TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
12/01/2026
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Dado oficial do USPTO
LAIRD
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Active USPTO registrationTipo: MistaEscritório: US
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
26
Atualização mais recente
14/01/2026
Classificação
Registrada
Tipo de marca
Mista
Classes Nice
17
Data de depósito
25/05/2017
Data de registro
10/07/2018
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
29/04/2025
Última transação
14/01/2026
Escritório responsável
United States Patent and Trademark Office
Código da situação
702
Cadastro oficial
Principal Register
Fundamento do pedido
Intent to use
Primeiro uso
04/05/2018
Primeiro uso no comércio
04/05/2018
Código do desenho
3
Tipo de titular
03
Localização do titular
Chesterfield, MO
Examinador
SOBRAL,CHRISTINA
Localização atual
Historical data usage
Descrição da marca
The mark consists of the word "LAIRD" and a ring design.
Titulares e representantes
Titulares
Laird Technologies, Inc.
Laird Technologies, Inc.
Representantes
Joseph E. Walsh, Jr. HARNESS, DICKEY & PIERCE, P.L.C.
Classificação técnica
Classes Nice
Classe 17
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 17
Microwave absorberspastespadsgelsmolded / extruded shapescomprised of foamselastomerspolymers loaded with magnetic particles; Conducting and protective interlayer conductive materials and coatings for use in integrated circuitssemiconductor devicescomputer disk drives and other computer hardware; conductive contactsfabric over foam contactsfoil over foam contactsspring contactssurface mount device contactsfor providing an electrical connection between two surfaces in electronic devices; Insulating and protective interlayer dielectric materials and coatings for use in integrated circuitssemiconductor devicescomputer disk drives and other computer hardware; conductive foamsheetspadsstripsdie-cut shapesfor use in conducting heat and electricity; conductive tape for electromagnetic radiation shielding in electronic products; decorative electromagnetic interference (EMI) shielding metalsconductive metal sheets having a decorative finish thereonfor EMI shielding in electronics; structural EMI shielding metalsin the form of metal board level shields; EMI shielding wire mesh and knitted wirein the form of gaskets; Electromagnetic interference (EMI) shielding productsEMI shielding contactsEMI spring contactsEMI shielding user interface shields and EMI combination shieldsEMI board level shielding and customer designed EMI shielding; electromagnetic interference shielding gasketsfabric over foam gasketsfoil over foam gasketsfingerstocks; conductive elastomerssynthetic elastomers in the form of padsas moldeddie cut or extruded shapesfor use as components in electronics; form-in-place non-metal gaskets for electronic devices; vent panelsmetal plated rigid structures that provide EMI shielding and permit air flow to electronic components; thermal interface materials and phase change thermal interface materialslow thermal resistance interface padstapessheetsfilmscoatings for use as heat transfer interfaces between electronic components and thermal dissipation members; thermal gap filler pad thermal interface materialsthermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materialslow thermal resistance interface padstapessheetsfilmscoatings for use as heat transfer interfaces between electronic components and thermal dissipation members; thermally conductive PCB (printed circuit board) materialsfilms and sheets made out of resins for use in manufacturing electronic circuit boards; thermally conductive thermoplasticssemiprocessed thermoplastics in moldedextrudedsheet form; conductive plastics and elastomersputtiesgreasespadssheets for use in the management of electromagnetic radiation and heat in electronic devices; absorbing plastics and elastomers for use in absorbing electromagnetic radiation in electronic devices
Publicações
Histórico de despachos e eventos da marca no USPTO.
26 publicações encontradas
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
12/01/2026
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
12/01/2026
NA85
NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
29/04/2025
C15A
REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
29/04/2025
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
28/04/2025
E815
TEAS SECTION 8 & 15 RECEIVED
10/01/2025
REM1
COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED
10/07/2023
R.PR
REGISTERED-PRINCIPAL REGISTER
10/07/2018
SUNA
NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
08/06/2018
CNPR
ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
07/06/2018
SUPC
STATEMENT OF USE PROCESSING COMPLETE
06/06/2018
AITU
CASE ASSIGNED TO INTENT TO USE PARALEGAL
06/06/2018
IUAF
USE AMENDMENT FILED
17/05/2018
EISU
TEAS STATEMENT OF USE RECEIVED
17/05/2018
CHAN
APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
19/02/2018
COAR
TEAS CHANGE OF OWNER ADDRESS RECEIVED
19/02/2018
NOAM
NOA E-MAILED - SOU REQUIRED FROM APPLICANT
21/11/2017
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
26/09/2017
PUBO
PUBLISHED FOR OPPOSITION
26/09/2017
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
06/09/2017
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
15/08/2017
DOCK
ASSIGNED TO EXAMINER
15/08/2017
MDSC
NOTICE OF DESIGN SEARCH CODE E-MAILED
02/06/2017
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
01/06/2017
NWAP
NEW APPLICATION ENTERED
29/05/2017
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