TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
12/01/2026
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Dado oficial do USPTO
LAIRD
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Active USPTO registrationTipo: VerbalEscritório: US
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
51
Atualização mais recente
14/01/2026
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
17
Data de depósito
01/04/2015
Data de registro
08/01/2019
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
06/11/2025
Última transação
14/01/2026
Escritório responsável
United States Patent and Trademark Office
Código da situação
702
Cadastro oficial
Principal Register
Fundamento do pedido
Intent to use
Primeiro uso
31/12/2003
Primeiro uso no comércio
31/12/2003
Código do desenho
4
Tipo de titular
03
Localização do titular
Chesterfield, MO
Examinador
YOUNG,CARRIE SKYE
Localização atual
Historical data usage
Titulares e representantes
Titulares
Laird Technologies, Inc.
Laird Technologies, Inc.
Representantes
Joseph E. Walsh, Jr. HARNESS, DICKEY & PIERCE, P.L.C.
Classificação técnica
Classes Nice
Classe 17
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 17
Microwave absorberspastespadsgelsmolded / extruded shapescomprised of foamselastomerspolymers loaded with magnetic particles; Conducting and protective interlayer conductive materials and coatings for use in integrated circuitssemiconductor devicescomputer disk drives and other computer hardware; Conductive contactsfabric over foam contactsfoil over foam contactsspring contactssurface mount device contactsfor providing an electrical connection between two surfaces in electronic devices; Insulating and protective interlayer dielectric materials and coatings for use in integrated circuitssemiconductor devicescomputer disk drives and other computer hardware; Conductive foamsheetspadsstripsdie-cut shapesfor use in conducting heat and electricity; Conductive tape for electromagnetic radiation shielding in electronic products; Decorative electromagnetic interference (EMI) shielding metalsconductive metal sheets having a decorative finish thereonfor EMI shielding in electronics; structural EMI shielding metalsin the form of metal board level shields; EMI shielding wire mesh and knitted wirein the form of gaskets; Electromagnetic interference (EMI) shielding productsEMI shielding contactsEMI spring contactsEMI shielding user interface shields and EMI combination shieldsEMI board level shielding and customer designed EMI shielding; Electromagnetic interference shielding gasketsfabric over foam gasketsfoil over film gasketsfingerstocks; conductive elastomerssynthetic elastomers in the form of padsas moldeddie cut or extruded shapesfor use as components in electronics; Form-in-place non-metal gaskets for electronic devices; Vent panelsmetal plated rigid structures that provide EMI shielding and permit air flow to electronic components ; Thermal interface materials and phase change thermal interface materialslow thermal resistance interface padstapessheetsfilmscoatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermal gap filler pad thermal interface materialsthermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materialslow thermal resistance interface padstapessheetsfilmscoatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermally conductive PCB (printed circuit board) materialsfilms and sheets made out of resins for use in manufacturing electronic circuit boards; Thermally conductive thermoplasticssemiprocessed thermoplastics in moldedextrudedsheet form; Conductive plastics and elastomersputtiesgreasespadssheets for use in the management of electromagnetic radiation and heat in electronic devices; absorbing plastics and elastomers for use in absorbing electromagnetic radiation in electronic devices
Publicações
Histórico de despachos e eventos da marca no USPTO.
51 publicações encontradas
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
12/01/2026
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
12/01/2026
NA85
NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
06/11/2025
C15A
REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
06/11/2025
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
04/11/2025
E815
TEAS SECTION 8 & 15 RECEIVED
08/07/2025
REM1
COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED
08/01/2024
R.PR
REGISTERED-PRINCIPAL REGISTER
08/01/2019
SUNA
NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
01/12/2018
CNPR
ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
30/11/2018
SUPC
STATEMENT OF USE PROCESSING COMPLETE
05/11/2018
AITU
CASE ASSIGNED TO INTENT TO USE PARALEGAL
05/11/2018
IUAF
USE AMENDMENT FILED
10/10/2018
EISU
TEAS STATEMENT OF USE RECEIVED
10/10/2018
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
13/04/2018
EX3G
SOU EXTENSION 3 GRANTED
11/04/2018
EXT3
SOU EXTENSION 3 FILED
11/04/2018
EEXT
SOU TEAS EXTENSION RECEIVED
11/04/2018
CHAN
APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
19/02/2018
COAR
TEAS CHANGE OF OWNER ADDRESS RECEIVED
19/02/2018
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
13/10/2017
EX2G
SOU EXTENSION 2 GRANTED
11/10/2017
EXT2
SOU EXTENSION 2 FILED
11/10/2017
EEXT
SOU TEAS EXTENSION RECEIVED
11/10/2017
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
11/10/2017
EXRA
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
14/04/2017
EX1G
SOU EXTENSION 1 GRANTED
11/04/2017
EXT1
SOU EXTENSION 1 FILED
11/04/2017
EEXT
SOU TEAS EXTENSION RECEIVED
11/04/2017
NOAM
NOA E-MAILED - SOU REQUIRED FROM APPLICANT
11/10/2016
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
16/08/2016
PUBO
PUBLISHED FOR OPPOSITION
16/08/2016
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
27/07/2016
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
08/07/2016
XAEC
EXAMINER'S AMENDMENT ENTERED
06/07/2016
GNEN
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
06/07/2016
GNEA
EXAMINERS AMENDMENT E-MAILED
06/07/2016
CNEA
EXAMINERS AMENDMENT -WRITTEN
06/07/2016
GNFN
NOTIFICATION OF FINAL REFUSAL EMAILED
07/01/2016
GNFR
FINAL REFUSAL E-MAILED
07/01/2016
CNFR
FINAL REFUSAL WRITTEN
07/01/2016
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
31/12/2015
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
30/12/2015
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
30/12/2015
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
07/07/2015
GNRT
NON-FINAL ACTION E-MAILED
07/07/2015
CNRT
NON-FINAL ACTION WRITTEN
07/07/2015
DOCK
ASSIGNED TO EXAMINER
29/06/2015
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
10/04/2015
NWAP
NEW APPLICATION ENTERED
04/04/2015
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