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Dado oficial do USPTO

IMEC. NETZERO

Sabia que essa marca já está registrada no Estados Unidos?

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Active USPTO registrationTipo: VerbalEscritório: US

Snapshot rápido

IMEC. NETZERO

ST13

US500000079387071

Classe

9, 35, 40, 41, 42

Pedido

79387071

Registro

7943008

Diagnóstico de risco e oportunidade

Leitura executiva para decisão de naming, protocolo e monitoramento.

Atenção: há risco ativo

Situação USPTO

Active USPTO registration

Tipo de processo

Pedido e registro

Eventos registrados

35

Atualização mais recente

17/04/2026

Classificação

Registrada

Tipo de marca

Verbal

Classes Nice

9, 35, 40, 41, 42

Data de depósito

03/11/2023

Data de registro

16/09/2025

Data de expiração

-

Ação recomendada

Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.

Próximo passo

Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.

Dados completos do processo

Campos estruturados da autoridade responsável e do histórico oficial.

Data da situação

16/09/2025

Última transação

17/04/2026

Escritório responsável

United States Patent and Trademark Office

Código da situação

700

Cadastro oficial

Principal Register

Código do desenho

4

Tipo de titular

99

Localização do titular

BE

Examinador

KOPENSKI, CLAUDIA ANN

Unidade examinadora

O20

Localização atual

FILE REPOSITORY (FRANCONIA)

Titulares e representantes

Titulares

I. V. (pessoa física)

Representantes

Jessica S. Sachs Harness, Dickey & Pierce, P.L.C.

Classificação técnica

Classes Nice

Classe 9Classe 35Classe 40Classe 41Classe 42

Códigos Vienna

Sem códigos Vienna disponíveis.

Produtos e serviços

Classe 9

Downloadable computer-aided manufacturing (CAM) software for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; downloadable computer software for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; downloadable computer application software for measuring the environmental impact of manufacturing integrated circuit chips; downloadable computer application software for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips to help reduce the carbon footprint of lithography and etch process steps; application-specific integrated circuits; electronic chips for the manufacture of integrated circuits; blank electronic chip cards; encoded electronic chip cards containing programming used for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; downloadable computer software for environmental monitoring; semiconductor chips; integrated circuit chips; semiconductors; semiconductor apparatus; semiconductor testing apparatus; integrated circuits; downloadable mobile applications for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips

Classe 35

Business consulting servicesproviding business information and advice concerning semiconductorsintegrated circuits and application-specific integrated circuits (ASICs); business consulting servicesproviding business information relating to reducing the carbon footprint of lithography and etch process steps

Classe 40

Custom manufacture of integrated circuitsapplication-specific integrated circuits (asics)semiconductorsmicroprocessorsmicrocontrollersembedded systems; custom manufacture of semiconductor componentsdevices and circuits

Classe 41

Training services in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; training services in the field of semiconductorsintegrated circuits and application-specific integrated circuits; educational servicesconducting programs in the field of scientific modelling of the environmental impact of manufacturing; educational servicesthe organization and conducting of workshopsconferences and seminars in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; publication of online and electronic books and periodicals; publication of learning materials in the nature of books and periodicals in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; developing learning materialseducational materials for others in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; provision of non-downloadableonline electronic publications in the nature of booksmagazinesbrochures in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; providing educational advising and information with respect to education in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chipsalso by electronic networks particularly the internet; training in the field of the design of integrated circuits; training in the field of the development of integrated circuits; training in the field of reducing the carbon footprint of lithography and etch process steps; educational servicesproviding workshopsconferences and seminars in the field of reducing the carbon footprint of lithography and etch process steps

Classe 42

Providing temporary use of online non-downloadable web-based applications for scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; environmental consulting services in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; scientific research in the field of environmental conservation; research in the reduction of carbon emissions; research in the area of semiconductor processing technology; technical project studies in the nature of technical research in the field of carbon offsetting; technical consultancy in the field of the production of semiconductors; providing scientific informationadvice and consultancy relating to carbon offsetting; providing scientific informationadvice and consultancy relating to net zero emissions; providing scientific informationadvice and consultancy relating to reducing the carbon footprint of lithography and etch process steps; designdevelopmenttesting in the field of integrated circuitsapplication-specific integrated circuits (ASICs)semiconductorsmicroprocessorsmicrocontrollers and embedded systems for others; product quality testing services; technological consultancy in the field of new semiconductor processing and manufacturing technologies; research and development services in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; quality control and authentication services for others in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; scientific and technological servicesscientific researchanalysistesting and modelling in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; industrial analysis and industrial research services in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; development of new technology for others in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips; design of integrated circuits; integrated circuit design services; technology consultancy in the field of new semiconductor processing and manufacturing technologies by experts; scientific adviceconsultancy and information relating to the design and modelling in the field of scientific modelling of the environmental impact of manufacturing integrated circuitssemiconductor technologieselectronic components in the nature of electronic chips also to be provided via electronic networks particularly the internet

Publicações

Histórico de despachos e eventos da marca no USPTO.

35 publicações encontradas

FINO

FINAL DECISION TRANSACTION PROCESSED BY IB

16/04/2026

FICS

FINAL DISPOSITION NOTICE SENT TO IB

28/03/2026

FIMP

FINAL DISPOSITION PROCESSED

27/03/2026

FICR

FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB

16/12/2025

NRCC

NOTICE OF REGISTRATION CONFIRMATION EMAILED

16/09/2025

R.PR

REGISTERED-PRINCIPAL REGISTER

16/09/2025

NPUB

OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED

29/07/2025

PUBO

PUBLISHED FOR OPPOSITION

29/07/2025

NONP

NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED

23/07/2025

CNSA

APPROVED FOR PUB - PRINCIPAL REGISTER

24/06/2025

XAEC

EXAMINER'S AMENDMENT ENTERED

24/06/2025

GNEN

NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED

24/06/2025

GNEA

EXAMINERS AMENDMENT E-MAILED

24/06/2025

CNEA

EXAMINERS AMENDMENT -WRITTEN

24/06/2025

OPNX

NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB

20/06/2025

OPNS

NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB

03/06/2025

OPNR

NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB

03/06/2025

TEME

TEAS/EMAIL CORRESPONDENCE ENTERED

28/05/2025

CRFA

CORRESPONDENCE RECEIVED IN LAW OFFICE

28/05/2025

ERFR

TEAS REQUEST FOR RECONSIDERATION RECEIVED

28/05/2025

GNFN

NOTIFICATION OF FINAL REFUSAL EMAILED

20/02/2025

GNFR

FINAL REFUSAL E-MAILED

20/02/2025

CNFR

FINAL REFUSAL WRITTEN

20/02/2025

TEME

TEAS/EMAIL CORRESPONDENCE ENTERED

23/01/2025

CRFA

CORRESPONDENCE RECEIVED IN LAW OFFICE

23/01/2025

TROA

TEAS RESPONSE TO OFFICE ACTION RECEIVED

23/01/2025

RFNT

REFUSAL PROCESSED BY IB

11/08/2024

RFCS

NON-FINAL ACTION MAILED - REFUSAL SENT TO IB

23/07/2024

RFRR

REFUSAL PROCESSED BY MPU

23/07/2024

RFCR

NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW

26/06/2024

CNRT

NON-FINAL ACTION WRITTEN

25/06/2024

DOCK

ASSIGNED TO EXAMINER

13/06/2024

MAFR

APPLICATION FILING RECEIPT MAILED

10/01/2024

NWOS

NEW APPLICATION OFFICE SUPPLIED DATA ENTERED

06/01/2024

REPR

SN ASSIGNED FOR SECT 66A APPL FROM IB

04/01/2024

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