NREP
NEW REPRESENTATIVE AT IB RECEIVED
02/04/2026
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Dado oficial do USPTO
CELLFIL
Sabia que essa marca já está registrada no Estados Unidos?
Antes de investir em nome, identidade e divulgação, valide risco de colisão e estratégia de registro para não perder tempo nem budget.
Active USPTO registrationTipo: VerbalEscritório: US
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
33
Atualização mais recente
03/04/2026
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
1, 2, 17
Data de depósito
22/02/2021
Data de registro
31/05/2022
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
31/05/2022
Última transação
03/04/2026
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Código do desenho
4
Tipo de titular
03
Localização do titular
JP
Examinador
HARMON, RAYMOND E
Unidade examinadora
L30
Localização atual
PUBLICATION AND ISSUE SECTION
Titulares e representantes
Titulares
TAIYO HOLDINGS CO., LTD.
Representantes
Kumiko Ide Wenderoth, Lind & Ponack, L.L.P.
Classificação técnica
Classes Nice
Classe 1Classe 2Classe 17
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 1
Chemicals for use in the process of producing printed circuit boardsresist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boardsresist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boardssolder resists; chemical preparations for use in the process of producing printed circuit boardssolder mask; chemicals for use in the process of producing printed circuit boardsetching resist; chemicals for use in the process of producing printed circuit boardsphotoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the form of film for sealing electronic components; unexposed dry filmsmold dry films for electronic components; unexposed dry filmsinsulation mold dry films for electronic components; unexposed dry filmsthermal curing type mold dry films for electronic components; chemicals for use in the process of producing printed circuit boardschemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boardschemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boardschemical agents for plugging holes on printed circuit boards; chemical sealants for use in the process of producing electronic components; synthetic resins that are used as sealants for use in the process of producing electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes
Classe 2
Dyessynthetic dyes; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks being printing inks for use in the process of producing electronic components; inks for hole pluggingprinting inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink
Classe 17
Electrical insulating resistselectrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materialsinsulating resin materials for use in the process of producing printed circuit boards; electrical insulating materialsinsulating resin materials for use in the process of producing electronic components; electrical insulating materialsinsulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; electrical insulating materialsinsulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; electrical insulating materialsinsulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materialsinsulating resin materials for interlayer dielectric materials for sealing electronic components; electrical insulating materialsinsulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; electrical insulating materialsinsulating resin materials for interlayer dielectric materials in the form of film for sealing electronic components; electrical insulating materialsinsulating coating materials for use in the process of producing printed circuit boards; electrical insulating materialsinsulating coating materials for use in the process of producing display panels; electrical insulating materialsinsulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materialsinsulating coating materials for use in the process of producing package application boards; electrical insulating materialsinsulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillerselectrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic components; electrical insulating materialsinsulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics
Publicações
Histórico de despachos e eventos da marca no USPTO.
33 publicações encontradas
FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
10/10/2022
FICS
FINAL DISPOSITION NOTICE SENT TO IB
15/09/2022
FIMP
FINAL DISPOSITION PROCESSED
15/09/2022
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
31/08/2022
ADCH
CHANGE OF NAME/ADDRESS REC'D FROM IB
09/07/2022
NRCC
NOTICE OF REGISTRATION CONFIRMATION EMAILED
31/05/2022
R.PR
REGISTERED-PRINCIPAL REGISTER
31/05/2022
GPNX
NOTIFICATION PROCESSED BY IB
21/03/2022
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
15/03/2022
PUBO
PUBLISHED FOR OPPOSITION
15/03/2022
OPNS
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
23/02/2022
OP2R
NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB
23/02/2022
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
23/02/2022
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
14/02/2022
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
14/02/2022
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
14/02/2022
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
09/02/2022
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
09/02/2022
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
09/02/2022
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
09/02/2022
RFNT
REFUSAL PROCESSED BY IB
05/11/2021
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
12/10/2021
RFRR
REFUSAL PROCESSED BY MPU
12/10/2021
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
25/09/2021
CNRT
NON-FINAL ACTION WRITTEN
24/09/2021
DOCK
ASSIGNED TO EXAMINER
16/09/2021
CORR
CORRECTION FROM IB ENTERED - NO REVIEW REQUIRED
05/08/2021
CRCV
CORRECTION TRANSACTION RECEIVED FROM IB
31/07/2021
MAFR
APPLICATION FILING RECEIPT MAILED
06/07/2021
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
30/06/2021
LIMI
LIMITATION FROM ORIGINAL APPLICATION ENTERED
28/06/2021
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
24/06/2021
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