ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
18/10/2023
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Dado oficial do USPTO
CMC MATERIALS
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Active USPTO registrationTipo: VerbalEscritório: US
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CMC MATERIALS
ST13
US500000088698404Classe
1, 3, 4, 7
Pedido
88698404
Registro
6667318
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
47
Atualização mais recente
18/10/2023
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
1, 3, 4, 7
Data de depósito
19/11/2019
Data de registro
08/03/2022
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
08/03/2022
Última transação
19/08/2023
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Fundamento do pedido
Intent to use
Primeiro uso
24/05/2021
Primeiro uso no comércio
24/05/2021
Código do desenho
4
Tipo de titular
16
Localização do titular
WILMINGTON, DE, US
Examinador
CLARK, ROBERT C
Unidade examinadora
L10
Localização atual
PUBLICATION AND ISSUE SECTION
Titulares e representantes
Titulares
CMC MATERIALS LLC
CMC MATERIALS, INC.
C. C. (pessoa física)
Representantes
Cynthia Johnson Walden Fish & Richardson P.C.
Classificação técnica
Classes Nice
Classe 1Classe 3Classe 4Classe 7
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 1
Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductorssilicon wafersglassmetalsplasticsmachineryelectronic components and substratesoptical componentscomputer partsmagnetic data-storage disks and heads for use in the semiconductorelectronicrigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarizesmoothotherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarizesmooth or otherwise modify their mechanicalphysicalchemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductorsphotoresist stripperbenzotriazole (BTA) and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additivesabrasive dispersions for use in the manufacture of electronic components and substratesoptical componentsmetalsmachinerycomputer partsmagnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturingsolar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductorsintegrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and sciencefor use in the semiconductor and micro-electronics industries; Chemicalspolymer-containing drag reducers and flow improvers to increase flow of hydrocarbons through pipelines; Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
Classe 3
Industrial abrasivesabrasive compounds for lapping and polishing semiconductorssilicon wafersglass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparationschemical cleanersabrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substratesoptical componentsglassmetalsplasticsmachinerycomputer partsmagnetic data-storage disks and heads
Classe 4
Industrial lubricantsvalve lubricants for the oil and gas storagepipeline and gas distribution markets; Industrial lubricants and greases
Classe 7
Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafersintegrated circuitshard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafersintegrated circuitshard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
Publicações
Histórico de despachos e eventos da marca no USPTO.
47 publicações encontradas
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
09/08/2023
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
09/08/2023
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
09/08/2023
CHAN
APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
09/08/2023
COAR
TEAS CHANGE OF OWNER ADDRESS RECEIVED
09/08/2023
R.PR
REGISTERED-PRINCIPAL REGISTER
08/03/2022
SUNA
NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
02/02/2022
CNPR
ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
01/02/2022
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
01/02/2022
SUPC
STATEMENT OF USE PROCESSING COMPLETE
31/01/2022
EX3G
SOU EXTENSION 3 GRANTED
31/01/2022
AITU
CASE ASSIGNED TO INTENT TO USE PARALEGAL
31/01/2022
IUAF
USE AMENDMENT FILED
21/01/2022
EXT3
SOU EXTENSION 3 FILED
21/01/2022
EEXT
SOU TEAS EXTENSION RECEIVED
21/01/2022
EISU
TEAS STATEMENT OF USE RECEIVED
21/01/2022
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
23/07/2021
EX2G
SOU EXTENSION 2 GRANTED
21/07/2021
EXT2
SOU EXTENSION 2 FILED
21/07/2021
EEXT
SOU TEAS EXTENSION RECEIVED
21/07/2021
ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
12/05/2021
PCGR
PETITION TO DIRECTOR GRANTED
13/04/2021
APET
ASSIGNED TO PETITION STAFF
13/04/2021
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
14/01/2021
EX1G
SOU EXTENSION 1 GRANTED
12/01/2021
EXT1
SOU EXTENSION 1 FILED
12/01/2021
EEXT
SOU TEAS EXTENSION RECEIVED
12/01/2021
TPDR
TEAS PETITION TO DIRECTOR RECEIVED
12/01/2021
NOAM
NOA E-MAILED - SOU REQUIRED FROM APPLICANT
21/07/2020
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
26/05/2020
PUBO
PUBLISHED FOR OPPOSITION
26/05/2020
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
06/05/2020
ALIE
ASSIGNED TO LIE
22/04/2020
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
14/04/2020
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
13/04/2020
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
13/04/2020
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
13/04/2020
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
25/02/2020
GNRT
NON-FINAL ACTION E-MAILED
25/02/2020
CNRT
NON-FINAL ACTION WRITTEN
25/02/2020
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
24/02/2020
GNRT
NON-FINAL ACTION E-MAILED
24/02/2020
CNRT
NON-FINAL ACTION WRITTEN
24/02/2020
DOCK
ASSIGNED TO EXAMINER
24/02/2020
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
26/11/2019
NWAP
NEW APPLICATION ENTERED
22/11/2019
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