RNWL
INTERNATIONAL REGISTRATION RENEWED
23/06/2025
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Dado oficial do USPTO
NEXWAFE
Sabia que essa marca já está registrada no Estados Unidos?
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Active USPTO registrationTipo: VerbalEscritório: US
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
44
Atualização mais recente
03/04/2026
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
7, 9, 40
Data de depósito
23/01/2023
Data de registro
17/12/2024
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
17/12/2024
Última transação
03/04/2026
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Código do desenho
4
Tipo de titular
16
Localização do titular
DE
Examinador
JOHNSON, AISHA CLARKE
Unidade examinadora
L10
Localização atual
FILE REPOSITORY (FRANCONIA)
Titulares e representantes
Titulares
NexWafe GmbH
Representantes
Shoko Naruo Thompson Coburn LLP
Classificação técnica
Classes Nice
Classe 7Classe 9Classe 40
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 7
Machines for machining metalssemimetals and ceramics; industrial robots; machines for electrical engineering industries and electrical industries for drying and platingnamely electro and electroless depositions processing of different substratesparticularly semiconductor waferssemiconductor layer stackssemi-conductor chipsmedical implantsphotovoltaic wafersphotovoltaic cells; machines for chemical industrymaterial processing industriesmining industry and power generation industry for installations for wet and dry chemical etching and annealingwet-chemical cleaning processing of different substratesparticularly semiconductor waferssemiconductor layer stackssemi-conductor chipsmedical implantsphotovoltaic wafersphotovoltaic cellsmachines for epitaxy and for the crystalline growth of semiconductor heterostructuresmachines for cuttinggrindingseparating or handling; Machine toolstools for producing semiconductor waferssemiconductor layer stackssemi-conductor chipsmedical implantsphotovoltaic wafersphotovoltaic cells; control mechanisms for machinesnamely sensorsvalveslocksswitches and actuators for fluidsmoving parts and workpieces in wet chemical etchingfor gasescurrentmoving parts and workpieces in machines for epitaxy and for lasersmoving parts and workpieces in machines for cuttinggrindingseparating or handling semiconductor waferssemiconductor layer stackssemiconductor chipsmedical implantsphotovoltaic wafersphotovoltaic cells; Structural parts of machines used for wet and dry chemical etching and annealingepitaxy and machines for the crystalline growth of semiconductor heterostructuresfor cuttinggrindingseparating or handling of semiconductor waferssemiconductor layer stackssemiconductor chipsmedical implantsphotovoltaic wafersphotovoltaic cells
Classe 9
Apparatus and instruments for conductingswitchingaccumulatingregulating or controlling electricity; Apparatus and instruments for physicsnamely chemical vapor deposition chambers and parts and accessories thereof for epitaxy and for crystalline growth of semiconductor heterostructures; Apparatus and instrumentslaser apparatussaws and grinders and parts and accessories thereof for cutting and grinding of semiconductor waferssemiconductor layer stackssemiconductor chipsmedical implantsphotovoltaic wafers and photovoltaic cells; Apparatus and instrumentsautomation handling equipment for grippingseparatingdetachingplacing and moving of semiconductor waferssemiconductor layer stackssemiconductor chipsphotovoltaic wafers and photovoltaic cells; chemistry apparatus and instrumentsnamely wet benchesdry etching chambersgas controlled ovens and furnaces and parts and accessories thereof for wet and dry chemical etchingannealing and doping of semiconductor waferssemiconductor layer stackssemiconductor chipsmedical implantsphotovoltaic wafers and photovoltaic cells; material testing instruments and machineselectronic apparatus for testing of semiconductor waferssemiconductor layer stackssemi-conductor chipsmedical implantsphotovoltaic wafersphotovoltaic cells; data processing equipment and computers; microprocessors; Integrated circuit chips for the manufacture of semiconductor waferssemiconductor layer stackssemiconductor chipsmedical implantsphotovoltaic wafersphotovoltaic cells; electric and electronic componentssemiconductors; silicon wafers and semiconductor wafers for integrated circuits; parts of all the aforesaid goods in this class.
Classe 40
Treatment and transformation of materialstreatment of metaltreatment of semimetalstreatment of glass and treatment of ceramics; manufacturing of single crystals; Treatment and transformation of materialsrecyclingcoating and surface treatment; Treatment and transformation of materialsetchingprintingmill workingmetal coatingcastinglaser treatmentmagnetizationburnishing servicessawinggrindingblacksmithingcustom tailoringstamping using a press and laminating of semiconductor waferssemiconductor layer stackssemiconductor chipsmedical implantsphotovoltaic wafersphotovoltaic cells; contract manufacturing services in the field of semiconductor waferssemiconductor layer stackssemi-conductor chipsmedical implantsphotovoltaic wafersphotovoltaic cells; Production of energythermal heat and electricity
Publicações
Histórico de despachos e eventos da marca no USPTO.
44 publicações encontradas
FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
06/06/2025
FICS
FINAL DISPOSITION NOTICE SENT TO IB
20/05/2025
FIMP
FINAL DISPOSITION PROCESSED
20/05/2025
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
17/03/2025
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
17/12/2024
R.PR
REGISTERED-PRINCIPAL REGISTER
17/12/2024
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
15/10/2024
PUBO
PUBLISHED FOR OPPOSITION
15/10/2024
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
25/09/2024
OPNX
NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
10/08/2024
OPNS
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
22/07/2024
OPNR
NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
21/07/2024
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
26/06/2024
XAEC
EXAMINER'S AMENDMENT ENTERED
26/06/2024
GNEN
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
26/06/2024
GNEA
EXAMINERS AMENDMENT E-MAILED
26/06/2024
CNEA
EXAMINERS AMENDMENT -WRITTEN
26/06/2024
ZZZX
PREVIOUS ALLOWANCE COUNT WITHDRAWN
26/06/2024
PBSR
WITHDRAWN FROM PUB - SENIOR ATTORNEY REQUEST
26/06/2024
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
21/06/2024
XAEC
EXAMINER'S AMENDMENT ENTERED
21/06/2024
GNEN
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
21/06/2024
GNEA
EXAMINERS AMENDMENT E-MAILED
21/06/2024
CNEA
EXAMINERS AMENDMENT -WRITTEN
21/06/2024
GNFN
NOTIFICATION OF FINAL REFUSAL EMAILED
03/06/2024
GNFR
FINAL REFUSAL E-MAILED
03/06/2024
CNFR
FINAL REFUSAL WRITTEN
03/06/2024
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
16/05/2024
ECDR
TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
16/05/2024
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
16/05/2024
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
16/05/2024
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
14/05/2024
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
13/05/2024
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
13/05/2024
RFNT
REFUSAL PROCESSED BY IB
18/12/2023
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
14/11/2023
RFRR
REFUSAL PROCESSED BY MPU
14/11/2023
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
10/11/2023
CNRT
NON-FINAL ACTION WRITTEN
09/11/2023
DOCK
ASSIGNED TO EXAMINER
20/10/2023
MAFR
APPLICATION FILING RECEIPT MAILED
03/03/2023
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
27/02/2023
SDRC
SN ASSIGNED FOR SECT 66A SUBSEQ DESIG FROM IB
24/02/2023
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