MIND.X

Class 6

Common metals and their alloys for semiconductor application.

Class 7

Semiconductor sorting machines; die-cutting and tapping machines; handling apparatus for loading and unloading being loading and unloading machines; machining in the nature of pick and place mechanism; semiconductor packaging machines; automatic die and flip chip handling machines; reeling machine for taping and reeling packaging

Class 9

Measuring apparatus and instruments, namely, downloadable vision guided software for automated optical inspection, dimensional measurement, image processing, machine learning operations, and defect detection of semiconductor wafers, dies, and packages, for use with optical apparatus and instruments incorporating in-house developed algorithms; data processing equipment for semiconductor application

Class 40

Treatment of materials by means of laser application for semiconductor

Class 42

Research, development, and design services in the field of semiconductor, wireless communication components, optoelectronic products, and fiber-optics component; testing and analysis of goods for others being semiconductor, wireless communication components, optoelectronic products, and fiber-optics component to assure compliance with semiconductor industry standards; research in the field of semiconductor processing technology; analysis and evaluation of product development of others to the order and specification of SEMI, IEEE, IEC, ISO, CE and others equivalent accrediting bodies or certification boards; design of integrated circuits; testing and inspection being analysis and evaluation of semiconductor, semiconductor wafer, memory chips and integrated circuits, product quality control, consultancy relating to semiconductor research and development