FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
14/07/2026
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Dado oficial do USPTO
CHOSHU
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Active USPTO registrationTipo: VerbalEscritório: US
Snapshot rápido
CHOSHU
ST13
US500000079418193Classe
7, 9, 11, 37, 40
Pedido
79418193
Registro
8208756
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
21
Atualização mais recente
14/07/2026
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
7, 9, 11, 37, 40
Data de depósito
24/12/2024
Data de registro
14/04/2026
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
14/04/2026
Última transação
14/07/2026
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Código do desenho
4
Tipo de titular
03
Localização do titular
JP
Examinador
LATTUCA, FRANK J
Unidade examinadora
L90
Localização atual
FILE REPOSITORY (FRANCONIA)
Titulares e representantes
Titulares
Choshu Industry Co., Ltd.
Representantes
M. Scott Alprin ALPRIN LAW OFFICES, P.C.
Classificação técnica
Classes Nice
Classe 7Classe 9Classe 11Classe 37Classe 40
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 7
Hydrogen production equipment namely electrolysis machines for generating hydrogen; chemical processing machines and apparatus; Hydrogen station equipmenthydrogen supplying machines for service stations; Fuel supply system comprised of fuel dispensing machinesfuel dispensing machines for vehicles and its components; AC electric motors and DC electric motors and their parts not including those for land; Alternators; direct current generators; Hydrogen-powered gas turbine generator; Hydrogen-based boiler power generation equipment namely generators; Semiconductor manufacturing equipmentwafer processing machinesphotolithography systems comprised of steppers and coater-developersetching machines for etching conductive filmsinsulating filmssemiconductor filmsoxide filmsnitride filmsion implantation machinesdeposition machines for depositing conductive filmsinsulating filmssemiconductor filmsdiffusion barrier filmscleaning machines for removing particlesorganic residuesmetal residueschemical residues from semiconductor waferschemical mechanical polishing machinessemiconductor testing machinestheir structural replacement parts; Organic light-emitting diode manufacturing equipmentsubstrate cleaning machineschemical vapor deposition systemsorganic material deposition equipment comprised of load lock chambersdegas chambersdeposition chambersmask alignment chamberspatterning machines for forming thin films including organic layerselectrode layersencapsulation layers into predetermined patternsetching machines for selectively removing unwanted portions of transparent electrodesmetal filmsinsulating filmsencapsulation machines for encapsulating light-emitting devices including organic layers and electrodesthin-film encapsulation systemsdeposition mask alignment equipment comprised of mask holding mechanismssubstrate stagesposition adjustment mechanismsdrive mechanismsoptical alignment sensorsgap control mechanismscontrol computersinspection and testing machines for inspecting and testing electrical characteristicsoptical characteristicsdimensional accuracypositional accuracyencapsulation integrity of organic light-emitting diode devicescontrol units for controlling operation of manufacturing equipmentprocess conditionsmaterial handlinginterlock functionsmonitoring functions in organic light-emitting diode manufacturing processes; Manufacturing equipment for organic electroluminescent display devicessubstrate handling robotsthin-film encapsulation equipment for forming encapsulation layers to protect organic electroluminescent materials from moisture and external environment during manufacturingmask alignment systemsorganic material deposition equipment for depositing organic thin-film materials including light-emitting layers and charge transport layers of organic electroluminescent devices on substratesinspection modules for inspecting film deposition quality including film thickness and uniformitypatterning accuracyelectrical characteristicsoptical characteristicstheir structural replacement parts; LCD panel manufacturing equipmentsubstrate cleaning machinesalignment machinesliquid crystal injection machinessealing machines for sealing liquid crystal materials between glass substrates with sealing materialsinspection machines for inspecting display defects including pixel defectsluminance non-uniformity and color non-uniformityelectrical characteristics including wiring disconnection and short circuitsthin film transistor on/off characteristicsdriving voltage and leakage currentappearance defects including scratchescontaminationforeign mattertheir structural replacement parts; Semiconductor thin film formation equipmentchemical vapor deposition machinesphysical vapor deposition machinesatomic layer deposition machinessputtering machinesepitaxial growth reactorstheir structural replacement parts; Vacuum thin film forming equipmentvacuum evaporation systems comprised of vacuum chamber unitsevacuation and vacuum system unitsevaporation source unitssubstrate holding and transfer unitspatterning and deposition control unitsfilm thickness and process control unitsmaterial supply and preheating and drying unitssputtering systems comprised of vacuum chamber unitsevacuation and vacuum system unitsgas introduction and pressure control unitsplasma generation and power supply unitstarget and cathode unitssubstrate stage and transfer unitsfilm thickness and process control unitsshielding unitsmolecular beam epitaxy chambersion plating apparatustheir structural replacement parts; Vacuum deposition equipmentvacuum coating machinesvacuum plating machinesion plating machinestheir structural replacement parts; Molecular launcher machines for thin film deposition in semiconductor manufacturing; Sputtering equipmentmagnetron sputtering machinesDC and RF sputtering systemsbatch and in-line sputter deposition machinestheir structural replacement parts; Ultrasonic cleaning equipmentultrasonic bath cleanersultrasonic spray cleaning systems comprised of cleaning chambersultrasonic oscillation unitsspray supply unitscleaning liquid supply and circulation unitswafer transfer and holding unitscleaning process control unitsdrying unitswaste liquid and exhaust unitstransducer-based cleaning systems comprised of cleaning tank unitstransducer unitsultrasonic oscillation unitscleaning liquid supply and circulation unitswafer transfer and holding unitscontrol unitsdrying unitswaste liquid and exhaust unitstheir structural replacement parts; Manufacturing equipment for electronic circuit boardsPCB etching machinessolder mask application systems comprised of board transfer and positioning unitssurface cleaning unitsresist supply unitscoating unitsfilm thickness and coating quality control unitsexposure unitsdeveloping unitsdrying unitscontrol unitsexhaust and waste liquid treatment unitsdrilling and routing machinespick-and-place machines for picking electronic components including chip resistorscapacitorsintegrated circuitstransistorsdiodesLEDssensor components and placing the picked electronic components onto predetermined mounting positions on circuit boardsreflow soldering ovenstheir structural replacement parts; Plasma etching equipmentdry etching machinesreactive ion etching machinesdeep reactive ion etching machinesplasma ashing systems comprised of plasma sourcesreaction chambersgas supply unitsexhaust unitstransfer unitstemperature control unitsprocess control and monitoring unitsstructural replacement parts thereforfor use in semiconductor manufacturing; Gate valves for vacuum deposition equipment used in semiconductor manufacturing; Semiconductor manufacturing equipmentjigs and fixtures for holding waferssubstratescomponents during processingassemblytestingtransport; Semiconductor manufacturing equipmentalignment fixtures for aligning wafers during semiconductor manufacturing processespolishing and dicing blades being machine parts for use in semiconductor wafer polishing and dicing machinescalibration tools and modules for calibrating semiconductor manufacturing equipment
Classe 9
Solar Cell; Solar panel for the production of electricity; photovoltaic modules; Photovoltaic installation apparatusphotovoltaic solar modules for production of electricitysolar thermal and electric receiverstracking mechanisms and concentrating opticscontrol algorithms; Fuel cells; accumulatorselectric; Electrical junction box for solar power generation equipment; Solar power generation inverter; Power line conditioner for solar power generation equipment; Power indicator for solar power generation equipment; organic light-emitting diodes; Organic light-emitting diode (OLED) display devicesOLED panelsOLED display modulestheir structural replacement parts; Electron gunselectron beam heating guns for use in electron beam evaporation for vacuum deposition
Classe 11
Chiller units for industrial equipment; Thin film deposition crucibles for industrial purposes; Vacuum drying equipmentvacuum ovensvacuum freeze dryersvacuum dryers; Solar cell-powered lighting fixtures
Classe 37
Repair or maintenance of hydrogen production equipment and its parts; Repair or maintenance of hydrogen station equipment and its parts; Repair or maintenance of fuel supply systems and parts thereof for passenger vehicles; repair or maintenance of AC motors and DC motors and their partsexcluding AC motors and DC motors for land vehicles and excluding their parts; Repair or maintenance of alternators and their parts; Repair or maintenance of DC generators and their parts; Repair or maintenance of hydrogen-based gas turbine power generation equipment and its parts; Repair or maintenance of biomass power generation equipment and its parts; Battery repair or maintenance; Installationrepair and maintenance of solar power generation equipment; Repair or maintenance of semiconductor manufacturing equipment and its parts; Repair or maintenance of LCD panel manufacturing equipment and its parts; Repair or maintenance of organic light-emitting diode manufacturing equipment and its parts; Repair or maintenance of manufacturing equipment for organic EL displays and their parts; Repair or maintenance of manufacturing equipment for electronic circuit boards and parts thereof; repair and maintenance of vacuum pumps
Classe 40
Recycling of used parts of manufacturing equipment for electronic devices; recycling processrecovery of valuable materials from semiconductor manufacturing equipment; recycling processrecovery of valuable materials from used solar cells; custom manufacture of semiconductor devices for others; Semiconductor wafer cutting and grinding servicesprecision wafer dicingback grindingthinningpolishing of semiconductor wafers; semiconductor wafer cleaningchemical cleaningplasma cleaningmega sonicultrasonic cleaning of semiconductor wafers; metal processing for vacuum equipment partsprecision machiningmillingturning machininggrindingpolishing of metal components used in vacuum equipment; metalworking
Publicações
Histórico de despachos e eventos da marca no USPTO.
21 publicações encontradas
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
14/04/2026
R.PR
REGISTERED-PRINCIPAL REGISTER
14/04/2026
CORN
CORRECTION FROM THE IB EXAMINED, NO ACTION IS NEEDED
25/02/2026
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
24/02/2026
PUBO
PUBLISHED FOR OPPOSITION
24/02/2026
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
18/02/2026
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
01/02/2026
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
30/01/2026
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
30/01/2026
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
30/01/2026
RFNT
REFUSAL PROCESSED BY IB
23/08/2025
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
02/08/2025
RFRR
REFUSAL PROCESSED BY MPU
02/08/2025
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
12/06/2025
CNRT
NON-FINAL ACTION WRITTEN
11/06/2025
DOCK
ASSIGNED TO EXAMINER
10/06/2025
CRCV
CORRECTION TRANSACTION RECEIVED FROM IB
16/05/2025
MAFR
APPLICATION FILING RECEIPT MAILED
28/02/2025
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
28/02/2025
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
27/02/2025
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