REM3
COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED
07/07/2025
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Dado oficial do USPTO
3.5 D
Sabia que essa marca já está registrada no Estados Unidos?
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Active USPTO registrationTipo: VerbalEscritório: US
Snapshot rápido
3.5 D
ST13
US500000079251467Classe
6, 7, 40, 42
Pedido
79251467
Registro
6092940
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
31
Atualização mais recente
08/07/2025
Classificação
Registrada
Tipo de marca
Verbal
Classes Nice
6, 7, 40, 42
Data de depósito
30/08/2018
Data de registro
07/07/2020
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
07/07/2020
Última transação
08/07/2025
Escritório responsável
United States Patent and Trademark Office
Código da situação
700
Cadastro oficial
Principal Register
Código do desenho
4
Tipo de titular
99
Localização do titular
14641 Nauen, DE
Examinador
NADELMAN, ANDREA
Unidade examinadora
M10
Localização atual
PUBLICATION AND ISSUE SECTION
Titulares e representantes
Titulares
Pac Tech - Packaging Technologies GmbH
Representantes
Cynthia A. Moyer Fredrikson & Byron, P.A.
Classificação técnica
Classes Nice
Classe 6Classe 7Classe 40Classe 42
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 6
Common metals and their alloysunwrought or semi-wrought; transportable buildings of metal; non-electric cables and wires of common metal; metal containers for storage and transport; contact metallizations for micro joints of soldering in the nature of solder pastessoft solder filmsfoilsfluids and powder
Classe 7
Machinesmachine tools and power tools for manufacturing of multifunctional-microelectromechanical and microoptoelectromechanical systems for the manufacture of transponders and semiconductor wafers and integrated circuits affixed thereto; bonding machines and bonding machine tools for assembly of electricalmechanical and optical components for the manufacture of transponderssensors and semiconductor wafersintegrated circuits affixed thereto; machinesmachine tools and power tools in the field of microperipheric technologiesautogenous soldering machineselectric welding machinesgas welding machineselectric brazing machinessintering machines for chemical processingall for manufacturing micro and non-scale structures by the transformation of solderweldingbrazingadhesive-bonding or sintering materials; machinesmachine tools and power tools for applying connecting materials in form of pre-formspastesfilmsfoilsfluids or powder onto substrates by using chemicalelectro-chemical and physical deposition techniquesmachinery for applying coatings ultrasonically to medical and industrial apparatus; machinesmachine tools and power tools for manufacturing microconnectionsby chemical or physical depositionmechanical-thermal- or optical transformation; machines for electricaloptical and mechanical bonding to build up substrate units composed of one substrate or several substrates combined together to form a modulein particular chips; motors and enginesother than for land vehicles; machine couplings and transmission componentsother than for land vehicles; devices in relation to micro-peripheral technologiesmachines for manufacture and processing of semi-conductors; apparatuselectrostatic coating machines for applying connecting materials onto substratesby using chemicalelectro-chemical and physical depositiondispenseplacement and mechanical-thermal- and optical transformation for manufacturing microconnectionsin particular for building up substrate units composed of one substrate or several substrates combined together to form a modulein particular chips
Classe 40
Treatment of materials by thermaloptical and mechanical interaction in relation to substrates used in the field of microelectronicsin particular semiconductor substrates and flexible substratesoptical radiationlaser radiation
Classe 42
Industrial analysis of goods or services of others to assure compliance with industry standards and scientific research services; design and development of computer hardware and software; product development in the field of contact pad metallizations for connection technology; development of new technology for others in the field of the manufacture of microconnections; technological consultancyin the technology field of the manufacture of microconnections
Publicações
Histórico de despachos e eventos da marca no USPTO.
31 publicações encontradas
NREP
NEW REPRESENTATIVE AT IB RECEIVED
30/05/2025
NREP
NEW REPRESENTATIVE AT IB RECEIVED
09/10/2021
FINO
FINAL DECISION TRANSACTION PROCESSED BY IB
09/01/2021
FICS
FINAL DISPOSITION NOTICE SENT TO IB
30/10/2020
FIMP
FINAL DISPOSITION PROCESSED
30/10/2020
FICR
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
07/10/2020
R.PR
REGISTERED-PRINCIPAL REGISTER
07/07/2020
NPUB
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
21/04/2020
PUBO
PUBLISHED FOR OPPOSITION
21/04/2020
NONP
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
01/04/2020
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
13/03/2020
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
10/03/2020
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
09/03/2020
ERFR
TEAS REQUEST FOR RECONSIDERATION RECEIVED
09/03/2020
GNFN
NOTIFICATION OF FINAL REFUSAL EMAILED
16/09/2019
GNFR
FINAL REFUSAL E-MAILED
16/09/2019
CNFR
FINAL REFUSAL WRITTEN
16/09/2019
TEME
TEAS/EMAIL CORRESPONDENCE ENTERED
27/08/2019
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
27/08/2019
ALIE
ASSIGNED TO LIE
27/08/2019
TROA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
20/08/2019
RFNT
REFUSAL PROCESSED BY IB
16/03/2019
RFCS
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
23/02/2019
RFRR
REFUSAL PROCESSED BY MPU
23/02/2019
MAFR
APPLICATION FILING RECEIPT MAILED
16/02/2019
RFCR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
15/02/2019
CNRT
NON-FINAL ACTION WRITTEN
14/02/2019
DOCK
ASSIGNED TO EXAMINER
12/02/2019
NWOS
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
12/02/2019
REPR
SN ASSIGNED FOR SECT 66A APPL FROM IB
07/02/2019
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