R.PR
REGISTERED-PRINCIPAL REGISTER
09/05/2023
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Dado oficial do USPTO
CDNA
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Active USPTO registrationTipo: VerbalEscritório: US
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
32
Atualização mais recente
09/05/2023
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
9
Data de depósito
22/09/2020
Data de registro
09/05/2023
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
09/05/2023
Última transação
09/05/2023
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Fundamento do pedido
Intent to use
Primeiro uso
10/08/2020
Primeiro uso no comércio
30/11/2020
Código do desenho
4
Tipo de titular
03
Localização do titular
Santa Clara, CA
Examinador
DELGIZZI, RONALD ERNEST
Unidade examinadora
L70
Localização atual
PUBLICATION AND ISSUE SECTION
Titulares e representantes
Titulares
Advanced Micro Devices, Inc.
Representantes
Belinda J. Scrimenti Wilkinson Barker Knauer, LLP
Classificação técnica
Classes Nice
Classe 9
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 9
Integrated circuitsgraphics integrated circuits; integrated circuit chip sets; cards containing integrated circuits; integrated circuit chips; semiconductor devices; semiconductor chips; semiconductors; chipsets; computer hardware; microprocessors; microprocessor subsystems comprised of one or more microprocessorscentral processing unit (CPU)CPU coresdownloadable and recorded software for operating the foregoing; computer hardware subsystems comprised of microprocessor subsystems; microprocessor modules; system-on-a-chip (SOC) processors; system-on-a-chip (SoC) architecture for use with central processing units (CPU) and graphics processing units (GPU)system-on-a-chip (SoC) architecture that connects die-to-diechip-to-chipsocket-to-socketused across different microprocessors for enabling increased computing performance; system-on-a-chip (SoC) architecture for use with multiple graphics processing units (GPU)system-on-a-chip (SoC) architecture that connects die-to-diechip-to-chipsocket-to-socketused across multiple different microprocessorsoptimized for machine learning and high-performance computing applicationsto enhance GPU to GPU connectivityto enable increased computing performanceto accelerate data center computer workloadsto enable exascale-class supercomputers; network-on-a-chipmicroprocessor hardware technology for use in scaling for high performance computing (HPC) and machine learning (ML) that provides for computer network interfaces across microprocessor central processor unit (CPU) and graphics processing unit (GPU) corescomputer memoryhubs and data fabric for enabling microprocessor communications and increasing computing performance and efficiency; microprocessor communication fabricdata communication interconnect architecture responsible for collecting datacommand control interconnect architecture responsible for data sensor telemetry; data fabrichardware and downloadable and recorded software that supports storageprocessinganalysis and management of disparate data; graphics processors units (GPUs); graphics processing units (GPU); GPU cores; graphics cards; accelerated data processors; computer accelerator board; graphics accelerators; graphics processor subsystemmicroprocessor subsystems comprised of one or more microprocessorsgraphics processing units (GPUs)GPU coresdownloadable and recorded software for operating the foregoing; supercomputers; computer servers; network servers; computer workstationscomputers designed for advanced technical or scientific applications and high performance computing applications; digital media streaming devices; solid state drives; computer memory devicesvolatile memory devices; dynamic random-access memory (DRAM); dynamic random access memory (DRAM) controllers; downloadable and recorded software for operating all of the foregoing; downloadable and recorded computer software for operating computer and graphics processors
Publicações
Histórico de despachos e eventos da marca no USPTO.
32 publicações encontradas
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
09/05/2023
SUNA
NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
01/04/2023
CNPR
ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
31/03/2023
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
11/03/2023
SUPC
STATEMENT OF USE PROCESSING COMPLETE
10/03/2023
EX2G
SOU EXTENSION 2 GRANTED
10/03/2023
AITU
CASE ASSIGNED TO INTENT TO USE PARALEGAL
10/03/2023
IUAF
USE AMENDMENT FILED
27/02/2023
EXT2
SOU EXTENSION 2 FILED
27/02/2023
EEXT
SOU TEAS EXTENSION RECEIVED
27/02/2023
EISU
TEAS STATEMENT OF USE RECEIVED
27/02/2023
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
31/08/2022
EX1G
SOU EXTENSION 1 GRANTED
29/08/2022
EXT1
SOU EXTENSION 1 FILED
29/08/2022
EEXT
SOU TEAS EXTENSION RECEIVED
29/08/2022
NOAM
NOA E-MAILED - SOU REQUIRED FROM APPLICANT
01/03/2022
ETOP
EXTENSION OF TIME TO OPPOSE PROCESS - TERMINATED
16/01/2022
ETOF
EXTENSION OF TIME TO OPPOSE RECEIVED
07/10/2021
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
07/09/2021
PUBO
PUBLISHED FOR OPPOSITION
07/09/2021
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
18/08/2021
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
03/08/2021
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
14/07/2021
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
13/07/2021
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
13/07/2021
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
13/01/2021
GNRT
NON-FINAL ACTION E-MAILED
13/01/2021
CNRT
NON-FINAL ACTION WRITTEN
13/01/2021
DOCK
ASSIGNED TO EXAMINER
09/01/2021
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
01/11/2020
NWAP
NEW APPLICATION ENTERED
25/09/2020
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