrologycharacterizationinspection systems comprised of machinecomponents and operating software therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical componentssurface roughness of opticsmetalssemiconductorsceramicsplasticspaints and other finely finished materialsdefects and geometries of parts in aerospaceautomotivepower generationsemiconductordata storagebearingsadditive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical componentssurface roughness of opticsmetalssemiconductorsceramicsplasticspaints and other finely finished materialsdefects and geometries of parts in aerospaceautomotivepower generationsemiconductordata storagebearingsadditive manufacturing and other precision-machined components; downloadable softwareprocess control and defect analysis software for use in the production of laminar substrates including discrete electronic componentssemiconductors including non-volatile and volatile memory devicesfoundry and logic devicesasic devicescmos image sensorsmicroelectromechanical systemslight emitting diodesother micro and nano technology devicessystem in packageheterogeneous packagingother advanced packaging electronics technologies; downloadable software for the semiconductor industrydownloadable software for identifying defects in semiconductor structuresdownloadable software for identifying semiconductor fabrication process excursionsdownloadable software for recording and reviewing defects in semiconductors structuresdownloadable software for identifying root causes of defects in semiconductor structuresdownloadable software for controlling and monitoring semiconductor fabrication equipment; metrology inspection equipment for use in the manufacturinginspectiontesting and repair of semiconductor substrates; metrology inspection equipment and devicesinstruments and devices that sense and capture images of semiconductor componentssemiconductor waferssemiconductor diepackaged integrated circuitsprinted circuit boardsliquid crystal displayselectronic displaysdisk storage mediainspect these images for defectscoordinate or position determinationidentificationpresence or absence of a featurecharacteristic or substance thereon; metrology inspection systems comprised of one or more light sourcesone or more cameras and/or sensors in communication with embedded computer software and hardware used for the measurement of thicknessadhesion propertiesstructural properties of semiconductor materials and for monitoring the performance of semiconductor fabrication processes; optical inspection equipment for 2D and 3D inspection of semiconductor materials; metrology instruments for metrology purposesapparatus for measuring physical dimensions of samples and thicknesses of deposited films or for analyzing chemical composition of materialsconsisting of optical microscopeelectron microscopespectrophotometerellipsometer and scanning slit densitometers
Classe 42
Providing temporary use on onlinenon-downloadable process control and defect analysis software for use in the production of laminar substrates including discrete electronic componentssemiconductors including non-volatile and volatile memory devicesfoundry and logic devicesasic devicescmos image sensorsmicroelectromechanical systemslight emitting diodesother micro and nano technology devicessystem in packageheterogenous packagingother advanced packaging electronics technologies; providing online non-downloadable software for the semiconductor industryonline non-downloadable software for identifying defects in semiconductor structuresonline non-downloadable software for identifying semiconductor fabrication process excursionsonline non-downloadable software for recording and reviewing defects in semiconductors structuresonline non-downloadable software for identifying root causes of defects in semiconductor structuresonline non-downloadable software for controlling and monitoring semiconductor fabrication equipment
Publicações
Histórico de despachos e eventos da marca no USPTO.
26 publicações encontradas
R.PR
REGISTERED-PRINCIPAL REGISTER
09/07/2024
SUNA
NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
31/05/2024
CNPR
ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
31/05/2024
SUPC
STATEMENT OF USE PROCESSING COMPLETE
29/05/2024
AITU
CASE ASSIGNED TO INTENT TO USE PARALEGAL
28/05/2024
IUAF
USE AMENDMENT FILED
30/04/2024
EISU
TEAS STATEMENT OF USE RECEIVED
30/04/2024
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
02/12/2023
EX1G
SOU EXTENSION 1 GRANTED
30/11/2023
EXT1
SOU EXTENSION 1 FILED
30/11/2023
EEXT
SOU TEAS EXTENSION RECEIVED
30/11/2023
NOAM
NOA E-MAILED - SOU REQUIRED FROM APPLICANT
30/05/2023
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
04/04/2023
PUBO
PUBLISHED FOR OPPOSITION
04/04/2023
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
15/03/2023
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
01/03/2023
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
01/03/2023
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
28/02/2023
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
28/02/2023
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
30/08/2022
GNRT
NON-FINAL ACTION E-MAILED
30/08/2022
CNRT
NON-FINAL ACTION WRITTEN
30/08/2022
DOCK
ASSIGNED TO EXAMINER
02/05/2022
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
16/03/2022
NWAP
NEW APPLICATION ENTERED
15/03/2022
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