FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
22/08/2025
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Dado oficial do USPTO
SILANNA SAFE
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Active USPTO registrationTipo: VerbalEscritório: US
Snapshot rápido
SILANNA SAFE
ST13
US500000079380705Classe
9, 40, 42
Pedido
79380705
Registro
7656430
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
29
Atualização mais recente
03/04/2026
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
9, 40, 42
Data de depósito
09/08/2023
Data de registro
21/01/2025
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
21/01/2025
Última transação
03/04/2026
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Código do desenho
4
Tipo de titular
81
Localização do titular
AU
Examinador
BLAZICH, JOAN MICHELE
Unidade examinadora
N40
Localização atual
FILE REPOSITORY (FRANCONIA)
Titulares e representantes
Titulares
Silanna Semiconductor Pty Ltd
Representantes
David M. Perry Blank Rome LLP
Classificação técnica
Classes Nice
Classe 9Classe 40Classe 42
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 9
Scientificnauticalsurveyingphotographiccinematographicopticalweighingmeasuringsignallingchecking and supervisionlife-saving and teaching apparatus and instrumentsspecialized tools used for analysisnavigationmeasurementsignalling and safety namelyspectrometersdigital camera and traffic lights; apparatus and instruments for conductingswitchingtransformingaccumulatingregulating or controlling electricity; apparatus for recordingtransmission or reproduction of sound or images; blank magnetic data carriersrecording discs being blank record disks; mechanisms for coin-operated apparatus; cash registerscalculating machinesfire-extinguishing apparatus; RF integrated circuits; analog logic circuits; digital and analog signalling devicessignaling lights; high speed isolators being telecommunication switches; wideband radio receivers; low noise amplifiers; electronic circuits; electronic integrated circuits; electronic logic circuits; electronic memory circuits; hybrid electronic circuits; hybrid integrated circuits; infrared circuit structural components; logic circuits; masks for making circuitssynthetic quartz glass plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; electronic microprocessor control circuits; miniature circuit breakers; circuit breakers; integrated circuit cards; electronic circuit closers; electronic circuit distributors; electronic circuit fuses; electronic circuit openers; electronic circuit switches; circuit testers; circuitselectric or electronic; electronic chips being semiconductors for the manufacture of integrated circuits; integrated circuits; cards bearing integrated circuits; cards incorporating integrated circuits; electronic blank recorded computer software cartridges with memory integrated circuits; chips being integrated circuits; silicon on insulator wafers for integrated circuits; glass wafers for integrated circuits; integrated circuits for networks for use in identification; masks for making integrated circuitssynthetic quartz glass plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; masks for the production of integrated circuitssynthetic quartz glass plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; photo mask substrates for integrated circuitssynthetic quartz glass plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; probes for testing use with integrated circuitsother than for medical use; reading machines for integrated circuitselectronic card readers; silicon wafer carriers being semiconductor chip housings for handling integrated circuits; electric sockets for testing integrated circuits; solid-state integrated circuits; test probe assemblies being probes for testing integrated circuits; Electric test sockets for integrated circuits; thick film hybrid integrated circuits; integrated circuit electronic memories; semiconductors; complementary metal-oxide semiconductors; compound semiconductors; semiconductor memories; semiconductor chips; semiconductor and microprocessor cartridges being chips; semiconductor testing apparatus; semiconductor apparatus being semiconductor chips for use with computers; semiconductor devices; semiconductor elementssemiconductor power elements; semiconductor instrumentsspecialized tools and equipment in the nature of silicon wafersintegrated circuitssemiconductor testing apparatus used in the productionmanufacturetesting and analysis of semiconductor devicesintegrated circuitsmicrochips and other semiconductor-based components; semiconductor memories; downloadable computer programmes for electronic design automation of quantum computer networking hardware; semiconductor memory apparatus being semiconductor memory units; semiconductor memory units; downloadable computer programmes for designing semiconductors; semiconductor memory devices being semiconductor memory units; semiconductor memory instruments being computer memories; semiconductor wafers; semiconductors being integrated circuits; semiconductors being electronic devices; silicon chips being electronic components; silicon controlled electrical reactors; silicon controlled rectifiers; micro accelerometers; silicon micro accelerometers; silicon rubber layered electrical connectors; silicon slices being wafers; silicon wafer slices; silicon wafers; wafers being silicon slices; semiconductor processors; microprocessors; microcontrollers; static RAM (random access memory) card; digital logic circuits; equipment for testing and programming integrated circuitsprobes for testing integrated circuits; catalyst substrates for use in signalling apparatussynthetic quartz glass plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; flexible circuit substrates having controlled impedance characteristicssynthetic quartz glass plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; flexible printed circuits incorporating substrates; glass substrates for magnetic recording mediasynthetic quartz glass plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; photomask substratessynthetic quartz glass plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; printed circuits on substrates of flexible film; printed circuits on substrates of plastics material; printed substratessilicon wafers for printed circuit boards; recording substratesoptical recording substrates being optical silicon wafers; recording substratesblank magnetic data carriers; special glass carrier substrates for biologically significant substances for magnetic recording devicessynthetic quartz glass plates being structural parts of excimer steppersfor use in fabrication of integrated circuits; substrates being printed circuit boards ready for etching; substratessilicon wafers; substrates for carrying information in electronic formprinted circuit boards; substrates for carrying information in magnetic formprinted circuit boards; substrates for carrying information in optical formprinted circuit boards; substrates for holographsprinted circuit boards; substrates for exposed photographsprinted circuit boards; substrates for unexposed photographsprinted circuit boards; apparatus for connecting electrical circuit componentselectrical circuit boardsconnectors for electronic circuits; apparatus being continuity test apparatus for testing electronic circuits; testing apparatus for testing printed circuit boards; apparatus for the exposure of films for integrated circuitsphotographic exposure meters; light emitting diodes (LED); light emitting diodes (LED) for use in scientific and manufacturing equipment; light emitting diodes (LED) for high energy light; structural partsfittingsaccessoriescomponents and testing apparatus for all the aforesaid goodssemiconductors
Classe 40
Customised materials assembly being custom manufacture of semiconductors for others; custom manufacture of semiconductor chipsintegrated chipssilicon chips; custom manufacture of semiconductorscircuitsintegrated circuitsmicroprocessorscomplementary metal-oxide semiconductorscompound semiconductorssilicon chipssilicon wafers and processors; custom manufacture services for others in the field of semiconductor devices; providing semiconductor material treatment information being providing information relating to material treatment; technical support servicesproviding technical advice related to the custom manufacture of semiconductor materials and devices; consultancyassistanceadvisory and information servicesincluding onlinerelating to interactivedigital and data casting services in relation to the foregoing
Classe 42
Scientific and technological services and research and design relating theretoscientific and technological research in the field of semiconductors; scientific industrial analysis and research services in the field of integrated circuit boardssemiconductorssilicon chipssilicon wafers and processors; researchengineeringdesign and development of semiconductorscircuitsintegrated circuitsmicroprocessorscomplementary metal-oxide semiconductorscompound semiconductorssilicon chipssilicon wafers and processors; foundry services related to designdesign and development of semiconductorscircuitsintegrated circuitsmicroprocessorscomplementary metaloxide semiconductorscompound semiconductorssilicon chipssilicon wafers and processors; engineering project management servicesengineering services; management of scientific research projectsengineering services; project managementdesign of computer software and computer project management; researchengineeringdesign and development of microelectronic devices; Semiconductor design services for others; design of electric circuit boards; analysis of materials; scientific industrial analysis in the field of semiconductors; Scientific laboratory services; Scientific laboratory services for scientific research and analysis in the field of semiconductors; materials characterisation analysis; technological engineering analysis in the field of semiconductors; technological analysis servicesscientific analysis of semiconductors; scientific and technical analysisscientific analysis in the field of scientific analysis in the field of semiconductor development; engineering project management of testingpackaging and assembly servicesengineering services; prototype design services in the field of semiconductors; researchengineeringdesign and development of light emitting diodes (LED); testing of semiconductor materials and devices; technical project research of semiconductor materials and deviceslight emitters and detectorspower switches and RF integrated circuits; research and development of semiconductor materials and devices; engineering service in the field of semiconductor materials and devices; packaging design; contract foundry designtesting and engineering support services in the field of semiconductor materials and devicesengineering services; foundry services related to designdesign of light emitting diodes (LED); consultancyassistanceadvisory and information servicesincluding onlinerelating to interactivedigital and data casting services in relation to the foregoing
Publicações
Histórico de despachos e eventos da marca no USPTO.
29 publicações encontradas
FICS
FINAL DISPOSITION NOTICE SENT TO IB
02/08/2025
FIMP
FINAL DISPOSITION PROCESSED
01/08/2025
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
21/04/2025
OPNX
NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
29/03/2025
OPNS
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
11/03/2025
OPNR
NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
11/03/2025
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
21/01/2025
R.PR
REGISTERED-PRINCIPAL REGISTER
21/01/2025
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
03/12/2024
PUBO
PUBLISHED FOR OPPOSITION
03/12/2024
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
27/11/2024
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
12/11/2024
XAEC
EXAMINER'S AMENDMENT ENTERED
12/11/2024
GNEN
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
12/11/2024
GNEA
EXAMINERS AMENDMENT E-MAILED
12/11/2024
CNEA
EXAMINERS AMENDMENT -WRITTEN
12/11/2024
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
28/10/2024
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
28/10/2024
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
28/10/2024
RFNT
REFUSAL PROCESSED BY IB
22/05/2024
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
29/04/2024
RFRR
REFUSAL PROCESSED BY MPU
29/04/2024
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
17/04/2024
CNRT
NON-FINAL ACTION WRITTEN
16/04/2024
DOCK
ASSIGNED TO EXAMINER
10/04/2024
MAFR
APPLICATION FILING RECEIPT MAILED
24/10/2023
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
18/10/2023
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
12/10/2023
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