Classe 1
Hydraulic fluidspressure compensating fluidsmotion compensating fluidshydraulic fluids for subsea production control systemswell control fluidssubsea blowout preventer control fluidssurface blowout preventer control fluidschemicals used in the oil and gas, exploration and production industryindustrial chemicals for use in plating, cleaning and etching metal and plastic surfaceschemicals for use in the manufacture of commercial and industrial printing plates, namely, polymer compositionschemicals for use in electroless plating and electroplating processeschemical compositions for metal platingpre-treatment preparations for platingtrivalent chromate finishing and coating preparations for platingmetal chlorideschemicals for use in semiconductor manufacture, semiconductor device fabrication and semiconductor packagingelectroplating chemicalschemicals for wafer level semiconductor packaging processeschemicals for panel level semiconductor packaging processeschemicals for fan out wafer level semiconductor packaging processeschemicals for fan out panel level semiconductor packaging processeschemicals for use in the circuit board industry, namely, peroxide and sulfuric acid based etchants and oxidants for roughening or etching copper surfaces prior to multilayer lamination of printed wiring boardschemicals used in industryadhesives for use in electronics industrynon-conductive adhesives for use in electronics industryunprocessed epoxy resins for use in electronics industryindustrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industryfillers for use with electronic components, namely, unprocessed epoxy resins for use as underfillunprocessed epoxy resinschemicals, namely, soldering fluxindustrial chemicals used for cleaning circuit boards and surface mount devicesindustrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industrychemicals used in the cleaning, etching and plating of metals and non-metal substrateschemicals used in the production of printed circuit boards and semiconductor materialsindustrial chemicalschemical preparations for scientific use (other than for medical or veterinary use)chemicals for laboratory analyses (other than for medical or veterinary use)chemical reagents (other than for medical or veterinary use)compositions for chemically modifying metal and nonmetal productschemical used in activating, acidification, coating, drying, retouching and altering metal and nonmetal productschemicals used for separating chromium compounds from aqueous solutions
Classe 7
Machine for use in fabricating printing photopolymer plates, namely for ultraviolet exposure and imaging equipment, infrared imaging equipment, solvent and thermal developing equipment, detackification equipment, and post exposure processing equipment