NREP
NEW REPRESENTATIVE AT IB RECEIVED
11/06/2026
Voltar para busca
Dado oficial do USPTO
BONDTECH
Sabia que essa marca já está registrada no Estados Unidos?
Antes de investir em nome, identidade e divulgação, valide risco de colisão e estratégia de registro para não perder tempo nem budget.
Active USPTO registrationTipo: MistaEscritório: US
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
39
Atualização mais recente
12/06/2026
Classificação
Registrada
Tipo de marca
Mista
Classes Nice
7, 37
Data de depósito
27/07/2022
Data de registro
08/10/2024
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
08/10/2024
Última transação
12/06/2026
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Código do desenho
3
Tipo de titular
03
Localização do titular
JP
Examinador
MONINGHOFF, KIM TERESA
Unidade examinadora
M40
Localização atual
FILE REPOSITORY (FRANCONIA)
Descrição da marca
The mark consists of the stylized wording "BONDTECH" combined with an oval outline.
Titulares e representantes
Titulares
Bondtech Co., Ltd.
Representantes
Shintaro Yamada LUCAS & MERCANTI, LLP
Classificação técnica
Classes Nice
Classe 7Classe 37
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 7
Semiconductor manufacturing equipmentsemiconductor manufacturing machinessemiconductor wafer processing equipment; machine couplings and transmission components and machine elements in the nature of shock prevention devices for semiconductor manufacturing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and semiconductor exposure apparatuses for use in manufacturestructural components thereof; positioning devices for semiconductor manufacturing equipmentball transfer unitscomponents thereofbearingsas parts of machines; hydraulic and pneumatic controls for semiconductor manufacturing equipmentcomponents thereofhydraulic valves being parts of machinesoil-water separators for pneumatic controls being parts of machines; machines for manufacturing semiconductor equipmentsemiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipmentstructural components thereof; robots for manufacturing semiconductorsstructural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines and exposure apparatuses for use in manufacture; semiconductor element manufacturing equipmentmachines therefor; integrated circuit manufacturing equipmentmachines thereforcomponents thereof; stacked semiconductor chips manufacturing equipmentmachines for manufacturing stacked semiconductor chips; machines for nanoimprint lithography (NIL) for semiconductor manufacturing; equipment for manufacturing and processing microelectromechanical systems (MEMS)electromechanical manufacturing and marking machines and components and appendages in the nature of parts thereof; equipment for cleaning microelectromechanical systems (MEMS)dust removing installations for cleaning purposescomponents and appendages in the nature of parts thereof; cleaning devices for semiconductor manufacturingcleaning machines for semiconductor manufacturing machines; devices in the nature of machines for mounting IC chips on circuit boards; plasma etching machines; semiconductor exposure devicesapparatus for use in manufacture; semiconductor cutting devices being parts of machines; semiconductor polishing devices being parts of machines; semiconductor plating devices being parts of machines; semiconductor etching devices being parts of machines; semiconductor thin-film formation devices being parts of machines; none of the aforementioned goods being 3D printers or machines for moulding plasticsparts or fittings thereof
Classe 37
Repair and maintenance of semiconductor manufacturing equipmentproviding information related thereto; repair and maintenance of semiconductor manufacturing machinesproviding information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatusesproviding information related thereto; repair and maintenance of positioning devices for semiconductor manufacturing equipmentproviding information related thereto; repair and maintenance of control devices for semiconductor manufacturing equipmentproviding information related thereto; repair and maintenance of semiconductor product manufacturing equipmentproviding information related thereto; repair and maintenance of semiconductor processing machines and apparatusesproviding information related thereto; repair and maintenance of robots for manufacturing semiconductorsproviding information related thereto; repair and maintenance of semiconductor wafer processing equipmentproviding information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturingproviding information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatusesproviding information related thereto; repair and maintenance of semiconductor element manufacturing equipmentproviding information related thereto; repair and maintenance of integrated circuit manufacturing equipmentproviding information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipmentproviding information related thereto; repair and maintenance of machines for nanoimprint lithography (NIL) for semiconductor manufacturingproviding information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS)providing information related thereto; repair and maintenance of equipment for cleaning microelectromechanical systems (MEMS)providing information related thereto; repair and maintenance of cleaning devices for semiconductor manufacturingproviding information related thereto; repair and maintenance of devices for mounting IC chips on circuit boardsproviding information related thereto; repair and maintenance of wafer foreign matter inspection devices for semiconductor manufacturingproviding information related thereto; repair and maintenance of plasma etching machinesproviding information related thereto; repair and maintenance of semiconductor exposure devicesproviding information related thereto; repair and maintenance of semiconductor cutoff devicesproviding information related thereto; repair and maintenance of semiconductor polishing devicesproviding information related thereto; repair and maintenance of semiconductor plating devicesproviding information related thereto; repair and maintenance of semiconductor etching devicesproviding information related thereto; repair and maintenance of semiconductor thin-film formation devicesproviding information related thereto; repair and maintenance of semiconductor drying devicesproviding information related thereto; cleaning of machines and apparatuses for semiconductor manufacturing; cleaning of semiconductor manufacturing equipment; installation work of semiconductor testing equipmentproviding information related thereto; installation work of semiconductor manufacturing equipmentproviding information related thereto; repair and maintenance of electronic machines and apparatusesproviding information related thereto; installation workrepairmaintenance of computer hardwareproviding information related thereto; none of the aforementioned services being intended for 3D printers or for machines for moulding plasticsparts thereof
Publicações
Histórico de despachos e eventos da marca no USPTO.
39 publicações encontradas
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
18/12/2025
ECDR
TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
18/12/2025
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
18/12/2025
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
18/12/2025
FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
04/04/2025
FICS
FINAL DISPOSITION NOTICE SENT TO IB
14/03/2025
FIMP
FINAL DISPOSITION PROCESSED
14/03/2025
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
08/01/2025
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
08/10/2024
R.PR
REGISTERED-PRINCIPAL REGISTER
08/10/2024
OPNX
NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
17/08/2024
OPNS
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
31/07/2024
OPNR
NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
31/07/2024
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
23/07/2024
PUBO
PUBLISHED FOR OPPOSITION
23/07/2024
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
03/07/2024
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
20/06/2024
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
17/06/2024
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
17/06/2024
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
17/06/2024
GNRN
NOTIFICATION OF NON-FINAL ACTION E-MAILED
09/01/2024
GNRT
NON-FINAL ACTION E-MAILED
09/01/2024
CNRT
NON-FINAL ACTION WRITTEN
09/01/2024
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
22/12/2023
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
21/12/2023
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
21/12/2023
ATRV
ATTORNEY REVIEW COMPLETED
25/10/2023
LIME
LIMITATION FROM THE IB - REQUEST EXAM REVIEW
25/10/2023
LIMG
LIMITATION OF GOODS RECEIVED FROM IB
30/07/2023
RFNT
REFUSAL PROCESSED BY IB
26/07/2023
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
05/07/2023
RFRR
REFUSAL PROCESSED BY MPU
05/07/2023
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
23/05/2023
CNRT
NON-FINAL ACTION WRITTEN
22/05/2023
DOCK
ASSIGNED TO EXAMINER
15/05/2023
MAFR
APPLICATION FILING RECEIPT MAILED
07/03/2023
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
03/03/2023
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
02/03/2023
Proteção contínua da sua marca
Seja avisado a cada novo depósito que ameace BONDTECH ou a sua marca.
Vigilância profissional por 24 meses: monitoramos o USPTO por você e alertamos a tempo de você se opor — antes que o conflito vire prejuízo.