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Dado oficial do USPTO

HICC

Sabia que essa marca já está registrada no Estados Unidos?

Antes de investir em nome, identidade e divulgação, valide risco de colisão e estratégia de registro para não perder tempo nem budget.

Active USPTO registrationTipo: VerbalEscritório: US

Snapshot rápido

HICC

ST13

US500000079349418

Classe

7, 9, 42

Pedido

79349418

Registro

7245084

Diagnóstico de risco e oportunidade

Leitura executiva para decisão de naming, protocolo e monitoramento.

Atenção: há risco ativo

Situação USPTO

Active USPTO registration

Tipo de processo

Pedido e registro

Eventos registrados

26

Atualização mais recente

23/04/2024

Classificação

Registrada

Tipo de marca

Verbal

Classes Nice

7, 9, 42

Data de depósito

23/03/2022

Data de registro

19/12/2023

Data de expiração

-

Ação recomendada

Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.

Próximo passo

Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.

Dados completos do processo

Campos estruturados da autoridade responsável e do histórico oficial.

Data da situação

19/12/2023

Última transação

19/12/2023

Escritório responsável

United States Patent and Trademark Office

Código da situação

700

Cadastro oficial

Principal Register

Código do desenho

4

Tipo de titular

27

Localização do titular

AT

Examinador

HOFFMAN, DAVID

Unidade examinadora

L70

Localização atual

PUBLICATION AND ISSUE SECTION

Titulares e representantes

Titulares

IBG Immobilien und Beteiligungs GmbH

Representantes

Brittany L. Kulwicki Calfee, Halter & Griswold LLP

Classificação técnica

Classes Nice

Classe 7Classe 9Classe 42

Códigos Vienna

Sem códigos Vienna disponíveis.

Produtos e serviços

Classe 7

Machines and machine tools for microelectronicsfor the productiontreatmenttransportprocessing of electronic components in the fields of medical equipment techniques technologybiotechnologymicrosystem techniques technologysemiconductor technologynanotechnologywafer bonding technologylithography equipment technology; machines for manufacturing electronic components and optical and technical devicesactive and passive electronical components in the nature of micro-electromechanical systems (MEMS)microchipsmemory chipsdiodeslight-emitting diodestransistorsoptical lenses; precision machines as well as spare parts for the same for use with semiconductor technologymicroelectronicsmedical equipmentbiotechnologymicrosystemsnanotechnology; self-regulating pumpsresist dispense pumps

Classe 9

Scientific apparatus and instruments for microelectronicsfor medical equipment techniquesbiotechnologymicrosystem techniquessemiconductor and nanotechnologyexposure systems for 1X lithography applicationsmask aligners and contact and proximity printers and devices for joining one or multiple substrates temporarily or permanentlysubstrate bonding systems comprised of UV-radiation/UV-light source devicesheaterspneumatic and hydraulic piston setups and spindles; surveying deviceselectricphotographicopticalmeasuringsignalingmonitoring devicesin particular for precision systems in the semiconductor technologyin microelectronicsin medical equipment techniquesbiotechnologymicrosystem techniquesnanotechnologyfront to backside alignment measurement systems including at least one of measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substratecomputer hardware that can analyze the data and calculate misalignment values between the pattern on the front and backside; chipsintegrated circuits; downloadable computer operation programs for use in the operation of microelectronics and semiconductor fabrication and processing apparatuses; peripheral equipment for computers; data processing unitsdata processing devices and computers; downloadable computer software for analyzing wafer bonding results and pattern alignment of substrates; scientific diagnosis devices in bio-chip formatDNA microarraysmicrofluidic chipsprotein microarrays comprising oligonucleotide-arraysminiaturized immunologic test-arrayssubstance librariescombinatorial substance libraries on chip surfaces for scientific purposes; electric systems for remote controlled industrial operational processeslaboratory robots; protective masks and filters therefor for use with photographic and photolithographic equipment and photographic film processing; devices for telecommunicationstelegraphic transmitting apparatustelecopying devicestelephones; semiconductors; capillary reagent tubes for laboratory use; electric monitoring devicesoscillographsindicatorssurveying instruments; couplers being data processing equipment; furniture especially made for laboratories; laser for non-medical purposes; reading devices being data processing apparatus; measuring instrumentsnamely laser measuring devices; measuring deviceslaser measuring devices; material testing instruments and machinesmachines for testing bonding strength in bonded substrates; optical apparatus and instrumentsmicroscopes; photographic apparatus and instrumentscameras; physical and chemical laboratory apparatus and instrumentsmetrology toolsdebonding tools based on chemical assisted debonding; precision measuring devices for measuring wafter curvatureswafer warpagesstructural misalignmentsrun-out errors; projectorsdigital micromirror device (DMD) based illumination devices; protective clothingin particular for protection against accidents in clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; range finders for photographic equipment

Classe 42

Scientific and technological services and research and design relating thereto in the field of engineering; industrial analysisindustrial research and industrial design services in the field of engineering; design and development of computer hardware and software; scientific laboratory services; engineering; computer programming; engineering and scientific laboratory services; providing and conducting evaluationsestimatesresearch and reports in the scientific and technological fieldsanalysis and metrology of coatingimprintingembossing bondingdebondingalignment quality of wafers and chips; technological consultancy in the field of medical and scientific equipment; software as a service (SaaS) featuring software for metrologyanalyzing wafer warpagebond qualityrun-out qualityimprinting qualityembossing quality; platform as a service (PaaS) featuring software for metrologyanalyzing wafer warpagebond qualityrun-out qualityimprinting qualityembossing quality; conducting technical project studies relating to medical and scientific equipment; material testing; calibration; construction drafting; research and development of new products for others; research in the field of physics; mechanical research; engineering services for others; product development of precision systems and devices for the semiconductor technology; product development of devices for microsystem techniquesmicroelectronicsmedical techniquesbiotechnologytelecommunicationwafer bondinglithography equipment; providing systems technology solutions for sensorics and diagnosticsin particular of biology and medicine for others; research work in the field of bio-technology; mechanical research work in the field of microsystem technologynanotechnologywafer bondinglithography equipment; mechanical and scientific research work in the field of bio-sensorics and chemical sensorics; technological consulting for third parties concerning handling production plants and process equipment; research servicesmicrosystem technology and nanotechnology research services; providing temporary use of online non-downloadable computer programs for data processing

Publicações

Histórico de despachos e eventos da marca no USPTO.

26 publicações encontradas

FINO

FINAL DECISION TRANSACTION PROCESSED BY IB

23/04/2024

FICS

FINAL DISPOSITION NOTICE SENT TO IB

29/03/2024

FIMP

FINAL DISPOSITION PROCESSED

29/03/2024

FICR

FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB

19/03/2024

NRCC

NOTICE OF REGISTRATION CONFIRMATION EMAILED

19/12/2023

R.PR

REGISTERED-PRINCIPAL REGISTER

19/12/2023

GPNX

NOTIFICATION PROCESSED BY IB

04/10/2023

NPUB

OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED

03/10/2023

PUBO

PUBLISHED FOR OPPOSITION

03/10/2023

OPNS

NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB

13/09/2023

OP2R

NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB

13/09/2023

NONP

NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED

13/09/2023

PBCR

WITHDRAWN FROM PUB - OG REVIEW QUERY

29/08/2023

CNSA

APPROVED FOR PUB - PRINCIPAL REGISTER

14/08/2023

TEME

TEAS/EMAIL CORRESPONDENCE ENTERED

05/06/2023

CRFA

CORRESPONDENCE RECEIVED IN LAW OFFICE

05/06/2023

TROA

TEAS RESPONSE TO OFFICE ACTION RECEIVED

05/06/2023

RFNT

REFUSAL PROCESSED BY IB

06/04/2023

RFCS

NON-FINAL ACTION MAILED - REFUSAL SENT TO IB

14/03/2023

RFRR

REFUSAL PROCESSED BY MPU

14/03/2023

RFCR

NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW

19/01/2023

CNRT

NON-FINAL ACTION WRITTEN

18/01/2023

DOCK

ASSIGNED TO EXAMINER

06/01/2023

MAFR

APPLICATION FILING RECEIPT MAILED

20/09/2022

NWOS

NEW APPLICATION OFFICE SUPPLIED DATA ENTERED

16/09/2022

REPR

SN ASSIGNED FOR SECT 66A APPL FROM IB

15/09/2022

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