NAS8
NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED
14/06/2024
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Dado oficial do USPTO
KS
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Active USPTO registrationTipo: MistaEscritório: US
Snapshot rápido
ST13
US500000076328762Classe
7, 8, 9, 35, 37, 40, 41, 42
Pedido
76328762
Registro
2788019
Diagnóstico de risco e oportunidade
Leitura executiva para decisão de naming, protocolo e monitoramento.
Situação USPTO
Active USPTO registration
Tipo de processo
Pedido e registro
Eventos registrados
41
Atualização mais recente
14/06/2024
Classificação
Registrada
Tipo de marca
Mista
Classes Nice
7, 8, 9, 35, 37, 40, 41, 42
Data de depósito
24/10/2001
Data de registro
02/12/2003
Data de expiração
-
Ação recomendada
Execute uma análise de colidência completa e valide classes antes de qualquer protocolo ou investimento de marca.
Próximo passo
Esses são os detalhes do processo de registro. Mesmo assim, o monitoramento constante é o que garante tranquilidade de que o seu principal ativo continue protegido.
Dados completos do processo
Campos estruturados da autoridade responsável e do histórico oficial.
Data da situação
14/06/2024
Última transação
14/06/2024
Escritório responsável
United States Patent and Trademark Office
Código da situação
800
Cadastro oficial
Principal Register
Primeiro uso
2000-05-00
Primeiro uso no comércio
2000-05-00
Código do desenho
5
Tipo de titular
03
Localização do titular
FORT WASHINGTON, PA, US
Examinador
KAZAZIAN, MICHAEL H
Titulares e representantes
Titulares
KULICKE AND SOFFA INDUSTRIES, INC.
Kulicke & Soffa Investments, Inc.
Representantes
Christopher M. Spletzer, Sr.
Classificação técnica
Classes Nice
Classe 7Classe 8Classe 9Classe 35Classe 37Classe 40Classe 41Classe 42
Códigos Vienna
Sem códigos Vienna disponíveis.
Produtos e serviços
Classe 7
Dicing bladespower-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipmentsemiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; solder ball placement equipmentsemiconductor assembly equipment used to place solder balls onto substrate material; wafer bumping equipmentsemiconductor assembly equipment for bonding stud bumps onto a silicon wafer; and wafer preparation equipmentsemiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame
Classe 8
Hand-operated wire bonding equipmentnamely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductorsnamely die colletscapillaries and wedge bonders
Classe 9
Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materialssubstrates with copper inlaypolymer materialswire encapsulants applied over wire bonds to lock individual wires in place prior to moldingbonding wires; bonder softwaresoftware used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; dicing equipmentelectrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; factory automation softwaresoftware designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; wafer test productssemiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test productselectrical sockets and contactors for testing the electrical functionality of a completed integrated circuit package; and electrical circuit substrates
Classe 35
Providing on-line electronic commerce serviceson-line catalog for selectionordering and payment of products and servicesautomatic wire bonding equipmenttools and materialsbonder softwaredie attachment equipmentdicing equipment and bladesfactory automation products and serviceselectrical circuit substratesmanual wire bonding equipmentsolder ball placement equipmentwafer bumping equipmentwafer bumping serviceswafer preparation equipmentwafer test products and package test productson-line customer support services relating theretoon-line supplyon-line logistics and supporton-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times
Classe 37
Maintenance and refurbishment of equipment used in back-end assembly of semiconductorsintegrated circuit ball bonderswedge bondersmanual wire bondersautomated dicing equipmentribbon bondersstud bumperswafer preparation equipmenttesting equipment and ball attachment equipment; on-line consulting and advisory services for said equipment maintenance and refurbishment
Classe 40
Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors; assembly services for othersprototype building of mechanical components and printed circuit boards; and wafer bumping services for otherssemiconductor assembly services for placement of solder balls onto individual integrated electrical circuits
Classe 41
Customer training in the use of equipment for back-end assembly of semiconductors; on-line consulting and advisory services for said training
Classe 42
Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application supportdesign of new bonding capillaries based on customer-specific capillary configurations; on-line design for others in the field of semiconductor packaging assemblysemiconductor packaging product design application support for the developmenttesting and assembly of new electrical circuitsall in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined informationwhich includes search engines and on-line web links to other web sites; design and fabrication services for othersdesign and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digitalanalog and mix signal circuit boards; technical support services rendered in personvia telephone and via global computer network relating to the use of equipment used for the back-end assembly of semiconductors and installation of spare parts therefor
Publicações
Histórico de despachos e eventos da marca no USPTO.
41 publicações encontradas
RNL2
REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS)
14/06/2024
9G8P
REGISTERED - SEC. 9 GRANTED/CHECK RECORD FOR SEC. 8
14/06/2024
8PRT
REGISTERED - PARTIAL SEC. 8 (10-YR) ACCEPTED
14/06/2024
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
14/06/2024
E89R
TEAS SECTION 8 & 9 RECEIVED
13/03/2024
REM2
COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
02/12/2022
ARAA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
29/01/2018
REAP
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
29/01/2018
NA89
NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
17/06/2014
RNL1
REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
17/06/2014
89AG
REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
17/06/2014
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
17/06/2014
E89R
TEAS SECTION 8 & 9 RECEIVED
30/05/2014
C15A
REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
04/01/2010
ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
16/12/2009
APRE
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
11/12/2009
ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
09/12/2009
E815
TEAS SECTION 8 & 15 RECEIVED
02/12/2009
FAXX
FAX RECEIVED
02/12/2009
EXPT
EXPARTE APPEAL TERMINATED
03/12/2003
R.PR
REGISTERED-PRINCIPAL REGISTER
02/12/2003
PUBO
PUBLISHED FOR OPPOSITION
09/09/2003
NPUB
NOTICE OF PUBLICATION
20/08/2003
CNSA
APPROVED FOR PUB - PRINCIPAL REGISTER
30/06/2003
CFIT
CASE FILE IN TICRS
21/05/2003
CFIT
CASE FILE IN TICRS
20/05/2003
JURT
JURISDICTION RESTORED TO EXAMINING ATTORNEY
13/05/2003
EXPI
EX PARTE APPEAL-INSTITUTED
29/04/2003
EXAF
EXPARTE APPEAL RECEIVED AT TTAB
25/04/2003
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
11/04/2003
PAPER RECEIVED
11/04/2003
CNFR
FINAL REFUSAL MAILED
10/10/2002
DOCK
ASSIGNED TO EXAMINER
09/10/2002
DOCK
ASSIGNED TO EXAMINER
27/09/2002
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
26/08/2002
PAPER RECEIVED
26/08/2002
CNRT
NON-FINAL ACTION MAILED
25/02/2002
DOCK
ASSIGNED TO EXAMINER
22/02/2002
AMPX
PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED
14/12/2001
CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
14/12/2001
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