NA89
NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
25/10/2020
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Dado oficial do USPTO
ELECTROVAC
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Active USPTO registrationTipo: VerbalEscritório: Estados Unidos
Snapshot rápido
ELECTROVAC
ST13
US500000078811143Classe
1, 9, 17
Pedido
78811143
Registro
3839382
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
63
Atualização mais recente
25/10/2020
Tipo de marca
Verbal
Classes Nice
1, 9, 17
Data de depósito
09/02/2006
Data de registro
24/08/2010
Data de expiração
-
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
25/10/2020
Última transação
25/10/2020
Escritório responsável
United States Patent and Trademark Office
Código da situação
800
Cadastro oficial
Principal Register
Fundamento do pedido
Intent to use, Foreign priority
Primeiro uso
30/11/2005
Primeiro uso no comércio
30/11/2005
Código do desenho
4
Tipo de titular
03
Localização do titular
CHUR, CH
Examinador
RADEMACHER, MARK A
Unidade examinadora
M50
Localização atual
GENERIC WEB UPDATE
Titulares e representantes
Titulares
BC-TECH HOLDING AG
Electrovac AG
Representantes
Ursula B. Day LAW FIRM OF URSULA B. DAY
Classificação técnica
Classes Nice
Classe 1Classe 9Classe 17
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 1
PLASTICS ADDITIVESIN PARTICULAR POLYMER BONDED NANOFIBER MASTER BATCHES AND COMPOUNDS FOR REINFORCEMENT IN COMPOSITE MATERIALS FOR MECHANICALELECTRICAL AND THERMAL USE; THERMALLY CONDUCTING ADHESIVES ALSO IN THE FORM OF PASTES; THE FOREGOING ALL FOR USE IN MANUFACTURING IN THE AUTOMOTIVEAEROSPACEMEDICALELECTRONICS INDUSTRYFOR USE IN ENVIRONMENTAL TECHNOLOGY AND FOR USE IN MAJOR APPLIANCES
Classe 9
TEMPERATURE CONTROLLERSTEMPERATURE CONTROLLERS WITH BIMETAL DISKSTEMPERATURE CONTROLLERS WITH EXPANSION RODSTHERMAL CUT-OUTS WITH BIMETAL DISKSTHERMAL CUT-OUTS WITH EXPANSION RODSALL THE FOREGOING FOR USE IN THE ELECTRONICSAUTOMOTIVEAEROSPACE AND SEMICONDUCTOR INDUSTRY; TEMPERATURE SENSORSOXYGEN SENSORSELECTRONIC CONTROL AND EVALUATION UNITS FOR THE OPERATION AND SIGNAL EVALUATION OF OXYGEN SENSORS; OXYGEN MEASUREMENT APPARATUSOXYGEN SENSORS; SENSORS FOR MONITORING LIQUID LEVELTEMPERATURE AND AIR FLOW; THERMAL SWITCHESTEMPERATURE FUSES ALL THE FOREGOING FOR USE IN THE ELECTRONICSAUTOMOTIVEAEROSPACE AND SEMICONDUCTOR INDUSTRY; COMPONENTS IN THE NATURE OF HOUSINGS FORMED OF COMPOSITE MATERIALS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; COMPONENTS FORMED WITH GLASS BUSHINGS IN THE NATURE OF HOUSINGS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; HYBRID HOUSINGSHOUSINGS MADE OF METAL AND CERAMICFOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR HOUSING TRANSISTORSPASSIVE AND ACTIVE ELECTRONIC PARTSOPTO-COUPLERS AND OPTO-ELECTRONIC PACKAGES; HIGH FREQUENCY HOUSINGS FOR OPTO-ELECTRONIC PACKAGESAUTOMOTIVE ELECTRONICS AND ELECTRONIC FREQUENCY CONTROLS; HOUSINGS MADE OF METAL WITH GLASS BUSHINGS IN PARTICULAR FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE WITH COMPUTERSFOR TRANSISTORSSENSORSPASSIVE AND ACTIVE ELECTRONIC PARTS; HOUSINGS MADE OF METAL FOR OPTOELECTRONIC COMPONENTSLCD AND CMOS CHIPSLASERS AND OPTO-COUPLERS; COOLERS WITH LIQUID COOLING AGENT FOR ELECTRONIC AND ELECTRICAL MODULE UNITSELECTRONIC AND ELECTRICAL COMPONENTSELECTRONIC AND ELECTRICAL APPARATUS AND THEIR PARTSIN PARTICULAR MICRO CHANNEL COOLERSHIGH PERFORMANCE COOLERSCOOLERS FOR PC (PERSONAL COMPUTER) HOUSINGS; COOLERS FOR LASER DIODES; CONTROL UNITS FOR CERAMIC SURFACE COOK TOPS FOR COOKING APPLIANCES; TRANSISTOR HEADERSHOUSINGS FOR SEMICONDUCTOR CHIPS INCLUDING CONNECTING LEADSFINS OR BALLS; COVERS FOR ELECTRIC BATTERIES IN PARTICULAR MADE OF STEEL OR SPECIAL STEEL; SENSOR HOUSINGS; IGNITER HEADERSAIRBAG PYROLYTIC CHARGE IGNITER HEADERS ; THERMALLY CONDUCTING INTERFACE MATERIALS IN THE FORM OF THERMOCOUPLES FOR THE THERMAL COUPLING OF ELECTRICAL AND ELECTRONIC COMPONENTS; FIELD EMISSION CATHODESHEAT SINKS AND HEAT STRADDLERSHEAT SINKS FOR USE IN POWER ELECTRONIC MODULESHEAT SINKS FOR USE IN MICROPROCESSORSHEAT SINKS FOR USE IN POWER CHIPS SUCH AS LIGHT EMITTING DIODES OR LASERSALL FOR USE IN THE ELECTRONICS FIELD; CIRCUIT BOARDSIN PARTICULAR CERAMIC CIRCUIT BOARDS; SEMICONDUCTOR CHIP HOUSINGS MADE OF COPPER COATED CERAMICIN PARTICULAR MADE OF COPPER COATED ALUMINUM OXIDE CERAMIC OR ALUMINUM NITRIDE CERAMIC FOR USE IN THE ELECTRONICS FIELD; COPPER COATED ALUMINUM OXIDE SUBSTRATES FOR INTEGRATED CIRCUITS; COPPER COATED ALUMINUM NITRIDE SUBSTRATES FOR INTEGRATED CIRCUITS; THERMALLY CONDUCTING FOILS AND PADS FOR USE AS HEAT SINKS IN ELECTRONIC COMPONENTS IN THE NATURE OF INTEGRATED CIRCUITS
Classe 17
ELECTRICAL INSULATORSGLASS BUSHINGSIN PARTICULAR PRE-STRESSED GLASS BUSHINGS AND TUNED GLASS BUSHINGS FOR USE IN INTEGRATED CIRCUITS : CARBON NANOFIBERS NOT FOR TEXTILE USE; GRAPHITIC NANOFIBERS NOT FOR TEXTILE USE; THERMALLY CONDUCTING ADHESIVE TAPES FOR INDUSTRIAL AND COMMERCIAL USE
Publicações
Histórico de despachos e eventos da marca no USPTO.
63 publicações encontradas
RNL1
REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
25/10/2020
89AG
REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
25/10/2020
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
15/09/2020
E89R
TEAS SECTION 8 & 9 RECEIVED
05/08/2020
REM2
COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
24/08/2019
NA85
NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
26/10/2016
C15A
REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
26/10/2016
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
26/10/2016
E815
TEAS SECTION 8 & 15 RECEIVED
23/08/2016
ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
21/09/2011
R.PR
REGISTERED-PRINCIPAL REGISTER
24/08/2010
SUNA
NOTICE OF ACCEPTANCE OF STATEMENT OF USE MAILED
20/07/2010
REGV
LAW OFFICE REGISTRATION REVIEW COMPLETED
17/07/2010
CNPR
ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
16/07/2010
ACEC
AMENDMENT FROM APPLICANT ENTERED
15/07/2010
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
15/07/2010
ALIE
ASSIGNED TO LIE
14/07/2010
FAXX
FAX RECEIVED
29/06/2010
CNRT
NON-FINAL ACTION MAILED
29/12/2009
CNRT
SU - NON-FINAL ACTION - WRITTEN
29/12/2009
SUPC
STATEMENT OF USE PROCESSING COMPLETE
10/12/2009
AITU
CASE ASSIGNED TO INTENT TO USE PARALEGAL
09/12/2009
IUAF
USE AMENDMENT FILED
10/11/2009
EISU
TEAS STATEMENT OF USE RECEIVED
10/11/2009
EX1G
SOU EXTENSION 1 GRANTED
08/05/2009
EXT1
SOU EXTENSION 1 FILED
08/05/2009
EEXT
SOU TEAS EXTENSION RECEIVED
08/05/2009
NOAM
NOA MAILED - SOU REQUIRED FROM APPLICANT
11/11/2008
PUBO
PUBLISHED FOR OPPOSITION
19/08/2008
NPUB
NOTICE OF PUBLICATION
30/07/2008
PREV
LAW OFFICE PUBLICATION REVIEW COMPLETED
17/07/2008
CNEA
EXAMINERS AMENDMENT MAILED
14/07/2008
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
11/07/2008
XAEC
EXAMINER'S AMENDMENT ENTERED
11/07/2008
CNEA
EXAMINERS AMENDMENT -WRITTEN
11/07/2008
CNRT
NON-FINAL ACTION MAILED
11/06/2008
CNRT
NON-FINAL ACTION WRITTEN
10/06/2008
TCCA
TEAS CHANGE OF CORRESPONDENCE RECEIVED
22/05/2008
ACEC
AMENDMENT FROM APPLICANT ENTERED
21/05/2008
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
21/05/2008
FAXX
FAX RECEIVED
16/05/2008
CNRT
NON-FINAL ACTION MAILED
20/11/2007
CNRT
NON-FINAL ACTION WRITTEN
19/11/2007
CNEA
EXAMINERS AMENDMENT MAILED
15/11/2007
XAEC
EXAMINER'S AMENDMENT ENTERED
14/11/2007
CNEA
EXAMINERS AMENDMENT -WRITTEN
14/11/2007
NAUD
NOTICE OF UNRESPONSIVE AMENDMENT - MAILED
14/11/2007
NAUD
REPORT UNRESPONSIVE AMENDMENT - COMPLETED
13/11/2007
ACEC
AMENDMENT FROM APPLICANT ENTERED
20/10/2007
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
20/10/2007
ALIE
ASSIGNED TO LIE
05/10/2007
FAXX
FAX RECEIVED
04/10/2007
CNRT
NON-FINAL ACTION MAILED
09/05/2007
CNRT
NON-FINAL ACTION WRITTEN
09/05/2007
ACEC
AMENDMENT FROM APPLICANT ENTERED
01/03/2007
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
01/03/2007
ALIE
ASSIGNED TO LIE
01/03/2007
FAXX
FAX RECEIVED
01/02/2007
CNRT
NON-FINAL ACTION MAILED
02/08/2006
CNRT
NON-FINAL ACTION WRITTEN
02/08/2006
DOCK
ASSIGNED TO EXAMINER
31/07/2006
NWAP
NEW APPLICATION ENTERED
15/02/2006
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