FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
30/11/2024
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Dado oficial do USPTO
NOVASIC
Sabia que essa marca já está registrada no Estados Unidos?
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Active USPTO registrationTipo: VerbalEscritório: US
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
37
Atualização mais recente
30/11/2024
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
9, 40, 42
Data de depósito
27/09/2022
Data de registro
28/05/2024
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
28/05/2024
Última transação
28/05/2024
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Código do desenho
4
Tipo de titular
34
Localização do titular
FR
Examinador
BARRETT, LEAH
Unidade examinadora
N80
Localização atual
FILE REPOSITORY (FRANCONIA)
Titulares e representantes
Titulares
NOVASIC
Representantes
Mari-Elise Paul McBrayer PLLC
Classificação técnica
Classes Nice
Classe 9Classe 40Classe 42
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 9
Single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different machining operationsoperations for conducting cutsmeplatsbevels; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface preparation operations ready for epitaxy or bondinglappingprecision grindingmechanical and chemical mechanical (CMP) polishingcleaninglaser marking operations; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components; all these goods being used in precision grindingmechanical and chemical mechanical polishing (CMP) operations and other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling
Classe 40
mechanical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to machining operationsprocessing for conducting cutsmeplatsbevels; mechanicalchemical and optical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to for surface preparation operationslappingprecision grindingmechanical and chemical mechanical (CMP) polishingcleaninglaser marking operations; other mechanicalchemical and physical surface treatmentsused for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; surface characterization process beingphysicalchemical and opticaltopographyroughness and chemical analysis; structure characterization method being chemical or physicalmorphology and crystal structure; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling
Classe 42
Testing of machining techniquestechnical tests and trials for conducting cutsmeplatsbevels; testing and tests of surface preparation techniquestechnical testing and testing of lappingprecision grindingmechanical and chemical mechanical polishing (CMP)cleaninglaser marking; technical tests of other surface treatments for others in the field of materials used to for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; research and development for new products for others; research and development of new consumable products for others used in machining operationsoperations for conducting cutsmeplatsbevels; research and development of new consumable products for others for use in surface preparation operationslappingprecision grindingmechanical and chemical mechanical (CMP) polishingcleaninglaser marking operations; research and development of new consumables for others used in other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for conducting machining operationsoperations for conducting cutsmeplatsbevels; technical advice for conducting surface preparation operationslappingprecision grindingmechanical and chemical mechanical (CMP) polishingcleaninglaser marking operations; technical advice for conducting other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for surface characterizationtopographyroughness and chemical analysis; technical advice for structure characterizationmorphology and crystallography; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding
Publicações
Histórico de despachos e eventos da marca no USPTO.
37 publicações encontradas
FICS
FINAL DISPOSITION NOTICE SENT TO IB
12/11/2024
FIMP
FINAL DISPOSITION PROCESSED
12/11/2024
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
28/08/2024
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
28/05/2024
R.PR
REGISTERED-PRINCIPAL REGISTER
28/05/2024
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
11/04/2024
ECDR
TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
11/04/2024
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
11/04/2024
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
11/04/2024
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
12/03/2024
GPNX
NOTIFICATION PROCESSED BY IB
12/03/2024
PUBO
PUBLISHED FOR OPPOSITION
12/03/2024
OPNS
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
21/02/2024
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
21/02/2024
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
21/02/2024
OP2R
NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB
21/02/2024
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
06/02/2024
XAEC
EXAMINER'S AMENDMENT ENTERED
06/02/2024
GNEN
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
06/02/2024
GNEA
EXAMINERS AMENDMENT E-MAILED
06/02/2024
CNEA
EXAMINERS AMENDMENT -WRITTEN
06/02/2024
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
18/01/2024
ECDR
TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
18/01/2024
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
18/01/2024
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
18/01/2024
CHAN
APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
18/01/2024
COAR
TEAS CHANGE OF OWNER ADDRESS RECEIVED
18/01/2024
RFNT
REFUSAL PROCESSED BY IB
13/09/2023
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
19/08/2023
RFRR
REFUSAL PROCESSED BY MPU
19/08/2023
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
26/07/2023
CNRT
NON-FINAL ACTION WRITTEN
25/07/2023
DOCK
ASSIGNED TO EXAMINER
12/07/2023
MAFR
APPLICATION FILING RECEIPT MAILED
07/01/2023
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
03/01/2023
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
30/12/2022
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