FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
05/02/2026
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Dado oficial do USPTO
TORYZA
Sabia que essa marca já está registrada no Estados Unidos?
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Active USPTO registrationTipo: VerbalEscritório: US
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
25
Atualização mais recente
03/04/2026
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
1, 7
Data de depósito
04/03/2024
Data de registro
17/06/2025
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
17/06/2025
Última transação
03/04/2026
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Código do desenho
4
Tipo de titular
03
Localização do titular
JP
Examinador
JANSON, ANDREW KYLE
Unidade examinadora
L50
Localização atual
FILE REPOSITORY (FRANCONIA)
Titulares e representantes
Titulares
OKUNO CHEMICAL INDUSTRIES CO., LTD.
Representantes
Boris Umansky Ladas & Parry LLP
Classificação técnica
Classes Nice
Classe 1Classe 7
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 1
Chemicals for use in the manufacture of semiconductors; chemical surface treatment agents for use in the manufacture of electronic components; etchants for use in the manufacture of semi-conductors; plating removing preparationschemical agents for removing metal plating from microelectronic components and semiconductors; release solvent for photoresists being solvent type processing compositions for use in the electronics industry; chemicals for use in metal plating; industrial chemicals; chemicals for use in plating; plating preparations; chemical plating solutionslithium plating solutionssodium plating solutionsaluminum plating solutionsmagnesium plating solutionschromium plating solutionsmanganese plating solutionsiron plating solutionscobalt plating solutionsnickel plating solutionselectroless nickel plating solutionsacid copper plating solutionscopper plating solutionselectroless copper plating solutionszinc plating solutionsgallium plating solutionsgermanium plating solutionsruthenium plating solutionselectroless ruthenium plating solutionsrhodium plating solutionselectroless rhodium plating solutionspalladium plating solutionselectroless palladium plating solutionssilver plating solutionselectroless silver plating solutionstin plating solutionsiridium plating solutionsplatinum plating solutionselectroless platinum plating solutionsgold plating solutionselectroless gold plating solutionsbismuth plating solutionselectroless bismuth plating solutions; metal plating chemical compositions; chemical additives for metal plating chemical compositions; metal surface treatment agentschemical compositions for use in metal plating processes; chemicals for use in metal surface treatmentchemical compositions for use in metal plating processes; chemical preparations for use in metal industries; catalytic agents; catalysts for chemical plating processes; ungluing preparationschemical solvents and degreasing solvents for use in manufacturing processes; etching agents being etching solutions for metals; etching agents being etching solutions for the surface of aluminum and aluminum alloys; etching agents being etching solutions for the surface of glass.
Classe 7
Surface treatment equipment for use in manufacture of semiconductorssemiconductor wafer plating processing machines for use in manufacture; semiconductor manufacturing machines; metal plating machines for use in the manufacture of semiconductors; semiconductor wafers plating processing machines for use in the manufacture of semiconductors; surface treatment equipment for semiconductor wafers and integrated circuitsmetal plating processing machines system comprised of mixing machinesfilter machinesspraying machinesplating bath machinespumping machinesplating processing machines for use in surface treatment; semiconductor substrates manufacturing machines; semiconductor wafer processing machines; etching machines and equipment for semiconductor substrates; electrolessplating machines; electroplating machines; liquid metal processing tanks for electronic components and semiconductor wafer plating being parts of machines; chemical processing tanks being parts of machines; machines and equipment for use in manufacturing and processing electronic circuit printed boardsmetal plating processing machines system comprised of mixing machinesfilter machinesspraying machinesplating bath machinespumping machinesplating processing machines for use in surface treatment.
Publicações
Histórico de despachos e eventos da marca no USPTO.
25 publicações encontradas
FICS
FINAL DISPOSITION NOTICE SENT TO IB
17/01/2026
FIMP
FINAL DISPOSITION PROCESSED
17/01/2026
OPNX
NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
01/01/2026
OPNS
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
17/12/2025
OPNR
NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
17/12/2025
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
17/09/2025
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
17/06/2025
R.PR
REGISTERED-PRINCIPAL REGISTER
17/06/2025
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
29/04/2025
PUBO
PUBLISHED FOR OPPOSITION
29/04/2025
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
23/04/2025
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
01/04/2025
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
20/03/2025
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
20/03/2025
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
20/03/2025
RFNT
REFUSAL PROCESSED BY IB
12/10/2024
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
20/09/2024
RFRR
REFUSAL PROCESSED BY MPU
20/09/2024
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
19/09/2024
CNRT
NON-FINAL ACTION WRITTEN
18/09/2024
DOCK
ASSIGNED TO EXAMINER
18/09/2024
MAFR
APPLICATION FILING RECEIPT MAILED
25/07/2024
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
25/07/2024
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
18/07/2024
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